KINSUS — Investor Presentation 2017

Dec 15, 2017

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景碩科技股份有限公司
Kinsus Interconnect Technology Co.
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2017 Nov

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IC 封裝技術 IC Packaging Technology

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電子產品構裝的各個層次
最終組裝與測試
軟板模組
系統級組裝
硬板組裝
PCB 空板
IC 封裝
系統級封裝模組
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Levels of Assembly

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電子產品的組裝結構
系統級封裝模組
IC
被動元件 連接器
印刷電路板
IC 感應器
被動元件
軟板模組
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Components in Electronic Device Assembly
SiP (module)
IC
MLCC Connector
PCB
IC
Sensor
MLCC
FPCB module
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各種形式的 IC 封裝
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PLCC
DIP QFP TSOP
PBGA/
CSP WLP TSV
Flip-Chip BGA
QFN DFN Ceramic BGA Ceramic chip
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市場規模: 215 Billion units in 2015

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Different types of IC packaging
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PLCC
DIP QFP TSOP
PBGA/
CSP WLP TSV
Flip-Chip BGA
QFN DFN Ceramic BGA Ceramic chip
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Market size : 215 Billion units in 2015

封裝技術走向

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Packaging Technology Roadmap

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IC 結構
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What Substrate Makers do?

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IC 半導體上下游供應鏈關係
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IC 設計 IC

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專業封裝廠
封裝
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晶圓製造廠 晶圓

載板廠 載板

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IC Manufacturing Supply Chain
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IC Design (Fabless) IC OSAT Packaging Foundry Wafer

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Substrate house Substrate

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About Kinsus

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基本資料
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• 成立September 2000 上市November 2004

• 登記資本額新台幣44.6 億

• 員工數: 4,600 (2017 十一月)

• - 廠區: 總部 新屋區/ 桃園市 - 硬質載板事業部 一廠, 二廠 - 五廠 - 美國子公司 Santa Clara / California - 中國子公司 蘇州

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Basic Information
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• Established in September 2000 IPO in November 2004

• Capital : US$ 154 Million (NT$ 4.46 Billion)

• Headcounts : 4,600 as of Nov 2017

• Campus : Headquarters Rigid Substrates BU Kinsus USA Kinsus China

• Xin Wu / Taoyuan

• Plant I, Plant II

• Plant V

• Santa Clara / California

• Suzhou

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位置
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美國子公司

Kinsus Suzhou (統碩) 一廠 Piotek (百碩) 二廠A&B 五廠，六廠 景碩自有廠房辦公室 業務代表 / 代理

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Locations
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Kinsus Suzhou (統碩) Piotek (百碩) Kinsus owned facility Service representative

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Kinsus USA

Taiwan plant I Taiwan plant II-A & B Taiwan plant V, VI

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硬質載板產品
Desk Top, Server, Switch,
PCMCIA cards, Set-Top Box,
notebook, Home Game,
video cameras CPU / BUS boards
Conventional EBGA
Fine Pitch Laser EBGA
PBGA Cavity Down
FC CSP Thin CSP
Flip Chip CSP
Digital camera,
FC High IOs Chip Array
Cellular,
wireless,
MP3 Player,
Module
DROM
COB SIP
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Rigid Substrate Products
Desk Top, Server, Switch,
PCMCIA cards, Set-Top Box,
notebook, Home Game,
video cameras CPU / BUS boards
Conventional EBGA
Fine Pitch Laser EBGA
PBGA Cavity Down
FC CSP Thin CSP
Flip Chip CSP
Digital camera,
FC High IOs Chip Array
Cellular,
wireless,
MP3 Player,
Module
DROM
COB SIP
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軟質載板產品
TAB
SIM
DS
cards
COF
SS
Ink COF
Jet
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Flexible Substrate Products
TAB
SIM
DS
cards
COF
SS
Ink COF
Jet
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每月營業額
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單位: 新台幣百萬元

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Monthly Revenue
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Unit : Million NT$

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營業額分佈

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Revenue - Application

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Thank You!