Nordic Semiconductor — Investor Presentation 2016

Nov 28, 2016

Cellular IoT

Investor and analyst brief

Nordic Semiconductor ASA November 28 2016 Oslo, Norway

Introduction Svenn-Tore Larsen, CEO

Today is all about Cellular IoT

Low power LTE technology

The market opportunity

Our strategic investment

Fundamental concepts Shaping the future of IoT

Fundamental drivers Size and growth potential Product and market strategy Product development

Proven track record - 2 years into cellular IoT

Proprietary 2.4GHz

3 years

to reach first revenue

Bluetooth

to reach first revenue

Today's speakers

Thomas Embla Bonnerud

Svein-Egil Nielsen

Juha Heikkilä

Director of Strategy and IR

Chief Technology Officer

Head of Nordic Finland

15 year+ with Nordic Last 10 in Product Management Product and market strategy

Started in 2001 Responsible for R&D organization Ex chairman of Bluetooth SIG

20 years in cellular chipset development Nokia, Renesas, Broadcom

Today's agenda

Technology and ecosystem $#1$

• Cellular IoT market $#2$
• Product and market strategy #3
• Product development #4

#5 $Q\&A$

Technology and ecosystem Thomas Embla Bonnerud

Cellular - a unique value proposition for loT

The emergence of low power LTE

Cost/size/power

Lower throughput

Higher throughput

New low power LTE technologies

	LTE-M	NB-IoT
Also known as	"LTE-MTC", "LTE Cat-M1"	"LTE Cat-M2", "LTE Cat-NB1"
Max throughput	~575kbps	$~50/60$ kbps
Range	Up to $4X$	Up to 7X
Mobility	Yes	Limited
Frequency deployment	LTE In-band	LTE In-band, guard band and GSM re-purposing
Deployment density	Up to 200,000 per cell
Module price	Sub \$10
Module size	Suitable for wearables
Power consumption	Up to 10 year of battery lifetime

More than low power...

Broader coverage

Massive deployments

Smaller size

Lower cost

Rural areas Deep indoor Higher density deployments

Space constrained devices

Module cost Subscription cost

Low power LTE vs. unlicensed LPWNA

	Low power LTE (NB-IoT, LTE-M)	Unlicensed LPWAN (SigFox, LoRA)
Open standard	Yes, 3GPP	No, proprietary
Frequency bands	Licensed	Unlicensed, sub 1-GHz ISM
Infrastructure	Existing LTE	New
Max throughput	Up to 375kbps	Up to 6kbps
Reliability and QoS	$(+++)$	$(-)$
Security	$(+++)$	$(-)$
Module cost	$(-)$	$(+)$
Power	$(-)$	$(+)$

Cellular IoT ecosystem and players

The importance of modules for IoT

Barriers for chipset integration

Complexity of integration Tele-regulatory approvals Standard compliance Carrier certification Regional variants

Anatomy of a cellular module

LTE module for M2M

37x50x5.3mm, USD ~40 cost

• Chipset Baseband Processor, Radio
• RF Front-end PA, LNA, Switches, filters ++
• Memory RAM, Flash
• Power Management IC (PMIC)

Source: IHS Technology Teardown Service, 2015

Region and carrier specific frequency bands

• 44 LTE frequency bands
• Low Bands (Sub 1GHz) I.
• Mid Bands (2GHz) ×
• High Bands (>2GHz) I.
• Lower frequency longer range Ī.
• Country specific bands I.
• Operator specific bands ×

Band support for chipset and modules

Chipset

Transceiver support for multi-band Cost and complexity impact

Module

RF-front-end support for multi-band Significant cost and complexity impact Typically 2 - 5 bands

Device band support

4G data modem

1-3 bands Limited to a carrier and region Lower complexity and cost

Modern smartphone

$25+$ bands

Worldwide roaming Higher complexity and cost

SIM and subscription

SIM is needed for network access

Unique information / process for network identification Specialized secure microcontroller and memory

eSIM is key for IoT

SIM card not practical for IoT application

eSIM is chip

Over-the-air provisioning

Remotely manage subscription

Low power LTE standardization

A GLOBAL INITIATIVE

Standardization body GSM, UMTS and LTE

Part of Release 13 Completed

$LTE-M$

Part of Release 13 Completed

NB-IoT

Evolution path to 5G

Ultra high throughput

Higher frequency (>26GHz)

