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Scientech — Investor Presentation 2021
Sep 1, 2021
52347_rns_2021-09-01_70720f6e-0172-41a0-b422-5f6ac28102a0.pdf
Investor Presentation
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(3583)
2021/9/2
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Safe Harbor Statement
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This Presentation contains certain forward-looking statements that are based on current expectations and are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements.
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Except as required by law, we undertake no obligation to update any forward –looking statements, whether as a result of new information, future events or otherwise.
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Scientech Corp (3583: TT)
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Company 1979/10/17 Establishment IPO 2013/3/12 Capital NT$ 811 Million Chairman H.L. Hsieh CEO M.T. Hus 、 、 Equipment Manufacturing Wafer Reclaim Products Trading(Agent/Distributor)
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Organization
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Scientech
Equipment M’fg
General Admin.
Wafer Reclaim
New Projects
Semi / Opto / Biotech
Taiwan Offices China Offices USA Office Europe Office
Japan Agent Korea Agent S’pore Agent
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CONFIDENTIAL
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Business Overview
Products
Future Prospect
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Business Overview
Income Statement
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Units:NT $ M |
2016 | 2017 | 2018 | 2019 | 2020 | 2021/H1 |
|---|---|---|---|---|---|---|
| Revenues | 3,495 | 3,539 | 3,988 | 3,949 | 3,580 | 1,958 |
| Gross Profit | 1,178 | 1,251 | 1,448 | 1,384 | 1,456 | 663 |
| Operating Expenses | 835 | 829 | 935 | 997 | 991 | 472 |
| Operating Income | 343 | 423 | 514 | 387 | 465 | 191 |
| Other Income and Expenses | 21 | (8) | 26 | 16 | (76) | 16 |
| Income Before Tax | 363 | 415 | 540 | 403 | 389 | 207 |
| Net Income | 292 | 328 | 418 | 323 | 305 | 167 |
| EPS | 3.60 | 4.05 | 5.16 | 4.02 | 3.80 | 2.08 |
| Gross Margin | 34% | 35% | 36% | 35% | 41% | 34% |
| Operating Margin | 10% | 12% | 13% | 10% | 13% | 10% |
| Income Before Tax margin | 10% | 12% | 14% | 10% | 11% | 6 11% |
Business Overview
Products Mix
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Units:% |
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | Gross Margin |
|---|---|---|---|---|---|---|---|
| Trading | 59 | 51 | 54 | 57 | 59 | 58 | Below Average |
| Manufacturing | 41 | 49 | 46 | 43 | 41 | 42 | Above Average |
| 0% 20% 40% 60% 80% 100% 2015 2016 2017 2018 2019 2020 59 51 54 57 59 52 41 49 46 43 41 48 代理 製造 |
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Business Overview
R&D Expenses
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Units:NT $ M |
2016 | 2017 | 2018 | 2019 | 2020 | 2021/H1 |
|---|---|---|---|---|---|---|
| R&D Expenses | 226 | 228 | 246 | 246 | 248 | 126 |
| Expenses as % of Revenue |
6.5% | 6.4% | 6.2% | 6.2% | 6.9% | 6.4% |
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R & D
300 10.0%
250
9.0%
200
8.0%
150
6.9%
6.5% 6.4% 6.4% 7.0%
100 6.2% 6.2%
6.0%
50
0 5.0%
2016 2017 2018 2019 2020 2021/H1
研發費用 研發費用佔營業收入比重
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Products
What We Do
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Industries which we serve:
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Semiconductor (Front-End and Advanced Packaging)
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Compound Semiconductor
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LED / Mini LED / Micro LED
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Flat Panel Display (TFT-LCD, AMOLED, Touch Panel)
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Solar Cell / Battery
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Biotech / Chemistry Analysis / Scientific Instrument,…
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CONFIDENTIAL
Products
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Product and Technology
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•
•
Equipment •
Design
M’fg
Wafer Reclaim
Representative
Service
/ Distributor
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Wet-Process Tools
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Semiconductor
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Wafer Temporary Bonding Debonding System
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Compound SEMI
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LED / Micro LED
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SEMI / Compound / LED
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Flat Panel Display
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Solar Cell / Battery
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Biotech
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Scientific Inst.
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•
12” Si Wafer
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6” SiC Wafer
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CONFIDENTIAL
Products
Wafer Reclaim Service
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Scientech Corp.
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12” Wafer Reclaim
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Capacity: 120K / Month
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Cu and Non-Cu Process
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SiC Post Slicing Process and Reclaim
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Capacity: 3K / Month
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CONFIDENTIAL
Products
Wet Process Equipment
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Scientech Corp.
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Wet-Bench / Single-Wafer Wet Process Equipment
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Applications:
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Advanced Packaging Process
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Semiconductor Front-End Process
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Compound Semiconductor
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Microelectromechanical Systems (MEMS)
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High-End LED Fully-Automatic Advanced Process
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12 CONFIDENTIAL
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Products
Temporary Bonding Debonding System
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Scientech Corp.
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Temporary Bonding Debonding System (TBDB)
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Application: IGBT Power Device, Advanced Packaging for Semiconductor and LED
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Temporary Bonding System
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Temporary Debonding System
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Release Layer Formation System
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Carrier (Glass) Recycling System
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CONFIDENTIAL
Products
Trading (Agent/Distributor)
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Exclusive
Multi
Application Agency
Supply Chain
Partnership
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Future Prospect
The Growing Market
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In the next 10-20 years, the overall semiconductor industry will grow 5%-6% (CAGR) which is over than the global GDP growth rate 2.5%-3%
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The continuous development of 12” semiconductor advanced process
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Front-End : 5nm
、3nm、2nm、1nm、 -
Advanced Packaging : Fan-Out
、CoWoS (2.5D)、SoIC(3D)、etc. -
The continuous expansion of China semiconductor fabs in recent years
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The demand of 8” semiconductor fab is higher than the supplying capacity
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Compound semiconductor :
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The investments of electrical car and 5G are growing tremendously
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The third generation of semiconductor arises. The demand of high power and high frequency semiconductor are growing rapidly.
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The new application of Mini LED & Micro LED starts and it will lead the LED industry .
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grows again
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Q & A
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!
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