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OSE Interim / Quarterly Report 2019

Dec 5, 2019

52010_rns_2019-12-05_c245987e-4bb6-4773-a41c-863462a6db66.pdf

Interim / Quarterly Report

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華泰電子股份有限公司 Orient Semiconductor Electronics ,Ltd.

(股票代號:2329)

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簡報大綱

Part1 公司簡介 Part2 營運成果 Part3 Q&A

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公司簡介

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公司基本資料

  • 創立時間:1971年6月

  • 資本額:新台幣55.23億

  • 董事長:杜紹堯

  • 總經理:董悅明

  • 產品服務項目:

  • 積體電路(IC)封裝測試服務

  • 電子製造服務(EMS/CEM)

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營運成果

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合併綜合損益表 ( 與上一季比較 , 累計至 Q3)

(單位:新台幣仟元)
Q3/2019
%
營業收入淨額
4,971,024 100.00%
營業毛利
575,422
11.58%
營業淨利(淨損)
313,533
6.31%
稅前淨利(淨損)
313,534
6.31%
所得稅利益(費用)
(63,018)
(1.27%)
非控制權益
-
-
歸屬於本公司業主之淨利
250,516
5.04%
基本每股盈餘(新台幣元)
0.45
-
EBITDA
733,223
14.75%
Q2/2019
%
4,549,560 100.00%
564,876
12.42%
286,198
6.29%
289,073
6.35%
(62,862)
(1.38%)
-
-
226,211
4.97%
0.41
-
650,796
14.30%
季變化
9.26%
1.87%
9.55%
8.46%
0.25%
10.74%
-
12.67%
Q1~Q3/2019
%
13,416,556 100.00%
1,433,832
10.69%
675,522
5.03%
680,787
5.07%
(138,742)
(1.03%)
-
-
542,045
4.04%
0.98
-
1,806,629
13.47%

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合併綜合損益表(與去年同期比較)

(單位:新台幣仟元)
營業收入淨額
營業毛利
營業淨利(淨損)
稅前淨利(淨損)
所得稅利益(費用)
非控制權益
歸屬於本公司業主之淨利
基本每股盈餘(新台幣元)
EBITDA
Q3/2019
%
4,971,024
100.00%
575,422
11.58%
313,533
6.31%
313,534
6.31%
(63,018)
(1.27%)
-
-
250,516
5.04%

0.45
-
733,223
14.75%
Q3/2018
%
4,112,318
100.00%
173,201
4.21%
(48,976)
(1.19%)
(41,837)
(1.02%)
10,465
0.25%
-
-
(31,372)
(0.76%)
(0.06)
-
357,532
8.69%
年變化
20.88%
232.23%
740.18%
849.42%
(702.18%)
-
898.53%
64.71%
105.08%

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合併綜合損益表(累計至Q3與去年比較)

(單位:新台幣仟元)
營業收入淨額
營業毛利
營業淨利(淨損)
稅前淨利(淨損)
所得稅利益(費用)
非控制權益
歸屬於本公司業主之淨利
基本每股盈餘(新台幣元)
EBITDA
Q1~Q3/2019
%
13,416,556
100.00%
1,433,832
10.69%
675,522
5.03%
680,787
5.07%
(138,742)
(1.03%)
-
-
542,045
4.04%

0.98 -
1,806,629
13.47%
Q1~Q3/2018
%
10,981,666
100.00%
168,283
1.53%
(481,056)
(4.38%)
(451,691)
(4.11%)
279,158
2.54%
-
-
(172,533)
(1.57%)
(0.31) -
743,049
6.77%
年變化
22.17%
752.04%
240.42%
250.72%
(149.70%)
-
(414.17%)
(416.13%)
143.14%

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IC封測業務

元) 元) 元) 元) 元) 元) 元)
2,868,633 2,920,965
2,415,1452,637,563
2,383,583
1,788,8412,174,224

58%
59%
63%
61%
63%
59%
57%

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EMS業務

) ) ) ) ) ) )
2,050,059
1,349,8491,556,434
1,697,173
1,568,963 1,512,389
1,680,927
43%
42%
41%
37%
39%
37%
41%

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半導體封測營收-產品應用別佔比

0%
20%
40%
60%
80%
100%
6% 6% 5% 5% 5% 4% 4%
25% 25% 26%
19% 20%
17% 18%
69% 69% 69% 76% 75% 79% 78%
Q1/2018
Q2/2018
Q3/2018
Q4/2018
Q1/2019
Q2/2019
Q3/2019
記憶體相關產品
邏輯IC
測試

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重要資產負債表項目及財務指標 ( 與上一季比較 )

(單位:新台幣仟元)
現金及約當現金
金融資產-流動
金融資產-非流動及採用權益法之投資
不動產、廠房及設備
資產總計
短期借款及應付短期票券
一年內到期之長期借款
長期借款
負債總計
權益總計
當季EBITDA
重要財務指標
負債比率
應收帳款週轉天數(Q3)
存貨週轉天數(Q3)
Q3/2019
1,192,186
146,772
683,598
6,469,990
16,481,453
2,306,724
1,325,069
1,266,110
10,434,467
6,046,986
733,223
63.31%
63天
30天
Q2/2019
980,380
394,454
667,938
7,303,202
16,673,869
3,108,250
1,462,964
1,494,267
11,150,158
5,523,711
650,796
64.90%
63天
35天
季變化
21.60%
(62.79%)
2.34%
(11.41%)
(1.15%)
(25.79%)
(9.43%)
(15.27%)
(6.42%)
9.47%
12.67%

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重要資產負債表項目及財務指標(與去年同期比較)

(單位:新台幣仟元)
現金及約當現金
金融資產-流動
金融資產-非流動及採用權益法之投資
不動產、廠房及設備
資產總計
短期借款及應付短期票券
一年內到期之長期借款
長期借款
負債總計
權益總計
當季EBITDA
重要財務指標
負債比率
應收帳款週轉天數(Q1~Q3)
存貨週轉天數(Q1~Q3)
Q3/2019
1,192,186
146,772
683,598
6,469,990
16,481,453
2,306,724
1,325,069
1,266,110
10,434,467
6,046,986
733,223
63.31%
67天
36天
Q3/2018
929,802
362,557
430,479
7,157,658
16,935,212
3,104,857
1,359,617
1,608,761
11,446,487
5,488,725
357,532
67.66%
69天
40天
年變化
28.22%
(59.52%)
58.80%
(9.61%)
(2.68%)
(25.71%)
(2.54%)
(21.30%)
(8.84%)
10.17%
105.08%

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Q&A

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----- Start of picture text -----

Micro SD Process Flow
SMT
Wafer Grinding Wafer Saw Die Attach 1
Epoxy Curing 1
Die Attach 2
Epoxy Curing 2 Plasma Clean Wire Bonding
Back Side
Plasma Clean Molding Post Mold Curing
Marking
Top Side
Marking Laser Cutting V Saw Singulation
Memory Test Ship out
----- End of picture text -----

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免責聲明

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