Cellular IoT market

Cellular IoT market opportunity

Existing and fast growing market

Low power LTE a key driver

Complements Bluetooth market

Excludes phones, tablets and PCs

~ 400M connection in 2015 27% CAGR*

Continued growth $\rightarrow$ 2022 Diversification of the market Different type of applications A few overlaps

(*Source: Ericsson Mobility Report 2015)

Split between technologies

Low power connectivity redefined

No local

area network

Existing infrastructure

Ubiquitous connectivity Security and reliability Ease of use

Key use cases in cellular IoT

A diversified market opportunity

Low power LTE market $2017 - 2021$

Home

Industry

City

Healthcare

$\frac{\Delta}{\nabla}$

Transport

Buildings

Logistics

Utilities

Consumer

Agriculture & environment

28

Product-as-a-service unlocking consumer

Cellular subscription part of the service

Services built on top of connectivity Cloud, big data, machine learning Per "use" and/or recurring

Low power LTE coverage is key enabler

Massive worldwide LTE coverage

• $\blacksquare$ LTE Cat 3+
• January 2016: 480 networks, 157 countries
• Drivers: throughput and spectrum efficiency

Low power LTE status and projection

• Upgrade of existing LTE infrastructure
• Rapid deployment
• Test deployments in 2016
• LTE-M in US, NB-IoT in Europe and Asia
• First commercial services 2017
• Broad coverage for both technologies 2018 $\rightarrow$ $\blacksquare$

Market sizing: public research

Ericsson Mobility Report $(2015)$

15 28 CAGR billion billion 2015-2021 Cellular IoT $0.4$ $1.5$ 27% $4.2$ $14.2$ 22% Non-cellular IoT PC/laptop/tablet 1.8 1% $1.7$ Mobile phones $7.1$ 8.6 3% Fixed phones $1.3$ 0% $1.4$ 2015 2021

GSMA

$(2015)$

Modelling unit shipments for low power LTE

Connections

$\rightarrow$ Unit shipments

Replacement

rate $(\%)$

Low power LTE share $(\%)$

Change in number of connections

Replacement of 2G/3G General replacement

VS. 2G/3G and LTE Cat 1+

Example model: units shipment 2016 - 2021

Dataset and assumptions

• Ericsson Mobility Report 2015
• 400M connected devices in 2015, mainly 2G/3G
• $-27\%$ CAGR

Replacement rate

• % of total number of connection
• 2% per year 2017 2021: total of 110MU

Low power LTE share

• Bluetooth Smart: from 0 to 250MU in 5 years
• May be to optimistic, may be to pessimistic
• Just an example! $\mathcal{L}_{\mathcal{A}}$

Projected chipset ASP 2017 - 2021

Chipset price range

'Baseline'

• Transceiver + Baseband Processor
• Single mode NB-IoT or LTE-M
• Single low band support
• Price erosion $\rightarrow$ 2021

'Value add'

• Application Processor
• Memory (Flash/RAM)
• Power Management
• Multimode LTE-M/NB-IoT
• Multi-band support
• Simplified RF front-end
• Size, power and performance
• Advanced connectivity features

Projected module ASP 2017 - 2021

Module price range

'Baseline'

• 'Thin modem', low cost LGA
• Single mode NB-IoT or LTE-M
• Single low band support
• Price erosion $\rightarrow$ 2021

'Value add'

• Multi-band, high performance RF front-end
• Higher value chipset
• On-board sensors, including GPS
• On-board application processor
• On-board eSIM
• Temperature range
• Automotive qualification
• Miniaturization

Modelling market value for chipsets

$ASP \neq lowest price$

Volume distribution over the price range Distribution of customer size

Range of price points

Market / application depend

Market dependent

There will be a "value play"

Example model: market value 2016 - 2021

Dataset and assumptions

• Unit per year model earlier slide (Ericsson Mobility Report)
• Low power LTE only
• Flat \$5 ASP
• Value add integration offsets price erosion
• May be to optimistic, may be to pessimistic

