Mirle — Investor Presentation 2024

Dec 12, 2024

法人說明會

Investor Conference

• 簡報內本簡報及同時發佈之相關訊息，包括公司策略、財務狀況等內容，係本公司基於內部資料及 外部整體經濟發展現況所得之資訊。

• 本簡報所作有關本公司財務上、業務上、Q&A之說明，可能與未來實際結果存有差異。其原因可能 來自各種因素，包括但不限於市場需求、各種政策法令與整體經濟現況之改變，及其他本公司無法 掌控之風險等因素。

• 本公司不因任何新事件或任何狀況的產生而負有更新或修正本簡報資料內容之責任。

• The information contained in this presentation and its accompanying announcements, including content relating to business outlooks, financial operations, is based on information derived from internal corporate data and external economic developments as a whole.

• The company’s finance, business and Q&A made in this presentation could be different from the future actual results. This may be due to various factors, including but not limited to market demands, changes in policies and regulations and overall economic conditions, and other factors or risks beyond the Company’s control.

• The Company is not responsible for updating or amending changes or adjustments made to the contents of this presentation, if such changes or adjustments should occur in the future.

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公司簡介(Company Profile) 經營績效 (Operation Performance)

營運展望(Business Outlook) Q&A

About Mirle

Mirle Automation Corporation

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Date of establishment：February , 1989 Chairman & President：Houng Sun Chief Executive Officer：Stone Lin Headquarter address：

No. 3, R&D II Road, Hsinchu Science Park, Hsinchu City Paid-in capital：Approximately NT$ 20.5 billion Number of Group Employees：Approximately 1,400 employees Stock code：2464

Houng Sun

Chairman & President

Brand Core: Providing comprehensive and cost-effective solutions with AI intelligent technology to meet customers' needs for full-factory automation. Value Proposition: Enhancing customers' competitiveness with stable and reliable full-factory automation capabilities. Relationship: A reliable and professional partner for mutual growth.

Main Clients

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Semiconductor Logistics Panel Information Machinery Food Industry Automotive Touch Panel Parts

01 經營績效Operation Performance

年營收及毛利 Revenue & Gross Profit by Year

	年營收	及毛利Revenue & Gross Profit by Year	及毛利Revenue & Gross Profit by Year	及毛利Revenue & Gross Profit by Year	及毛利Revenue & Gross Profit by Year	及毛利Revenue & Gross Profit by Year
		單位:佰萬元；% Unit：In Millions of NTD，% 2020 2021 2022 2023 2024Q3 8,909 9,861 10,769 8,813 5,360 1,883 2,045 1,877 1,450 1,003 21.1% 20.7% 17.4% 16.5% 18.7% 0.0% 5.0% 10.0% 15.0% 20.0% 25.0% 合併營收 Revenue 營業毛利 Gross profit 營業毛利率 GP %
	- 2,000 4,000 6,000 8,000 10,000 12,000	2020 2021 2022 2023 2024Q3 8,909 9,861 10,769 8,813 5,360 1,883 2,045 1,877 1,450 1,003 21.1% 20.7% 17.4% 16.5% 18.7% 0.0% 5.0% 10.0% 15.0% 20.0% 25.0% 合併營收 Revenue 營業毛利 Gross profit 營業毛利率 GP %
		2020	2021	2022	2023	2024Q3
	合併營收 Revenue	8,909	9,861	10,769	8,813	5,360
	營業毛利 Gross profit	1,883	2,045	1,877	1,450	1,003
	營業毛利率 GP %	21.1%	20.7%	17.4%	16.5%	18.7%

年度產品別營收 Revenue by Product Category

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其他自動化產品
Other Niche Key Product
10%
10,000 數位科技
7% Digital Technology
11% 光電面板自動化系統
9% FPD Automation System
10%
21%
8,000 半導體設備系統
10% Semiconductor System
智能自動化系統
34% Intelligent Automation System
40% 16%
6,000
36%
11%
6%
4,000 38%
23%
34%
19%
12%
2,000 44%
4%
24% 20% 26%
18%
17%
-
2020 2021 2022 2023 2024Q3
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合併季營收 Revenue by Quarter

	2,404 2,064 1,431 1,744 2,185 2023 3Q 2023 4Q 2024 1Q 2024 2Q 2024 3Q 單位：佰萬元 Unit：In Millions of NTD
0 500 1,000 1,500 2,000 2,500 3,000	2,404 2,064 1,431 1,744 2,185 2023 3Q 2023 4Q 2024 1Q 2024 2Q 2024 3Q

