SGS

TWSE STOCK CODE 1560

EST.1953

KINIK

Investor meeting

@ UBS Asian Invest Conference

27 May 2026

Investor service mail:

[email protected]

WWW.KINIK.COM.TW

KINIK

Disclaimers

The prospective statements released or mentioned in this presentation are based on our company's data as well as the current situation.
The forward-looking statements contained in this presentation are affected by risks, uncertainties, and people's inferences. As a result, actual results may differ materially from those in the forward-looking statements. There are various factors that can affect our prospective statements, including but not limited to the increasing cost of raw materials, market demands, changes of policies or financial situations, and risks that our company cannot control.
Our statements on future outlook represent our company's views regarding the future and the data. Our company does not guarantee the accuracy of the data nor undertake any obligation to update or correct any forward-looking statements, whether as a result of new information or future events.

KINIK

Outline

Welcome
William Lee, DBU President/Spokesperson
Tony Pai, Vice President/Acting Spokesperson
Company overview
1Q26 financial results
2026 outlook
Q & A
Appendix: KINIK Visions/Missions, Products, Plants information

KINIK

Company Overview

Company established in 1953; Taiwan Stock Code 1560
Capital: 1,490 Million (NTD) (Mar. 31 2025)
Employees: ~2400 worldwide. (~1800 in Taiwan.)
2025 revenue NTD 8,149M, EPS=9.28
Main products by 3 BUs & subsidiaries, and Sales Ratio in 2025

Grinding Wheel 23%
ABU & KTC/MKS/MGT/Hongia (Machinery & Mechanical Indus..etc)

CMP Diamond Disk 31%
DBU (Semiconductor Indus.)

Reclaim & Test Si Wafer 46%
SBU (Semiconductor Indus.)

KINIK

1Q26 Consolidated Income statement

Consolidated revenue reached NTD 2.29B, up 5.6% QoQ and 29.4% YoY. Gross margin was 35.0%, up 0.8ppt QoQ; EPS was NTD 2.94.
Revenue and gross margin growth were mainly driven by QoQ growth across all three business units.
Non-operating income was NTD 87.5M in 1Q, mainly from NTD 49M investment gains and NTD 31M FX gains.

| Accounting Period Income
(all in thousands TWD except ) | 1Q26 | 4Q25 | QoQ | 1Q25 | YoY |
| --- | --- | --- | --- | --- | --- |
| Net Revenue(USD thousand) | 72,785 | 70,212 | 3.66% | 53,839 | 35.2% |
| Net Revenue | 2,293,229 | 2,171,808 | 5.6% | 1,771,627 | 29.4% |
| Gross Margin | 35.0% | 34.2% | +0.8 ppt | 30.9% | +4.1 ppt |
| Operating Expenses | (358,121) | (405,905) | -11.8% | (266,125) | 34.6% |
| Operating Margin | 19.4% | 15.5% | +3.9 ppt | 15.9% | +3.5 ppt |
| Non-Operating Items | 87,512 | 253,970 | (166,458) | 33,794 | 53,718 |
| Net Income to Shareholders of
the Parent Company | 436,359 | 479,601 | -9.0% | 285,815 | 52.7% |
| Net Profit Margin | 19.3% | 22.9% | -3.6 ppt | 16.3% | +3.0 ppt |
| EPS | 2.94 | 3.26 | -9.8% | 1.96 | 50.0% |
| ROE | 20.7% | 25.0% | -4.3% ppt | 15.8% | +5.0 ppt |
| Average Exchange Rate-USD/NTD | 31.51 | 30.93 | 1.9% | 32.91 | -4.3% |

KINIK

1Q26 Sales Performance by BUs

ABU: Grinding Wheel
DBU: CMP Pad Conditioner
SBU: Reclaim/Test Wafer
Subsidiaries: Hongia, KTC, MKS, MGT

Company-wide: 1Q revenue reached NTD 2.29B, up 5.6% QoQ and 29.4% YoY.
Grinding Wheel: Revenue grew 5.1% QoQ, driven by recovery in traditional machinery and machine tool demand.
CMP Diamond disk: Revenue increased 5.0% QoQ, supported by higher CMP diamond disk shipments for 2nm processes and U.S. IDM customers.
Wafer: Revenue rose 6.3% QoQ, driven by full utilization of 330K/month 12-inch capacity and increased shipments of high-end reclaim wafers.