Other market enablers/drivers

Subscription cost / model

	Page Bill Date
WIRELESS BILL Account Number Customer	$\partial$ to t July 3, 2013
123456789-0 JOHN DOE	$\text{Tax}^{\text{o}/\text{o}}$ 4.00%
Tax/Charge	4.25%
State sales lax Local sales taxes	0.19% 2.50%
MCTD sales tax itate excise tax (186e) Hence (186e)	$0.30\%$ 1.49%

Support for eSIM

Adoption in

consumer

Cost of ownership

Over the air provisioning

Shorter design cycles Drive early volume ramp

Ξ

Birdseye view - strategic rationale

Technology shift

Market shift

Right expertise

High throughput $\rightarrow$ power, size, coverage and cost

Specialized $\rightarrow$ broad diversified market

Nordic low power DNA Broad market model Cellular expertise in Finland

Low power LTE only

I TE-M and NB-IoT

LTE-M first

Early US deployments

Broader range of applications

Multi-mode LTE-M / NB-IoT chipset

Incremental approach to a bigger market

Why not unlicensed LPWAN?

The chipset - a different approach

Architected and optimized for I TF-M and NB-IoT

High level of integration

NB-IoT support enabled with firmware update

Power Size Performance Features Solution cost

Off-the-shelf and broad market solution

Complete and easy to use solution

Lowering barriers of adoption

Leverage existing community & ecosystem

Strategic partnerships Hardware, software and tools

Enable innovation Drive market growth

Forum and Developer Zone 3'rd party tools and solutions

Focused and incremental go-to-market

Regions

Regional tailored offerings Carrier certifications and partnerships

Customers and verticals

High volume and growth potential Strong competitive edge

Software

New features and performance improvements,

Meeting focus customer requirements

Lead customer momentum

Selected verticals Logistics, consumer, utilities

Strong interest Competitiveness of our solution Working with Nordic

Collaboration on requirements

Matching our early offering to their requirements

Target sampling and launch

Second half

2017

Limited sampling

• Lead customers only $\blacksquare$
• Pre-production hardware $\blacksquare$ and software

2018

General sampling

• Public launch $\blacksquare$
• Pre-production hardware $\blacksquare$ and software

Aligning production with lead customers

9 – 18+ months design-in time

Evaluation - development - certifications - production Production ramp linked to sampling schedule

2018

Volume ramp with lead customers Dependent on sampling schedule and design-in time

2019

Lead customers in volume production Volume ramp with general customers

Product development Svein-Egil Nielsen Juha Heikkilä

Nordic has six R&D locations

• Trondheim Ì.
• ~230 Engineers ×
• RF/Analog, Digital design, Test, Firmware ×
• Oslo $\blacksquare$
• ~ 35 Engineers ×
• RF/Analog, Digital Design, Firmware ×
• Krakow $\blacksquare$
• ~25 Engineers ×
• Firmware ×
• Oulu/Turku ×
• ~130 Engineers ×
• RF/Analog, Digital/Mixed-Signal, Test, × Firmware
• Portland, OR I.
• IOT Labs
• 3 persons ×

World class IC design capability

Leading edge Radio's

• Fully designed in house $\mathbf{u}$
• Stability and yield in production
• Leading edge performance
• Basic Rate Bluetooth radio typically uses 25 to 35mA $\sum$
• Nordic 51 radio similar Basic Rate performance uses as low as 9mA $\rightarrow$

Highly configurable digital platform architecture

• Able to turn on/off each and every block to minimise current
• Co-operation with ARM so have leading micro-controller options for all products
• Flash process allowing flexibility and optimization by customers $\mathbf{u}$
• Source IP when a commodity freeing up R&D resources to focus on customer

Large software teams in place

Software is a key enabler for silicon sales

How does software add value?

• Making complex hardware simple to use $\mathbf{r}$
• Adding reliability
• Adding security $\mathbf{r}$

$\blacksquare$ $\cdots$

• Adding higher-level functionality
• Over-the-Air Device Firmware Upgrade $\mathbf{r}$
• Application-specific functions $\mathbf{r}$
• Enabling multi-role / multi-link / multi-protocol $\mathbf{r}$

COPYRIGHT © 2005, MOUNTAIN GOAT SOFTWARE

Overall: enabling customers to concentrate on their contribution, not on Nordic's hardware or software

We are building sustainable competitive edge with R&D

Tight collaboration with marketing, sales and customers to ensure we make the right products Highly educated and experienced staff

