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OSE — Interim / Quarterly Report 2021
Dec 8, 2021
52010_rns_2021-12-08_3ac62e7b-f3dd-44a0-94b7-5163ff6b6b4c.pdf
Interim / Quarterly Report
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華泰電子股份有限公司 Orient Semiconductor Electronics ,Ltd.
(股票代號:2329)
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簡報大綱
Part1 公司簡介 Part2 營運成果 Part3 Q&A
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公司簡介
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公司基本資料
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創立時間:1971年6月
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資本額:新台幣82.57億 (普通股55.54億/乙種特別股
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9.01億(負債類)/丙種特別股18.02億(權益類))
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董事長兼任執行長:董悅明
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總經理:涂家榮
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產品服務項目:
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積體電路(IC)封裝測試服務
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電子製造服務(EMS/CEM)
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營運成果
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合併綜合損益表 ( 與上一季比較 )
| (單位:新台幣仟元) 營業收入淨額 營業毛利 營業淨利(淨損) 稅前淨利(淨損) 所得稅利益(費用) 非控制權益 歸屬於本公司業主之淨利 基本每股盈餘(新台幣元) EBITDA |
Q3/2021 % 3,949,810 100.00% 687,425 17.40% 409,168 10.36% 455,092 11.52% (99,005) (2.51%) - - 356,087 9.02% 0.64 - 790,220 20.01% |
Q2/2021 % 4,148,371 100.00% 828,234 19.97% 546,234 13.17% 532,745 12.84% (108,747) (2.62%) - - 423,998 10.22% 0.77 - 872,005 21.02% |
季變化 (4.79%) (17.00%) (25.09%) (14.58%) (8.96%) (16.02%) - (9.38%) |
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合併綜合損益表(與去年同期比較)
| (單位:新台幣仟元) 營業收入淨額 營業毛利 營業淨利(淨損) 稅前淨利(淨損) 所得稅利益(費用) 非控制權益 歸屬於本公司業主之淨利 基本每股盈餘(新台幣元) EBITDA |
Q3/2021 % 3,949,810 100.00% 687,425 17.40% 409,168 10.36% 455,092 11.52% (99,005) (2.51%) - - 356,087 9.02% 0.64 - 790,220 20.01% |
Q3/2020 % 3,264,023 100.00% 253,881 7.78% 54,363 1.67% 16,838 0.52% (5,384) (0.16%) - - 11,454 0.35% 0.02 - 413,433 12.67% |
年變化 21.01% 170.77% 652.66% 2,602.77% 1,738.87% - 3,008.84% 3,100.00% 91.14% |
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合併綜合損益表(累計至Q3與去年比較)
| (單位:新台幣仟元) 營業收入淨額 營業毛利 營業淨利(淨損) 稅前淨利(淨損) 所得稅利益(費用) 非控制權益 歸屬於本公司業主之淨利 基本每股盈餘(新台幣元) EBITDA |
Q1~Q3/2021 % 11,887,077 100.00% 2,033,566 17.11% 1,228,897 10.34% 1,269,262 10.68% (268,823) (2.26%) - - 1,000,439 8.42% 1.81 - 2,311,330 19.44% |
Q1~Q3/2020 % 10,406,485 100.00% 401,586 3.86% (265,373) (2.55%) (295,506) (2.84%) 40,931 0.39% - - (254,575) (2.45%) (0.46) - 915,363 8.80% |
年變化 14.23% 406.38% 563.08% 529.52% 756.77% - 492.98% 493.48% 152.50% |
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IC封測業務
| 3,058,491 2,818,969 | 3,058,491 2,818,969 | 3,058,491 2,818,969 | 3,058,491 2,818,969 | 3,058,491 2,818,969 | 3,058,491 2,818,969 | 3,058,491 2,818,969 | |
