KINSUS — Investor Presentation 2020

Sep 2, 2020

景碩科技股份有限公司 Kinsus Interconnect Technology Corp.

Jun. 2020

Kinsus Interconnect Technology, Corp.

Confidential / All rights reserved by Kinsus Interconnect Technology, Corp.

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IC 封裝技術 IC Packaging Technology

Kinsus Interconnect Technology, Corp.

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電子產品構裝的各個層次

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最終組裝與測試
軟板模組
系統級組裝
硬板組裝
IC 封裝
PCB 空板
系統級封裝模組
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Levels of Assembly

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FATP for end device
FPCB assembly
System level
PCB assembly
IC packaging
Bare PCB
Module (SiP)
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電子產品的組裝結構

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系統級封裝模組
IC
被動元件 連接器
印刷電路板
IC 感應器
被動元件
軟板模組
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Basic structure of electronic devices

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SiP (module)
IC
MLCC Connector
PCB
IC
Sensor
MLCC
FPCB module
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各種形式的 IC 封裝

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PLCC
DIP QFP TSOP
PBGA/
CSP WLP TSV
Flip-Chip BGA
QFN DFN Ceramic BGA Ceramic chip
市場規模: 2016 年2,520 億顆, 其中 719 億顆為 BGA 封裝
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Different types of IC packaging

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PLCC
DIP QFP TSOP
PBGA/
CSP WLP TSV
Flip-Chip BGA
QFN DFN Ceramic BGA Ceramic chip
Market size : 252 Billion units in 2016, 71.9 Billion units in BGA substrates
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IC 結構

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What Substrate Makers do?

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IC 半導體上下游供應鏈關係

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IC 設計
IC
專業封裝廠
封裝
載板廠
晶圓製造廠
晶圓 載板
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IC Manufacturing Supply Chain

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IC Design (Fabless) IC OSAT Packaging Foundry Wafer

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Substrate house Substrate

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About Kinsus

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基本資料

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• 公司成立 2000 台股上市掛牌 2004

• • 資本額 : 新台幣 45.12 億元

• 廠區 : 總部 新屋 / 台灣 -

• IC 載板 ㇐廠及二廠 - 新豐廠 (五廠)

• Kinsus USA - Santa Clara / California -

• 統碩科技 蘇州 / 中國 -

• 百碩電腦 蘇州 / 中國 -

• 晶碩光學 桃園 / 台灣

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Basic Information

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• Established in September 2000 IPO at TWSE in November 2004

• Capital : US$ 146 Million (NT$ 4.512 Billion)

• Campus : Headquarters IC substrates

• Xin Wu / Taiwan

• Plant I & II

• Xing-Feng plant (Plant V)

Kinsus USA Kinsus China Piotek PegaVision

• Santa Clara / California - Suzhou / China

• Suzhou / China - Taoyuan / Taiwan

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位置

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美國子公司

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Kinsus Suzhou (統碩) ㇐廠 Piotek (百碩)

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二廠 五廠(新豐廠) 晶碩光學

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Locations

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Kinsus Suzhou (統碩) Piotek (百碩)

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Kinsus USA

Taiwan plant I Taiwan plant II Taiwan plant V (Xing-Feng plant) Fu-Yang Technology PegaVision

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每月營業額

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Monthly Revenue

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產品組合

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Product mix

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Thank you

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