OSE — Call Transcript 2018

Nov 30, 2018

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華泰電子股份有限公司 Orient Semiconductor Electronics ,Ltd.

（股票代號：2329）

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簡報大綱

Part1 公司簡介 Part2 營運成果 Part3 Q&A

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公司簡介

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公司基本資料

• 創立時間：1971年6月

• 資本額：新台幣55.23億

• 董事長：杜紹堯

• 總經理：董悅明

• 產品服務項目：

• 積體電路(IC)封裝測試服務

• 電子製造服務(EMS/CEM)

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營運成果

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合併綜合損益表(與上一季比較,累計至Q3)

(單位：新台幣仟元) Q3/2018 % 營業收入淨額 4,112,318 100.00% 營業毛利 173,201 4.21% 營業淨利(淨損) (48,976) (1.19%) 稅前淨利(淨損) (41,837) (1.02%) 所得稅利益(費用) 10,465 0.25% 非控制權益 - - 歸屬於本公司業主之淨利 (31,372) (0.76%) 基本每股盈餘(新台幣元) (0.06) - EBITDA 357,532 8.69%	Q2/2018 % 3,730,658 100.00% 113,940 3.05% (102,493) (2.75%) (43,730) (1.17%) (823) (0.02%) - - (44,553) (1.19%) (0.06) - 351,862 9.43%	季變化 10.23% 52.01% 52.22% 4.33% 1371.57% - 29.58% 0.00% 1.61%	Q1~Q3/2018 % 10,981,666 100.00% 168,283 1.53% (481,056) (4.38%) (451,691) (4.11%) 279,158 2.54% - - (172,533) (1.57%) (0.31) - 743,049 6.77%

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合併綜合損益表(與去年同期比較)

(單位：新台幣仟元) 營業收入淨額 營業毛利 營業淨利(淨損) 稅前淨利(淨損) 所得稅利益(費用) 非控制權益 歸屬於本公司業主之淨利 基本每股盈餘(新台幣元) EBITDA	Q3/2018 % 4,112,318 100.00% 173,201 4.21% (48,976) (1.19%) (41,837) (1.02%) 10,465 0.25% - - (31,372) (0.76%) (0.06) - 357,532 8.69%	Q3/2017 % 3,549,901 100.00% 93,469 2.63% (114,876) (3.24%) (71,623) (2.02%) (22,218) (0.63%) - - (93,841) (2.64%) (0.17) - 339,024 9.55%	年變化 15.84% 85.30% 57.37% 41.59% 147.10% - 66.57% 64.71% 5.46%

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合併綜合損益表(累計至Q3與去年比較)

Q1~Q3/2018 % 10,981,666 100.00% 168,283 1.53% (481,056) (4.38%) (451,691) (4.11%) 279,158 2.54% - - (172,533) (1.57%) (0.31) - 743,049 6.77%	Q1~Q3/2017 % 10,322,716 100.00% 158,744 1.54% (504,357) (4.89%) (463,956) (4.49%) 50,325 0.49% (1,227) (0.01%) (413,631) (4.00%) (0.75) - 812,444 7.87%	年變化 6.38% 6.01% 4.62% 2.64% 454.71% 100.00% 58.29% 58.67% (8.54%)

(單位：新台幣仟元)

營業收入淨額 營業毛利 營業淨利(淨損) 稅前淨利(淨損) 所得稅利益(費用) 非控制權益 歸屬於本公司業主之淨利 基本每股盈餘(新台幣元) EBITDA

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封測業務

( 單位：新台幣仟元 )

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3,000,000 100%
90%
2,415,145
2,500,000
2,174,224 80%
2,153,983
2,066,419 2,036,917
1,941,149 70%
2,000,000 1,788,841
60%
61%
1,500,000 57% 61% 57% 57% 58% 59% 50%
40%
1,000,000
30%
20%
500,000
10%
0 0%
Q1/2017 Q2/2017 Q3/2017 Q4/2017 Q1/2018 Q2/2018 Q3/2018
營業收入淨額 佔全公司營收比重
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EMS業務

