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OSE Interim / Quarterly Report 2021

Dec 8, 2021

52010_rns_2021-12-08_3ac62e7b-f3dd-44a0-94b7-5163ff6b6b4c.pdf

Interim / Quarterly Report

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華泰電子股份有限公司 Orient Semiconductor Electronics ,Ltd.

(股票代號:2329)

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簡報大綱

Part1 公司簡介 Part2 營運成果 Part3 Q&A

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公司簡介

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公司基本資料

  • 創立時間:1971年6月

  • 資本額:新台幣82.57億 (普通股55.54億/乙種特別股

  • 9.01億(負債類)/丙種特別股18.02億(權益類))

  • 董事長兼任執行長:董悅明

  • 總經理:涂家榮

  • 產品服務項目:

  • 積體電路(IC)封裝測試服務

  • 電子製造服務(EMS/CEM)

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營運成果

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合併綜合損益表 ( 與上一季比較 )

(單位:新台幣仟元)
營業收入淨額
營業毛利
營業淨利(淨損)
稅前淨利(淨損)
所得稅利益(費用)
非控制權益
歸屬於本公司業主之淨利
基本每股盈餘(新台幣元)
EBITDA
Q3/2021
%
3,949,810
100.00%
687,425
17.40%
409,168
10.36%
455,092
11.52%
(99,005)
(2.51%)
-
-
356,087
9.02%
0.64
-
790,220
20.01%
Q2/2021
%
4,148,371
100.00%
828,234
19.97%
546,234
13.17%
532,745
12.84%
(108,747)
(2.62%)
-
-
423,998
10.22%
0.77
-
872,005
21.02%
季變化
(4.79%)
(17.00%)
(25.09%)
(14.58%)
(8.96%)
(16.02%)
-
(9.38%)

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合併綜合損益表(與去年同期比較)

(單位:新台幣仟元)
營業收入淨額
營業毛利
營業淨利(淨損)
稅前淨利(淨損)
所得稅利益(費用)
非控制權益
歸屬於本公司業主之淨利
基本每股盈餘(新台幣元)
EBITDA
Q3/2021
%
3,949,810
100.00%
687,425
17.40%
409,168
10.36%
455,092
11.52%
(99,005)
(2.51%)
-
-
356,087
9.02%

0.64
-
790,220
20.01%
Q3/2020
%
3,264,023
100.00%
253,881
7.78%
54,363
1.67%
16,838
0.52%
(5,384)
(0.16%)
-
-
11,454
0.35%
0.02
-
413,433
12.67%
年變化
21.01%
170.77%
652.66%
2,602.77%
1,738.87%
-
3,008.84%
3,100.00%
91.14%

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合併綜合損益表(累計至Q3與去年比較)

(單位:新台幣仟元)
營業收入淨額
營業毛利
營業淨利(淨損)
稅前淨利(淨損)
所得稅利益(費用)
非控制權益
歸屬於本公司業主之淨利
基本每股盈餘(新台幣元)
EBITDA
Q1~Q3/2021
%
11,887,077
100.00%
2,033,566
17.11%
1,228,897
10.34%
1,269,262
10.68%
(268,823)
(2.26%)
-
-
1,000,439
8.42%

1.81
-
2,311,330
19.44%
Q1~Q3/2020
%
10,406,485
100.00%
401,586
3.86%
(265,373)
(2.55%)
(295,506)
(2.84%)
40,931
0.39%
-
-
(254,575)
(2.45%)
(0.46)
-
915,363
8.80%
年變化
14.23%
406.38%
563.08%
529.52%
756.77%
-
492.98%
493.48%
152.50%

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IC封測業務

3,058,491 2,818,969 3,058,491 2,818,969 3,058,491 2,818,969 3,058,491 2,818,969 3,058,491 2,818,969 3,058,491 2,818,969 3,058,491 2,818,969
2,386,9692,655,453
2,127,892
2,084,640
69%
70%
74%
%
1,567,658
58%
64%
71
45%

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EMS業務

仟元) 仟元) 仟元) 仟元) 仟元) 仟元) 仟元)
1,932,271
1,514,641
1,179,383
1,058,4551,133,443 1,089,880 1,130,841
55%
42%
36%
31%
30%


26%
29%

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半導體封測營收-產品應用別佔比

0%
20%
40%
60%
80%
100%
6% 7% 6% 5% 4% 6% 8%
17% 21% 17% 21% 24% 25%
30%
77% 72% 78% 74% 71% 70% 62%
Q1/2020
Q2/2020
Q3/2020
Q4/2020
Q1/2021
Q2/2021
Q3/2021
記憶體相關產品
邏輯IC
測試

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重要資產負債表項目及財務指標 ( 與上一季比較 )

(單位:新台幣仟元)
現金及約當現金
按攤銷後成本衡量之金融資產
金融資產-非流動及採用權益法之投資
不動產、廠房及設備
資產總計
短期借款及應付短期票券
一年或一營業週期內到期之長期負債
長期借款
負債總計
權益總計
當季EBITDA
重要財務指標
負債比率
應收帳款週轉天數(Q3)
存貨週轉天數(Q3)
Q3/2021
2,354,877
38,675
724,604
5,009,970
15,804,544
359,004
29,344
406,356
7,220,140
8,584,404
790,220
45.68%
74天
46天
Q2/2021
1,807,469
110,164
708,177
5,114,192
15,315,779
757,974
-
300,00
7,078,876
8,236,903
872,005
46.22%
67天
39天
季變化
30.29%
(64.89%)
2.32%
(2.04%)
3.19%
(52.64%)
-
35.45%
2.00%
4.22%
(9.38%)

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重要資產負債表項目及財務指標(與去年同期比較)

(單位:新台幣仟元)
現金及約當現金
按攤銷後成本衡量之金融資產
金融資產-非流動及採用權益法之投資
不動產、廠房及設備
資產總計
短期借款及應付短期票券
一年或一營業週期內到期之長期負債
長期借款
負債總計
權益總計
當季EBITDA
重要財務指標
負債比率
應收帳款週轉天數(Q1~Q3)
存貨週轉天數(Q1~Q3)
Q3/2021
2,354,877
38,675
724,604
5,009,970
15,804,544
359,004
29,344
406,356
7,220,140
8,584,404
790,220
45.68%
64天
40天
Q3/2020
1,024,525
207,369
676,886
5,591,222
14,048,968
2,539,490
844,176
1,184,527
8,301,969
5,746,999
413,433
59.09%
65天
34天
年變化
129.85%
(81.35%)
7.05%
(10.40%)
12.50%
(85.86%)
(96.52%)
(65.69%)
(13.03%)
49.37%
91.14%

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Q&A

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----- Start of picture text -----

Micro SD Process Flow
SMT
Wafer Grinding Wafer Saw Die Attach 1
Epoxy Curing 1
Die Attach 2
Epoxy Curing 2 Plasma Clean Wire Bonding
Back Side
Plasma Clean Molding Post Mold Curing
Marking
Top Side
Marking Laser Cutting V Saw Singulation
Memory Test Ship out
----- End of picture text -----

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免責聲明

本簡報及同時發布之相關內容來自可取得之內外部資訊 ,若因後列各項因素而改變或調整,如市場需求、價格 變動、國際經濟情勢、供應鏈議題、國際匯率波動及其 他本公司不能掌控因素等,本公司不負責隨時提醒或更 新,請以台灣證券交易所公開資訊觀測站公告資訊為主 要依據。

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