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OSE — Interim / Quarterly Report 2019
Dec 5, 2019
52010_rns_2019-12-05_c245987e-4bb6-4773-a41c-863462a6db66.pdf
Interim / Quarterly Report
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華泰電子股份有限公司 Orient Semiconductor Electronics ,Ltd.
(股票代號:2329)
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簡報大綱
Part1 公司簡介 Part2 營運成果 Part3 Q&A
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公司簡介
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公司基本資料
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創立時間:1971年6月
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資本額:新台幣55.23億
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董事長:杜紹堯
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總經理:董悅明
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產品服務項目:
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積體電路(IC)封裝測試服務
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電子製造服務(EMS/CEM)
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營運成果
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合併綜合損益表 ( 與上一季比較 , 累計至 Q3)
| (單位:新台幣仟元) Q3/2019 % 營業收入淨額 4,971,024 100.00% 營業毛利 575,422 11.58% 營業淨利(淨損) 313,533 6.31% 稅前淨利(淨損) 313,534 6.31% 所得稅利益(費用) (63,018) (1.27%) 非控制權益 - - 歸屬於本公司業主之淨利 250,516 5.04% 基本每股盈餘(新台幣元) 0.45 - EBITDA 733,223 14.75% |
Q2/2019 % 4,549,560 100.00% 564,876 12.42% 286,198 6.29% 289,073 6.35% (62,862) (1.38%) - - 226,211 4.97% 0.41 - 650,796 14.30% |
季變化 9.26% 1.87% 9.55% 8.46% 0.25% 10.74% - 12.67% |
Q1~Q3/2019 % 13,416,556 100.00% 1,433,832 10.69% 675,522 5.03% 680,787 5.07% (138,742) (1.03%) - - 542,045 4.04% 0.98 - 1,806,629 13.47% |
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合併綜合損益表(與去年同期比較)
| (單位:新台幣仟元) 營業收入淨額 營業毛利 營業淨利(淨損) 稅前淨利(淨損) 所得稅利益(費用) 非控制權益 歸屬於本公司業主之淨利 基本每股盈餘(新台幣元) EBITDA |
Q3/2019 % 4,971,024 100.00% 575,422 11.58% 313,533 6.31% 313,534 6.31% (63,018) (1.27%) - - 250,516 5.04% 0.45 - 733,223 14.75% |
Q3/2018 % 4,112,318 100.00% 173,201 4.21% (48,976) (1.19%) (41,837) (1.02%) 10,465 0.25% - - (31,372) (0.76%) (0.06) - 357,532 8.69% |
年變化 20.88% 232.23% 740.18% 849.42% (702.18%) - 898.53% 64.71% 105.08% |
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合併綜合損益表(累計至Q3與去年比較)
| (單位:新台幣仟元) 營業收入淨額 營業毛利 營業淨利(淨損) 稅前淨利(淨損) 所得稅利益(費用) 非控制權益 歸屬於本公司業主之淨利 基本每股盈餘(新台幣元) EBITDA |
Q1~Q3/2019 % 13,416,556 100.00% 1,433,832 10.69% 675,522 5.03% 680,787 5.07% (138,742) (1.03%) - - 542,045 4.04% 0.98 - 1,806,629 13.47% |
Q1~Q3/2018 % 10,981,666 100.00% 168,283 1.53% (481,056) (4.38%) (451,691) (4.11%) 279,158 2.54% - - (172,533) (1.57%) (0.31) - 743,049 6.77% |
年變化 22.17% 752.04% 240.42% 250.72% (149.70%) - (414.17%) (416.13%) 143.14% |
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IC封測業務
| 元) | 元) | 元) | 元) | 元) | 元) | 元) | |
|---|---|---|---|---|---|---|---|
| 2,868,633 2,920,965 | |||||||
| 2,415,1452,637,563 2,383,583 |
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| 1,788,8412,174,224 | |||||||
58% 59% 63% 61% 63% 59% |
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| 57% | |||||||
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EMS業務
| ) | ) | ) | ) | ) | ) | ) | |
|---|---|---|---|---|---|---|---|
| 2,050,059 | |||||||
| 1,349,8491,556,434 1,697,173 1,568,963 1,512,389 1,680,927 |
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| 43% 42% 41% 37% 39% 37% 41% |
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半導體封測營收-產品應用別佔比
| 0% 20% 40% 60% 80% 100% |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 6% | 6% | 5% | 5% | 5% | 4% | 4% | |||||||||||||||
| 25% | 25% | 26% |
19% | 20% |
17% | 18% | |||||||||||||||
| 69% | 69% | 69% | 76% | 75% | 79% | 78% | |||||||||||||||
| Q1/2018 Q2/2018 Q3/2018 Q4/2018 Q1/2019 Q2/2019 Q3/2019 記憶體相關產品 邏輯IC 測試 |
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重要資產負債表項目及財務指標 ( 與上一季比較 )
| (單位:新台幣仟元) 現金及約當現金 金融資產-流動 金融資產-非流動及採用權益法之投資 不動產、廠房及設備 資產總計 短期借款及應付短期票券 一年內到期之長期借款 長期借款 負債總計 權益總計 當季EBITDA 重要財務指標 負債比率 應收帳款週轉天數(Q3) 存貨週轉天數(Q3) |
Q3/2019 1,192,186 146,772 683,598 6,469,990 16,481,453 2,306,724 1,325,069 1,266,110 10,434,467 6,046,986 733,223 63.31% 63天 30天 |
Q2/2019 980,380 394,454 667,938 7,303,202 16,673,869 3,108,250 1,462,964 1,494,267 11,150,158 5,523,711 650,796 64.90% 63天 35天 |
季變化 21.60% (62.79%) 2.34% (11.41%) (1.15%) (25.79%) (9.43%) (15.27%) (6.42%) 9.47% 12.67% |
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重要資產負債表項目及財務指標(與去年同期比較)
| (單位:新台幣仟元) 現金及約當現金 金融資產-流動 金融資產-非流動及採用權益法之投資 不動產、廠房及設備 資產總計 短期借款及應付短期票券 一年內到期之長期借款 長期借款 負債總計 權益總計 當季EBITDA 重要財務指標 負債比率 應收帳款週轉天數(Q1~Q3) 存貨週轉天數(Q1~Q3) |
Q3/2019 1,192,186 146,772 683,598 6,469,990 16,481,453 2,306,724 1,325,069 1,266,110 10,434,467 6,046,986 733,223 63.31% 67天 36天 |
Q3/2018 929,802 362,557 430,479 7,157,658 16,935,212 3,104,857 1,359,617 1,608,761 11,446,487 5,488,725 357,532 67.66% 69天 40天 |
年變化 |
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| 28.22% (59.52%) 58.80% (9.61%) (2.68%) (25.71%) (2.54%) (21.30%) (8.84%) 10.17% 105.08% |
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Q&A
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Micro SD Process Flow
SMT
Wafer Grinding Wafer Saw Die Attach 1
Epoxy Curing 1
Die Attach 2
Epoxy Curing 2 Plasma Clean Wire Bonding
Back Side
Plasma Clean Molding Post Mold Curing
Marking
Top Side
Marking Laser Cutting V Saw Singulation
Memory Test Ship out
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