MVI — Annual Report 2018

Apr 17, 2019

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April 17, 2019

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簡明綜合損益表-年度比較

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Quarterly Financial Highlights 近年季度營運表現

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Wafer Foundry Output Trend (average per month) 平均每月晶圓製造產出數量

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Pcs/Month
60000
50000
40000
30000
20000 Others
Analog/TVS
10000 Diode/MCD
MOSFET/IGBT
0
2014 2015 2016 2017 2018
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2018 Revenue Breakdown

銷售分析 – 產品別

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Summary 經營總結

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• 拓展國際品牌大廠與車規應用業務，提高附加價值與長期穩健 訂單。

• 投資 IGBT 八吋製程設備並添購車規要求軟硬體設備，持續優 化生產線。

• 透過與上、下游合作夥伴和客戶結盟，共同開發下世代產品。

• 2018 年完成募資計畫，用以改善公司財務結構及擴充先進製程 與產能，以拓展產品業務與提升公司競爭力。

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2019/4/17

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MVI Product Update 產品訊息報告

Mosel IGBT Products Overview – IGBT 產品一覽表

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Voltage Rating (V)	Current Rating (A)	Technology		Availability
650	10	Trench NPT		Released
650	15	Trench NPT		Released
650	20	Trench NPT		Released
650	30	Trench NPT		Released
650	100	Trench NPT		Released
750	150	Trench SPT		Eng. Sample Ready
750	150	Trench Field Stop		Under development
1200	20	Trench NPT		Released
1200	30	Trench NPT		Released
1200	40	Trench NPT		Released
1200	100	Trench NPT		Eng. sample Ready
1200	150	Trench SPT		Eng. sample in process
1200	150	Trench Field Stop		Under development
1200	200	Trench NPT		Released

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溝渠 式 Trench IGBT 工藝技術

• 場截止型 (Field Stop)

• 軟貫穿型 (Soft Punch through)

先進晶片薄化 工藝技術

 50 ~ 90um 厚度晶片薄化

 Taiko like grinding process

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Dec 18
IGBT -Trench NPT with Carrier Thin wafer process start
Enhancement (6” wafer) (6” & 8” wafer)
Thin wafer process launch (8” wafer)
IGBT -Soft Punch Through SiC Diode & MOSFET
IGBT -Trench Field Stop Start
TMPS ¹ Diode start IGBT - Trench Field Stop mass production (8” wafer)
TMPS Diode mass production (6” & 8”wafer)
2018 2019 June 2019 Dec. 2020 March 2021 2022 2023
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Note 1: TMPS : High voltage fast recovery diode, Mosel patent pending

Product Strategy for Automobile

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MOSEL IGBT Module Feature – IGBT/FRD Chips

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	Items Wafer FAB Target Status Capacity Trench NPT 1 6” 650V / 700V SOP 20K/yr Trench NPT 2 (Lo-Loss) 6” 1200V SOP 20K/yr Exist IGBT/FRED Chip Items Wafer FAB Target Status Capacity Field Stop 1 8” 650V – 1200V Develop 20K/yr Field Stop 2 8”~12” 750V – 1200V Develop Develop IGBT / FRD for next generation

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SUMMARY

茂矽以符合客户產品需求,提供先進IGBT工藝的產品。

1. Trench NPT IGBT (溝槽式 NPT) 家電與工控產品應用。

2. Trench CETBT IGBT (溝槽電荷儲存式) 電機控制與逆變器使用。

3. FS IGBT (場截止式) 高效能車用電機驅動器使用。

4. FS IGBT with RC structure, 低功耗家電使用。

Mosel is MOVING forward to AUTOMOTIVE

• Engaged with 1st tier WW Electric Vehicle manufacturing companies

• 進入電動車領先企業

• Broaden product portfolio – 400V to 1700V

擴充產品系列 – 400V – 1700V

• Developing next killer product to service emerging market - Hi-density power package

• 開發殺手級產品 – 高功率密度封裝件

• Technology migration – Trench NPT to SPT and Field Stop

• 工藝升級 – 從 Trench NPT 到 SPT( 軟貫穿 ) 與 FS (場截止)

• Listen to the voice of the customer

• 聆聽客戶的聲音

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