營業費用 Operating Expenses

			360 433 423 13.6%	360 433 423 13.6%	447 510 396 13.7%	447 510 396 13.7%	481 536 499 14.1%	481 536 499 14.1%	單位：佰萬元；% Unit：In Millions of NTD， 2023 2024 3Q 16.4% 18.6% 504 376 558 346 382 276 382 276 558 346 504 376 16.4% 18.6%	單位：佰萬元；% Unit：In Millions of NTD， 2023 2024 3Q 16.4% 18.6% 504 376 558 346 382 276 382 276 558 346 504 376 16.4% 18.6%	單位：佰萬元；% Unit：In Millions of NTD， 2023 2024 3Q 16.4% 18.6% 504 376 558 346 382 276 382 276 558 346 504 376 16.4% 18.6%	%
			2020		2021		2022		2023		2024 3Q
	佔營收比		13.6%		13.7%		14.1%		16.4%		18.6%
	研發費用 R&D		423		396		499		504		376
	管理費用 General & administrative		433		510		536		558		346
	銷售費用 Sales & marketing		360		447		481		382		276

綜合損益表 Statements of Comprehensive Income

單位：仟元；% Unit：In Thousands of NTD，% 營業收入淨額 Net Revenue 營業毛利率 Gross Margin 營業費用 OperatingExpense 營業費用率 OperatingExpense Ratio 營業淨利 OperatingMargin 營業淨利率 OperatingMargin 營業外收入及支出 Non-OperatingItems 本期淨利 Net Income 每股盈餘（元） EPS(NT Dollar)	單位：仟元；% Unit：In Thousands of NTD，% 營業收入淨額 Net Revenue 營業毛利率 Gross Margin 營業費用 OperatingExpense 營業費用率 OperatingExpense Ratio 營業淨利 OperatingMargin 營業淨利率 OperatingMargin 營業外收入及支出 Non-OperatingItems 本期淨利 Net Income 每股盈餘（元） EPS(NT Dollar)	2024Q1~Q3 5,359,922	2023Q1~Q3 6,748,408	2023
				8,812,743
	營業毛利率 Gross Margin	18.71%	14.86%	16.46%
	營業費用 OperatingExpense	998,460	1,082,115	1,443,827
	營業費用率 OperatingExpense Ratio	18.63%	16.04%	16.38%
	營業淨利 OperatingMargin	3,300	31,374	13,357
	營業淨利率 OperatingMargin	0.06%	0.46%	0.15%
	營業外收入及支出 Non-OperatingItems	40,992	21,072	230,673
	本期淨利 Net Income	51,091	31,979	182,762
	每股盈餘（元） EPS(NT Dollar)	0.23	0.14	0.89

綜合損益表 Statements of Comprehensive Income

單位：仟元；% Unit：In Thousands of NTD，% 營業收入淨額 Net Revenue 營業毛利率 Gross Margin 營業費用 OperatingExpense 營業費用率 OperatingExpense Ratio 營業淨利 OperatingMargin 營業淨利率 OperatingMargin 營業外收入及支出 Non-OperatingItems 本期淨利 Net Income 每股盈餘（元） EPS(NT Dollar)	單位：仟元；% Unit：In Thousands of NTD，% 營業收入淨額 Net Revenue 營業毛利率 Gross Margin 營業費用 OperatingExpense 營業費用率 OperatingExpense Ratio 營業淨利 OperatingMargin 營業淨利率 OperatingMargin 營業外收入及支出 Non-OperatingItems 本期淨利 Net Income 每股盈餘（元） EPS(NT Dollar)	3Q/2024 2,185,324 20.4%	2Q/2024 1,743,603 19.8%	3Q/2023 2,404,189 15.3%	季變化 Quarter Variation 25.3% 0.6%	年變化 Annual Variation -9.1% 5.1% 5.2% 2.4% 7050.4% 2.7% -314.2% 414.9% 0.08
	營業費用 OperatingExpense	385,212	352,169	366,185	9.4%
	營業費用率 OperatingExpense Ratio	17.6%	20.2%	15.2%	-2.6%
	營業淨利 OperatingMargin	60,492	(7,398)	846	NA
	營業淨利率 OperatingMargin	2.8%	-0.4%	0.0%	3.2%
	營業外收入及支出 Non-OperatingItems	(42,464)	27,900	19,820	-252.2%
	本期淨利 Net Income	21,501	14,683	4,176	46.4%
	每股盈餘（元） EPS(NT Dollar)	0.10	0.07	0.02	0.03