Business Unit	1Q25	4Q25	1Q26	wf%	QoQ	YoY
ABU+subsidiaries (Grind Wheel)	301,323	517,119	543,555	24%	5.1%	80.4%
DBU (CMP Diamond Disk)	561,418	683,001	717,188	31%	5.0%	27.7%
SBU (Test/Reclaim Wafer)	908,888	971,688	1,032,486	45%	6.3%	13.6%
Total	1,771,630	2,171,808	2,293,229	100%	5.6%	29.4%

KINIK

1Q26 Diamond Disk Sales (1/2)

Diamond Disk Sales Ratio by Region

100%	2025 Q4	2026 Q1
■ Taiwan / Unique One	62.48%	62.78%
■ Taiwan / Others	13.39%	12.61%
■ Oversea customers	24.13%	24.61%

KINIK

1Q26 Diamond Disk Sales (2/2)

1Q26 DBU revenue: NT$ 717M, QoQ +5%.
Revenue ratio from the one specific customer's advanced technologies (sub-5nm) products and advanced packaging rose 58%; 16nm and 2nm diamond disk shipments surged 39% and 20%.

Remark: Data regards to one specific customer.

KINIK

1Q26 SBU Wafer Sales

1Q26 SBU revenue reached NTD 1,032M, up 6.3% QoQ.
Sales from 12" reclaim wafer increased 12.8%.

KINIK

Summary of Recent Key Events

KINIK has set May 12, 2026 as the capital increase record date for new shares issued from 1Q26 employee stock option exercises and convertible bond conversions:

Funds Raised: A total of 213,900 shares were exercised in Q1, raising ~ NT$27.76 million.
Paid-in Capital: Following the increase, the total paid-in capital reaches NT$1.489 billion.
The 2026 Annual General Shareholders' Meeting is scheduled for 9:00 a.m. on June 23, 2026, and will include a comprehensive re-election of the Board of Directors.

KINIK

2026 Outlook

ABU Grinding Wheel Business Unit and Subsidiaries

Expected to benefit from demand recovery and synergies from newly acquired grinding wheel subsidiaries, targeting double-digit % revenue growth vs. 2025.
Market Synergy: Leveraging group-wide marketing channels to maximize synergies and drive revenue growth.
Manufacturing Efficiency: Lowering costs through capacity, technology optimization, and unified procurement.
RD & Development: Expanding the market for high-end products, while advancing smart operation systems.

DBU CMP Diamond Disk

Strong Demand: Demand for diamond disks used in advanced processes and advanced packaging is expected to increase quarter by quarter.
Market share and shipment with U.S. IDM customers are expected to continue ramping up quarterly.
Monthly capacity reached 50K units in 1Q26, and will expand to over 60K units from 3Q26.

SBU Reclaim/Test/Specialty Wafer:

Capacity Fully Loaded & Expanding: 12-inch capacity has increased by 30K wafers/month to 360K starting 2Q, and will further expand to 400K wafers/month from 3Q.
Focus on Advanced Nodes: All newly added capacity will be dedicated to high-end reclaimed wafers for advanced node customers. Continuously optimizing the product mix toward high-end applications to boost both revenue and gross margin.

KINIK

Q & A

Thanks for your attention

KINIK’s investor relationship mail: [email protected]

KINIK

Appendix

Company Philosophy, Mission, and Vision
Introduction of KINIK Products
Plants Information
Company Milestone

KINIK

KINIK Company

Business philosophy | 經營共
Good together | 合好
Good to You, Me, All | 你好，我好，大家好

使命 | Mission
Keep creating innovative values for industries and customers.

精益求精為產業與客戶創新價值

Vision | 願景 | 成為研磨解決方案的卓越智造與服務中心

Become an excellent and intelligent smart manufacturing and service center for grinding solutions.

KINIK

History, Now, and Future of KINIK

Core Technology “Grinding”

KINK

Major Product and Business Diagram

Customer Industries
Semiconductor/Electronics/Optical...
Machinery/Mechanical...

Major Products
- Test Wafer
- Reclaim wafer

CMP Disk
Diamond Tool
Si/SiC Wheel

Grinding Wheel
- Diamond Wheel
- CBN Wheel

Resin Wheel
- Plating Wheel

Business Unit & Subsidiary
SBU (Semicon.)
DBU (Diamond)
ABU (Abrasive)
KTC (Thailand)
Hongia (Taiwan)

KINIK Group

KINIK COMPANY

中砂公司 TWSE STOCK CODE 1560

EST.1953

KINIK

中砂產品介紹

Products Introduction

SGS

KINIK

KINIK's products in Semiconductor Industries

In 2025, revenue from semiconductor industries was ~6.6 billion (80% of total Kinik’s revenue)

KINIK

測試&再生晶圓 Test/Reclaim Wafer

What is test and reclaim wafer?

