Scientech — Investor Presentation 2019

Jun 11, 2019

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(3583)

2019/6/13

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Safe Harbor Statement

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• This Presentation contains certain forward-looking statements that are based on current expectations and are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements.

• Except as required by law, we undertake no obligation to update any forward –looking statements, whether as a result of new information, future events or otherwise.

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Scientech Corp (3583: TT)

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|||
|---|---|
|Company|
|Establishment|1979/10/17|
|IPO|2013/3/12|
|Capital|NT$ 811 Million|
|Chairman|H.L. Hsieh|
|President|M.T. Hus|
|、|、|
|Equipment Manufacturing|Wafer Reclaim|
|Products|
|Trading(Agent/Distributor)|

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Business Overvies Products

Future Prospect

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Business Overview

Income Statement

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Units：NT $ M	2014	2015	2016	2017	2018	1Q19
Revenues	2,717	2,942	3,495	3,539	3,988	1,048
Gross Profit	970	903	1,178	1,251	1,448	353
Operating Expenses	673	779	835	829	935	227
Operating Income	297	124	343	423	514	126
Other Income and Expenses	20	(6)	21	(8)	26	3
Income Before Tax	317	119	363	415	540	129
Net Income	246	86	292	328	418	95
EPS	3.04	1.06	3.60	4.05	5.16	1.18
Gross Margin	35.71%	30.69%	33.71%	35.36%	36.32%	33.63%
Operating Margin	10.93%	4.23%	9.80%	11.95%	12.89%	11.98%
Income Before Tax margin	11.68%	4.03%	10.40%	11.72%	13.54%	12.32%

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Business Overview

Products Mix

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Units：%	2014	2015	2016	2017	2018	Gross Margin
Trading	50	59	51	54	57	Below Average
Manufacturing	50	41	49	46	43	Above Average

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Business Overview

R&D Expenses

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Units：NT $ M	2014	2015	2016	2017	2018
R&D Expenses	160	196	226	228	246
Expenses as % of Revenue	5.89%	6.66%	6.48%	6.44%	6.18%

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Products

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Wet Process
Equipment
Equipment
Manufacturing
Trading
Wafer
(Agent/Distr
Reclaim
ibutor)
Semiconductor and 12” Wafer
Optoelectronics
Reclaim
Process Equipment
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Products

Equipment Manufacturing

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Wet process equipment  Single wafer/ Batch type

• 8”/12’ Advanced packaging

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、
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、 、 (Fan-out Solder Bump 、 、 Copper Pillow Bumping 、 、 Gold Bump RDL TSV …ect)

• 6”/ 8”/12” Front-end special 、 、

• process (IoT Sensor Power IC 、 、 、

• FP sensor RF CMOS Touch 、

• Controller MEMS)

• HB LED fully-automatic process

• MEMS

• III-V

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Products Si Wafer Reclaim

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Advanced clean technology
Complete particle inspection
20nm/ 16nm Particle
• (SP1-DLS & SP2)
Low trace metal (<5E9)
•
 12” Wafer Reclaim
Cleaning Etching

Capacity: 120K / month

Separated Cu & Non Cu
Line
Full Process
Optimization
Polishing Grinding
Complete polishing process Super flatness
Single side polish • (GBIR<0.5 m m)
Double side polish
•
Final Haze polish 10
•
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Products

Trading (Agent/Distributor)

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Multi
Exclusive
applicati
Agency
on
Supply Chain
Partnership
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Future Product-based Extension Prospect

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Wet Process Equipment ------------------- Front-end Wet Process Equipment Wafer Support System Mass Spectrometer

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Equipment
Manufacturing
Trading
Wafer
(Agent/Distr
Reclaim
ibutor)
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Semiconductor and Optoelectronics Process Equipment

12” Wafer Reclaim ------------------- SiC Wafer Reclaim

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AMOLED Advanced Process Miniaturization

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Q & A

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Thank You!

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