02 營運展望 Business Outlook

在手訂單 Order in Hand

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其他自動化產品
智能自動化系統
Other Niche Key Product
Intelligent Automation System
10%
數位科技 18%
Digital Technology
6%
光電面板自動化系統
FPD Automation System
18%
半導體設備系統
Semiconductor System
48%
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營運展望 Business Outlook

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Robot Applications

• The core equipment such as OHT, EFEM, AMR, and Stocker (for Semiconductor & FPD) has already adopted the industrial robot technologies independently developed by Mengli. In addition to the robotic body and harmonic reducers, the integration of drive components, vision systems, and peripheral robotics systems has been applied to the semiconductor and other industries.

• The company has initiated a humanoid robot application layout, working through Taiwan and Chinese-invested companies to develop key robot components (such as harmonic reducers, joint modules, dexterous hands, integrated wheels, and key modules for mobile chassis) and engage in strategic industry collaborations. This aims to secure a position in the supply chain for the critical development stages of humanoid robots.

• Starting in 2025, the company will promote the application of humanoid/biomimetic robots in industries such as semiconductors, logistics, and EMS (electronics manufacturing services), as well as in environments like lightsout factories (unmanned factories).

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Semiconduct
or Assembly
and Testing Substrate
Industry Industry
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Third-Party
Logistics (3PL)
Industry
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營運展望 Business Outlook

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Semiconductor

• Including key in-house equipment such as OHT, EFEM, Stocker, AGV, and AI automation control software (such as MCS, WMS, DCS, etc.), with a focus on integrating the entire factory automation system.

• With the rising demand for advanced packaging such as GPU, HBM, orders have already been secured in Q3, and capital investments driven by high-end packaging and applications are expected to continue through 2027.

• MIRLE has had a long track record in FOPLP complete automation systems and is the leading company in Taiwan with the most extensive application of related automation systems. In response to the rapidly growing market demand, the company has already begun planning with target customers.

• MIRLE will continue to collaborate with major international equipment manufacturers to develop nextgeneration equipment based on Glass-core technology.

• The company has also launched a humanoid robot application project for the semiconductor industry, offering more comprehensive system integration solutions.

• Orders in Taiwan, Southeast Asia (Malaysia, Singapore, Thailand, etc.), and China are expected to continue growing through 2025.

營運展望 Business Outlook

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New Energy

• The development and integration of the immersion cooling automation system have secured orders from semiconductor target customers, and the verification and data collection of various systems are currently underway.

• The application fields of the related systems include (1) manufacturing and production sectors and (2)

Applications

• server users. As customer demand for cooling systems becomes clearer and expands, it is expected that by 2025, opportunities to establish application records will arise.

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OHT_Immersion Cooling Concept

AI

營運展望 Business Outlook

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• Using the Nvidia Omniverse platform, a virtual factory is constructed, integrating 3D models of equipment, physical simulations, Building Information Modeling (BIM), thermal and airflow simulations, structural analysis, and production management systems. Through AI deep learning, this technology enables the integration of the physical and virtual worlds, achieving digital twin capabilities. This optimizes automation operation efficiency and creates higher value for semiconductor customers’ automation systems.

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• Developing digital twins for each piece of equipment, and combining OT (Operational Technology) with IT (Information Technology), creates a virtual-physical integration system for smart factories. This system serves as an optimization platform for both internal technologies and external customer validation, significantly reducing the timeline and cost for automation system implementation and capacity expansion.

營運展望 Business Outlook

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Intelligent Automation System

• Shuttle Cart, AGV, and humanoid robots are the core equipment, complemented by self-developed logistics control systems, command center systems, and virtual-physical integration technologies, to assist customers in achieving intelligent logistics across the entire factory.

• Due to changes in customers' production manufacturing and related global supply chain layouts, the demand for logistics centers and EMS factory-wide intelligent automation logistics in Europe, the Americas, the Middle East, and Southeast Asia markets (such as Vietnam, Thailand, Malaysia, etc.) is expected to increase.

• The demand for new large-scale automation system projects is unclear in the short term.

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Panel

• The demand for equipment upgrades and production line enhancements in the Taiwan and China markets will still persist.

• The potential demand for new panel factories in emerging Asian markets from 2025 to 2026 could help boost orders.

Q&A