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| 2,386,9692,655,453 |
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| 2,127,892 2,084,640 69% 70% 74% % |
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| 1,567,658 58% 64% 71 |
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| 45% | |||||||
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EMS業務
| 仟元) | 仟元) | 仟元) | 仟元) | 仟元) | 仟元) | 仟元) | |
|---|---|---|---|---|---|---|---|
| 1,932,271 | |||||||
| 1,514,641 | |||||||
| 1,179,383 1,058,4551,133,443 1,089,880 1,130,841 55% |
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| 42% 36% 31% 30% |
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26% 29% |
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半導體封測營收-產品應用別佔比
| 0% 20% 40% 60% 80% 100% |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 6% | 7% | 6% | 5% | 4% | 6% | 8% | |||||||||||||||
| 17% | 21% | 17% | 21% | 24% | 25% | ||||||||||||||||
| 30% | |||||||||||||||||||||
| 77% | 72% | 78% | 74% | 71% | 70% | 62% | |||||||||||||||
| Q1/2020 Q2/2020 Q3/2020 Q4/2020 Q1/2021 Q2/2021 Q3/2021 記憶體相關產品 邏輯IC 測試 |
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重要資產負債表項目及財務指標 ( 與上一季比較 )
| (單位:新台幣仟元) 現金及約當現金 按攤銷後成本衡量之金融資產 金融資產-非流動及採用權益法之投資 不動產、廠房及設備 資產總計 短期借款及應付短期票券 一年或一營業週期內到期之長期負債 長期借款 負債總計 權益總計 當季EBITDA 重要財務指標 負債比率 應收帳款週轉天數(Q3) 存貨週轉天數(Q3) |
Q3/2021 2,354,877 38,675 724,604 5,009,970 15,804,544 359,004 29,344 406,356 7,220,140 8,584,404 790,220 45.68% 74天 46天 |
Q2/2021 1,807,469 110,164 708,177 5,114,192 15,315,779 757,974 - 300,00 7,078,876 8,236,903 872,005 46.22% 67天 39天 |
季變化 30.29% (64.89%) 2.32% (2.04%) 3.19% (52.64%) - 35.45% 2.00% 4.22% (9.38%) |
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重要資產負債表項目及財務指標(與去年同期比較)
| (單位:新台幣仟元) 現金及約當現金 按攤銷後成本衡量之金融資產 金融資產-非流動及採用權益法之投資 不動產、廠房及設備 資產總計 短期借款及應付短期票券 一年或一營業週期內到期之長期負債 長期借款 負債總計 權益總計 當季EBITDA 重要財務指標 負債比率 應收帳款週轉天數(Q1~Q3) 存貨週轉天數(Q1~Q3) |
Q3/2021 2,354,877 38,675 724,604 5,009,970 15,804,544 359,004 29,344 406,356 7,220,140 8,584,404 790,220 45.68% 64天 40天 |
Q3/2020 1,024,525 207,369 676,886 5,591,222 14,048,968 2,539,490 844,176 1,184,527 8,301,969 5,746,999 413,433 59.09% 65天 34天 |
年變化 129.85% (81.35%) 7.05% (10.40%) 12.50% (85.86%) (96.52%) (65.69%) (13.03%) 49.37% 91.14% |
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Q&A
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Micro SD Process Flow
SMT
Wafer Grinding Wafer Saw Die Attach 1
Epoxy Curing 1
Die Attach 2
Epoxy Curing 2 Plasma Clean Wire Bonding
Back Side
Plasma Clean Molding Post Mold Curing
Marking
Top Side
Marking Laser Cutting V Saw Singulation
Memory Test Ship out
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免責聲明
本簡報及同時發布之相關內容來自可取得之內外部資訊 ,若因後列各項因素而改變或調整,如市場需求、價格 變動、國際經濟情勢、供應鏈議題、國際匯率波動及其 他本公司不能掌控因素等,本公司不負責隨時提醒或更 新,請以台灣證券交易所公開資訊觀測站公告資訊為主 要依據。
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