The source of the reclaimed wafers comes from the monitor wafers and the dummy wafers but not the defect wafers manufactured by the semiconductor fab. The services we provide to refurbish these reclaimed wafers can dramatically lower the running cost of a semiconductor manufacturer.

The reclaimed wafers can be categorized according to functions as figure 1 and the reclamation system is shown as figure 2.

Figure 1 - The classification of the wafer application

Figure 2 - The reclamation system for the reclaimed wafer

KINIK

測試&再生晶圓 Test/Reclaim Wafer

中砂的再生晶圓之製程特色以延性輪磨(Ductile Mode Grinding)加工取代傳統研磨(Lapping)加工，目的是降低加工之變質層，減少化學藥品污染，且可提高加工精度，為最先進之再生晶圓製程。

The features of the KINIK reclaimed wafers are refurbished by ductile mode grinding used to replace traditional lapping to lower the strained thickness on the surface and chemical contamination. The ductile mode grinding is the leading-edge process for the high precious reclaimed wafers.

KINIK

CMP鑽石碟 Diamond Disk

CMP (Chemical Mechanical Polish) 化學機械拋光，主要用於先進IC製程中，透過拋光墊與拋光液同時透過機械與化學反應加工晶圓表面，達到表面晶圓材料的移除及整體的平坦化，才能接續後續製程以及提高良率，進而能循摩爾定律持續微縮IC線寬面積，推展出N5/N3/N2先進製程。而鑽石碟的功用就是在拋光晶圓的同時去加工拋光墊，以移除拋光時的副產物及穩定拋光速率並提升良率及延長拋光墊使用壽命，是先進IC拋光製程中提升良率及控制成本中非常重要的一環。

CMP (Chemical Mechanical Polish) is widely used for advanced IC manufacturing processes for surface material removal, smoothing surfaces, and planarization by the polish pad (mechanical) and the abrasive slurry (chemical reaction). And the diamond disk (aka pad conditioner)'s function is to in-situ dress the polish pad during the process to remove the polish byproduct, to maintain a stable pad roughness and remove rate, to improve yield, and to prolong the lifetime of the pad.

Source: VLSI-Expert

KINIK

Increasing Trend of Advanced IC CMP Layer Numbers

& Kinik's Diamond Disk Share

Global CMP Diamond Disk Market Size and Kinik's Market Share Trends (2020-2026) Source: SEMI, QY Research, and Kinik internal financial data and estimates; compiled by Kinik.

KINIK

CMP鑽石碟 Diamond Disk

中砂鑽石碟用於半導體化學機械研磨製程中修整研磨墊以達到理想移除率及平坦度。

KINIK diamond disk is used on semi-conductor CMP process in order to make the pad reach the desirable removal rate and uniformity.

Conventional Disk

DiaGrid®

I-DiaGrid®

S-DiaGrid®

Advanced Disk : High Performance / Long Life Time

Pyradia®

EDP Disk

CVD -WAVE

equaDia

(Metal Free)

KINIK

EDP Disk for Metal Free Solution

Diamond disk protected with EDP film for metal-free requested in advanced IC technologies.

> EDP Film is Epoxy. It is acid and alkali resistant, and effectively prevent from precipitation of metal ions during the manufacturing process.
> Both sides of a disk can be coated for better protection.

KINIK

equaDia Disk® 鑄石碟

Advanced disk “equaDia” for excellence tip height leveling and longer lifetime.

> Conventional Disk dressed a pad with the high points of the diamond. equaDia disk has good diamond leveling, and each diamond works. CR decay of equaDia disk is much slower.

CR decay rate	100p	200p	300p	500p
Conventional Disk	56%	77%	-	-
equaDia disk	25%	-	54%	58%
	equaDia P800	equaDia P1000	equaDia P1200	equaDia P1500
---	---	---	---	---
SEM
Appearance	Full face	Full face	Full face	Full face
Diamond Size (μm)	100	100	100	100
Diamond pitch (μm)	800	1000	1200	1500
Diamond Bonded (%)	55%	53%	56%	51%
Leveling (μm)	6.9	7.2	7.6	6.7
total diamond count (ex)	11600	7450	5200	2250

KINIK

Metal-free O-Pyradia® 鑄石碟

O-Pyradia CMP pad conditioner for advanced customer's tightened metal contamination control.