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( 單位：新台幣仟元 )
2,500,000 100%
90%
2,000,000 80%
1,697,173
70%
1,556,434
1,526,680
1,500,000 1,455,791 1,395,918 1,349,849 60%
1,309,456
50%
1,000,000 40%
43% 43% 43% 42% 41%
39% 39% 30%
500,000 20%
10%
0 0%
Q1/2017 Q2/2017 Q3/2017 Q4/2017 Q1/2018 Q2/2018 Q3/2018
營業收入淨額 佔全公司營收比重
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半導體封測營收-產品應用別佔比

0% 20% 40% 60% 80% 100%
		5%			4%			4%			6%			6%			6%			6%
		28%			24%			27%			28%			27%			27%			28%
		67%			71%			69%			67%			67%			67%			66%
	Q1/2017 Q2/2017 Q3/2017 Q4/2017 Q1/2018 Q2/2018 Q3/2018 記憶體相關產品 邏輯IC 測試

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重要資產負債表項目及財務指標(與上一季比較)

(單位：新台幣仟元) 現金及約當現金 金融資產-流動 金融資產-非流動及採用權益法之投資 不動產、產房及設備 資產總計 短期借款及應付短期票券 一年內到期之長期借款及應付租賃款 長期借款及應付租賃款 負債總計 權益總計(含非控制權益) 當季EBITDA 重要財務指標 應收帳款週轉天數 存貨週轉天數	Q3/2018 929,802 362,557 687,422 7,157,658 16,935,212 3,104,857 1,359,617 1,608,761 11,446,487 5,488,725 357,532 62天 37天	Q2/2018 980,380 394,454 667,938 7,303,202 16,673,869 3,108,250 1,462,964 1,494,267 11,150,158 5,523,711 351,862 63天 36天	季變化 (5.16%) (8.09%) 2.92% (1.99%) 1.57% (0.11%) (7.06%) 7.66% 2.66% (0.63%) 1.61%

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重要資產負債表項目及財務指標(與去年同期比較)

(單位：新台幣仟元) 現金及約當現金 金融資產-流動 金融資產-非流動及採用權益法之投資 不動產、產房及設備 資產總計 短期借款及應付短期票券 一年內到期之長期借款及應付租賃款 長期借款及應付租賃款 負債總計 權益總計(含非控制權益) 當季EBITDA 重要財務指標 應收帳款週轉天數 存貨週轉天數	Q3/2018 929,802 362,557 430,479 7,157,658 16,935,212 3,104,857 1,359,617 1,608,761 11,446,487 5,488,725 357,532 62天 37天	Q3/2017 1,394,742 492,396 703,237 7,946,426 17,023,756 2,845,254 1,614,499 2,066,744 10,997,377 6,026,379 339,024 61天 36天	年變化 (33.34%) (26.37%) (38.79%) (9.93%) (0.52%) 9.12% (15.79%) (22.16%) 4.08% (8.92%) 5.46%

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Q&A

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Micro SD Process Flow
SMT
Wafer Grinding Wafer Saw Die Attach 1
Epoxy Curing 1
Die Attach 2
Epoxy Curing 2 Plasma Clean Wire Bonding
Back Side
Plasma Clean Molding Post Mold Curing
Marking
Top Side
Marking Laser Cutting V Saw Singulation
Memory Test Ship out
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免責聲明

本簡報及同時發布之相關內容來自可取得之內外部資訊 ，若因後列各項因素而改變或調整，如市場需求、價格 變動、國際經濟情勢、供應鏈議題、國際匯率波動及其 他本公司不能掌控因素等，本公司不負責隨時提醒或更 新，請以台灣證券交易所公開資訊觀測站公告資訊為主 要依據。

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