KINSUS — Investor Presentation 2025

Aug 18, 2025

景碩科技股份有限公司 Kinsus Interconnect Technology Corp.

Aug 2025

Kinsus Interconnect Technology, Corp.

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IC 封裝技術 IC Packaging Technology

Kinsus Interconnect Technology, Corp.

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電子產品構裝的各個層次

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最終組裝與測試
軟板模組
系統級組裝
硬板組裝
IC 封裝
PCB 空板
系統級封裝模組
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Levels of Assembly

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FATP for end device
FPCB assembly
System level
PCB assembly
IC packaging
Bare PCB
Module (SiP)
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各種形式的 IC 封裝

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PLCC
DIP QFP TSOP
PBGA/
CSP WLP TSV
Flip-Chip BGA
QFN DFN Ceramic BGA Ceramic chip
BGA 封裝市場規模: 2023 年828 億顆, 產值 161億美元
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Different types of IC packaging

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PLCC
DIP QFP TSOP
PBGA/
CSP WLP TSV
Flip-Chip BGA
QFN DFN Ceramic BGA Ceramic chip
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BGA Market size : 82 Billion units, 16 Billion US$ in 2023

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IC 結構

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What Substrate Makers do?

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先進封裝結構

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CoWoS

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Advanced Packaging

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CoWoS

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IC 半導體上下游供應鏈關係

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IC 設計
IC
專業封裝廠
封裝
載板廠
晶圓製造廠
晶圓 載板
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IC Manufacturing Supply Chain

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IC Design (Fabless) IC OSAT Packaging Foundry Wafer

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Substrate house Substrate

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About Kinsus

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基本資料

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• 公司成立 2000 台股上市掛牌 2004

• • 資本額 : 新台幣 45.45 億元

• 廠區 : 總部 新屋 / 台灣 -

• IC 載板 ㇐廠及二廠 - 五廠及六廠

• Kinsus USA - Santa Clara / California -

• 統碩科技 蘇州 / 中國 -

• 晶碩光學 桃園 / 台灣

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Basic Information

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• Established in September 2000

IPO at TWSE in November 2004

• Capital : US$ 147 Million (NT$ 4.545 Billion)

• Campus : Headquarters IC substrates

• Xin Wu / Taiwan

• Plant 1 & 2

• Plant 5 & 6

Kinsus USA Kinsus China PegaVision

• Santa Clara / California

• Suzhou / China

• Taoyuan / Taiwan

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位置

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美國子公司

台灣㇐廠 Kinsus Suzhou (統碩) 台灣二廠 台灣五廠 台灣六廠 晶碩光學

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Locations

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Kinsus Suzhou (統碩)

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Kinsus USA Taiwan plant 1 Taiwan plant 2 Taiwan plant 5 Taiwan plant 6 PegaVision

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每月合併營業額

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Monthly Consolidated Revenue

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產品組合

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Product mix

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Thank you

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