Pyradia Type	O-Pyradia	Pyradia
Photo
Material of Substrate	Polymer	Metal
Bonding Material	Polymer	LM(Ni ; Cr powder)
Bonding Strength	+	++
Process Temp	<100 degree	~1000 degree
Diamond Strength	++	+
Acid and alkali resistant	Metal Free	Ni ; Cr

KINIK

Semiconductor Grinding Wheel

The Wafer grinding wheels are used in the in-feed grinding process of semiconductor wafers such as Si, SiC, and advanced 2.5D/3D package (Cu/compound...etc.). The in-feed grinding process consists of rough and fine grinding processes. Wafer grinding wheels are made of diamond abrasives and customized vitrified or resin bond in a unique porous microstructure. The diamond size for rough and finish grinding processes are #325~#1000 and #2000~#8000 respectively. The features of these wafer grinding wheels are stable high removal rate, long lifetime and lower grinding resistance.

Wafer Grinding Wheels

KINIK RD 15.0kV 5.5mm X5.00k SE 04/23/2019 10.0μm

Porous microstructure

KINIK

Diamond Roller

The diamond rollers are used to sophisticatedly dress the complex and high precision form of grinding wheels (e.g. Al2O3, SiC, cBN wheels) for automatic shaping high volume production of high precision transmission components such as ball screws, guides, bearings, gears, tools, automotive and aerospace parts etc..

Diamond rollers are mainly made by reverse-plated or infiltration methods using natural, synthetic diamond grits or CVD diamond either randomly or regularly distributed. The features of the diamond rollers are high profile accuracy and high dressing efficiency. We can supply proper diamond rollers for grinders in various applications in accordance with customers need.

Diamond roller for dressing profile grinding wheel of ball screw

KINIK

Tools for Semiconductor & photoelectric

中砂以最新電鑄、成型與燒結技術製造成的精密鑽石切割刀。搭配特殊的金屬與樹脂等結合劑，使切割軟刀具備高剛性、低磨耗且具備良好的自銳性；適合在各類精密陶瓷、硬脆材料、磁性材料，光學玻璃，印刷電路板與半導體封裝材料的切割應用。

KINIK Company announces the introduction of Super Hubless Dicing Blade with resin, metal and nickel matrices. The dicing blades are manufactured by specialty consolidation, sintering and electro-forming process that improve the uniformity of the thin blades. They are suitable for cutting ceramics, brittle materials, optical glass, printed circuit boards, especially for semiconductor packaging.

KINIK

Tools for Semiconductor & photoelectric

多孔質陶瓷真空吸盤

Porous Ceramic Chuck Table

多孔質陶瓷孔洞均勻微細、不發塵、可具靜電消散特性，應用於真空吸盤具備吸力均勻、局部吸附性、不產生印痕、工作效率及精度高等優點，可充分應用於半導體研磨、清洗、切割及檢測等設備。

High-performance, High-precision, Uniform suction force.
Partial chucking without sagging.
Chucking and transport of wafer without leaving suction marks.
Produces no static electricity and dust.

Application :

Wafer grinder, cleaning/dicing machine and measuring equipment, etc.

KINIK

金屬精密加工刀具

Ultra Precision Machining Tools

中砂提供電子業、PCB板、木工業及金屬加工業所需的單晶（SCD）、聚晶鑽（PCD）、立方氮化硼（PcBN）等鑽石刀具已逾20年。

近年積極投入生產高精度、更微小之SCD、PCD 及 PcBN產品供光學業、精密模具等加工技術使用，如：單晶鑽石車刀與銑刀、PcBN微小徑銑刀等。

KINIK company already has more than 20-year experience in providing all kinds of diamond tools for the applications of PCB, woodworking and metal working industries.

Recently, KINIK also developed several kinds of SCD, PCD and PcBN precision micro tools to meet high-end market's requirements.

加工面達到極高的光潔度表現。

High finish at processing parts.

KINIK

傳統砂輪及鑽石/CBN砂輪

Traditional Grinding Wheel & Diamond / CBN Grinding Wheel

中砂提供各式平面、內外圓、無心及雙平面等工件研磨及切斷用的傳統、BD及電鑄砂輪。

主要產業應用包含精密機械業的滑軌及齒輪研磨與砂輪成形修整用的鑽石滾輪、鋼鐵業的輥筒研磨、工具製造業的高速鋼鑽頭、CNC及PCD/PcBN刀具等研磨、半導體業的晶圓減薄及倒角研磨、高效率硬脆材料如SiC研磨用的蜂巢砂輪、光學模具模仁拋光等。

KINIK provides various grinding wheels for surface, internal & cylindrical, centerless and disc surface grinding and cutting of workpiece production. The main industrial applications include linear guideway, gear grinding and diamond roller for dressing wheel in precision machinery, steel roll grinding, HSS drill, CNC & PCD/PcBN tool grinding, wafer thinning and edge grinding in semiconductor, honeycomb wheel for high-efficient grinding of hard and brittle materials such as SiC, optical mold polishing etc.