• low attrition rate ×.
• selective recruiting $\mathbf{r}$

Large portfolio of in-house IP that are leveraged in new products, patent portfolio

Top of the line design tools

Collaboration with leading partners

TSMC, ARM, CEVA $\mathbf{r}$

Active participant in standards organizations to shape tomorrow's specifications

Bluetooth Sig, ETSI, 3GPP, NCF Forum, IEEE, Rezence, ++ $\mathbf{r}$

Focus and agility

Committed to customer focused development

Nordic Semiconductor's R&D Department have a customer focused approach committed to providing off-the-shelf solutions to thousands of customer but at the same time be able to develop targeted solution to key application segments and supporting key customers with their special needs. With our flexible IC and software architecture, robust solutions, willingness to support customers, whatever it takes attitude, we will provide the ultimate peace of mind for any engineer and company working with our products.

Fall of 2014 large layoffs in Finland

UUTISET > NEWS

News 23.7.2014 14:27 | updated 23.7.2014 14:27

Broadcom to stop making phone chips-600 jobs to go in Finland

The wireless modem maker Broadcom is to shut down its connectivity chip operations with the loss of 600 jobs in Finland. Some 430 of them will go in Oulu. which is already reeling from the announcement last week that Microsoft will close a research facility there.

Image: Kirsi Karppinen / Yle

The fate of Oulu as an IT hub hangs in the balance after another company announced hundreds of job losses in the sector. Broadcom, a US wireless modem firm that runs a research hub in the city, is to cease operations in the connectivity chip field after failing to find a buyer for the unit.

The closure means 600 people in Finland will lose their jobs, with some 430 of those based in Oulu making 'baseband' chips for mobile devices.

The northern city has been hit hard by changes in the technology sector, with some 500 people informed just last week that their jobs at Microsoft's research and development centre will go when the centre shuts down

Ericsson, once the major manufacturer of modems, is planning to leave the business. The move will see 1,000 redundancies and 500 people moving to other Ericsson projects, such as small cells.

22 Sep 2014 at 13:36, Simon Rockman

$\mathbb{G}$

$\bullet$

G

$f_n$

In February 2009, Ericsson entered into a joint venture with ST-Microelectronics - itself a merger of SGS-Thomson and NXP - in a bid to take on Qualcomm. In mid-2013, ST-Ericsson was dissolved with the modem business moving to Ericsson. The closure of the joint venture led to the loss of 1,600 jobs.

We travelled to Oulu to recruit and investigate opportunities

Come meet us at Radisson Blu Oulu, Tuesday August 12th at 18:00

We are always looking for the best engineers and offer a working environment where you will be integral to the development of ideas and decisions. It is an environment where you can make a difference and contribute to the success of the company.

We are now hiring more engineers for our R&D centers in Oslo & Trondheim. RF & ANALOG DESIGN ENGINEERS IC DESIGN ENGINEERS HW/SW VERIFICATION ENGINEERS MCU VERIFICATION ENGINEERS FW DEVELOPERS PROJECT & PROGRAM MANAGERS

Norwegian company that produces and sells Integrated Chips [ICs] with Bluetooth technology, ANT+ and custom made protocols. Our engineers are central in the development of
the Bluetooth Smart standard, which is now being adopted by all major tech companies worldwide.

NORDIC

$\triangleright$ www.nordicsemi.com/career $\blacksquare$ $\blacksquare$ $\blacksquare$

Saw a great opportunity, action needed fast

• We knew it is difficult to build a large competent and experienced team in Norway quickly
• Competencies found in Finland was a great match to our ambitious
• Could build a sizeable organization quickly
• Cultural and Geographical fit
• Needed decision quickly

Clear success criteria for establishing a presence in Finland

• Strong management team. $\mathcal{L}_{\mathcal{A}}$
• Recruit efficiently and find great talent. Get up to speed fast with $\mathcal{L}_{\mathcal{A}}$ experience people
• License key IP to secure schedule and performance of product $\mathcal{L}_{\mathcal{A}}$
• Solid integration with other parts of organization - $\blacksquare$
• "Not: them and us" $\mathbf{u}$
• "It's about the culture" $\mathbf{u}$
• Leverage existing investments in IP and process and platform $\mathcal{L}_{\mathcal{A}}$
• Scale on existing Nordic infrastructure

R&D Finland

Highly capable organization quickly built

65 employees in place by start 7 January 2015, now 135 employees

• Managment team rapidly built $\mathcal{L}_{\mathcal{A}}$
• Have recruited the whole $\mathcal{L}_{\mathcal{A}}$ cellular modem competence in house
• Resourcing optimized for $\mathcal{L}_{\mathcal{A}}$ cellular low power and low cost loT develoment

Highly relevant experience

Radio Systems personell with Nokia-Renesas-Broadcom background

Design from very first cellular systems up to highest category LTE modems

Power management, RF and Digital IC and SOC design personell with Nokia-Renesas-Broadcom and Nokia-ST Fricsson-Fricsson backround

• Multi-billion IC/SOC volume experience

Firmware and protocol SW personnel with Nokia-Renesas-Broadcom and Nokia-ST-Fricsson-Fricsson background

• Multi-billion cellular product volume experience

Products developed with cross-functional teams in Finland and Norway

R&D Finland tightly integrated with teams in Norway

• 80% development in Finland: Cellular technology
• 20% in Norway: Low power technology SOC integration
• Cross fertilization of best in class knowledge
• Scale on specialized skills in each office
• Ensure reuse of building blocks
• Common culture, sharing

Scaling on existing Nordic Semiconductor infrastructure

• Leveraging existing technology platforms
• Internal design processes, Quality systems $\mathcal{C}$
• Reuse of technology and design blocks from current Nordic projects
• Shared CAD tools
• Shared resources for verification $\mathcal{L}_{\mathcal{A}}$
• Common datacenter $\mathcal{L}^{\text{max}}$
• Existing suppliers such as; TSMC, ASE, AMKOR $\blacksquare$

Technology purchasing, licensing and outsourcing vital to development success

Licensed and acquired HW and SW building blocks to speed up development and reduce risk

• Microcontrollers, DSP, memory,..
• $\blacksquare$ RF modules
• Software
• $\bullet$ OS's

Selective outsourcing of key elements to key partners

Extensive laboratory setup built

• Pre-silicon modelling environments (IC emulation and FPGA) in place
• RF and Power measurement capability with high level of automatization
• Automated protocol testing capability $\mathcal{L}_{\mathcal{A}}$
• RF Shielded champers

Iterated IC development process

Special function test chips

• Analog/RF

• Full system prototypes for SW development

• Debugging/verification, certification/ carrier interoperability

• Early customer sampling

Mass-production chips

• Fixing bugs and issues from prototype chips

• Possibly add additional functionality as needed

Software development ongoing

Software development for Cellular IOT products

• Firmware and RF SW $\mathbf{r}$
• L1 and L2/L3 protocols $\blacksquare$
• Communication protocols $\mathbf{r}$
• Test and verification SW $\overline{\phantom{a}}$
• Interoperability and field testing + certification $\blacksquare$

Multiple tools and platforms

• Emulators $\mathcal{L}_{\mathcal{A}}$
• FPGA platforms W.
• Prototype Chips ×

Software releases through iterative process

• Initial and subsequent alpha level software $\blacksquare$
• Beta software releases ٠
• Production SW releases $\mathbf{r}$

Partners in place for interoperability testing and certification

Collaboration with main infrastructure vendors in place

• Requirements alignment: technical details, feature roadmap and schedules $\mathbf{m}$
• Interoperability testing (lab and field testing) $\overline{\phantom{a}}$

Carrier collaboration with selected carriers in place

• Requirements alignment: features and schedules, certification processes $\overline{\phantom{a}}$
• Pre-certification testing planned to selected carrier labs $\blacksquare$

Overall development flow

Significant development progress

Multiple succesfull tapeouts

• $\blacksquare$ Two RF chips
• Full prototype Baseband Chip $\blacksquare$

Software development in good shape

• 1.5 million lines of code

Partnerships in place

• Technology
• Infrastrucuture vendors $\overline{\phantom{a}}$
• Carriers $\overline{\phantom{a}}$

Summary and Q&A

Today is all about Cellular IoT

Low power LTE technology

The market opportunity

Our strategic investment

Fundamental concepts Shaping the future of IoT

Fundamental drivers Size and growth potential Product and market strategy Product development

Cellular IoT

Investor and analyst brief

Nordic Semiconductor ASA November 28 2016 Oslo, Norway

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