KINIK

傳統砂輪及鑽石/CBN砂輪

Traditional Grinding Wheel & Diamond / CBN Grinding Wheel

平面研磨
Surface Grinding

外圓研磨
Cylindrical Grinding

輥筒研磨
Roll Grinding

滑軌成形研磨
Linear Guideway Grinding

雙平面研磨
Disc Surface Grinding

齒輪研磨
Gear Grinding

KINIK

傳統砂輪及鑽石/CBN砂輪

Traditional Grinding Wheel & Diamond / CBN Grinding Wheel

光學模仁拋光
Optical Mold Polishing

內圓研磨
Internal Grinding

CNC刀具研磨
CNC Tools Grinding

蜂巢砂輪
Diamond & CBN Honey Comb Wheel

PCD刀具研磨
PCD Cutting Tools Grinding

KINIK

傳統砂輪及鑽石/CBN砂輪

Traditional Grinding Wheel & Diamond / CBN Grinding Wheel

電錶砂輪
Electroplated Diamond & CBN Wheels and Products

各式切斷及可彎曲、碟式砂輪
Cut-off, Depressed & Flexible Wheels, and Flap Disc

鑽石滾輪
Diamond Roller

砂輪動平衡校正儀
Grinder Balancer

KINIK COMPANY

中砂公司 TWSE STOCK CODE 1560

殿區 Plant Information

Manufacturing Plants: Taiwan x5; Thailand x2. Japan x1
Grind Wheel: ABU(Yingge), Hongia( Hsinchu), KTC Thailand, MGT Thailand, MKS Japan
Diamond Disk: DBU (Yingge & Shulin, Taiwan))
Reclaim Wafer: SBU (Zhubei & Zhunan, Taiwan)

中砂產品研測生產基地

Manufacturing Bases of KINIK Grinding Wheels in Asia

MKS

2025年4月1日，中砂正式擁有台灣、日本、泰國共五座砂輪廠，整合技術改良品牌，擴大日本與東南亞市場版面，強化砂廠領域競爭力，服務更多客戶！

On April 1, 2025, KINIK officially own five grinding wheel factories across Taiwan, Japan, and Thailand, integrating technology and product lines to expand market in Japan and Southeast Asia, strengthen industry competitiveness, and serve more customers!

KINIK

廠區 Plant Information

總公司 Head Office

鷺歌廠區 Yingge Factory

239010 新北市鷺歌區中山路64號

No.64, Zhongshan Rd., Yingge Dist.,

New Taipei City 239010, Taiwan

TEL:+886 2 2679-1931~40

Grinding Wheel, Diamond Disk, Dicing Blade

樹林廠區 Shulin Factory

238010 新北市樹林區中山路2段151巷16號

No.16, Ln. 151, Sec. 2, Zhongshan Rd.,

Shulin Dist., New Taipei City 238010, Taiwan

TEL:+886 2 8684-4111~13

Diamond Disk & Wafer Grinding Wheels

新竹廠區 Hsinchu Factory

303035 新竹縣湖口鄉新竹工業區文化路6號

No.6, Wenhua Rd., Hukou, Hsinchu Ind.

Park, Hsinchu County 303035, Taiwan

TEL:+886 3 598-4990

Electroplating Diamond & CBN Wheels

KINIK

廠區 Plant Information

竹北廠區 Zhubei Factory
302059 新竹縣竹北市十興路260號
No.260, Shixing Rd., Zhubei City, Hsinchu County 302059, Taiwan
TEL:+886 3 550-7160~5

竹科廠區 Hsinchu Science Park Factory
350401 苗栗縣竹南鎮科北五路6號
No. 6, Kebei 5th Rd., Jhunan Township, Miaoli County 350401, Taiwan
TEL:+886 3 550-7160

Reclaim & Test Wafer
再生晶圓 & 測試晶圓

KINIK

廠區 Plant Information

湖記工業股份有限公司

Hongia Industry Co, Ltd.

239008 新北市鶯歌區余厝巷2號

No. 2, Yucho Lane, Yingge Dist.,

New Taipei City 239008, Taiwan

TEL: +886 2 2679-1006

Email: [email protected]

www.hongia.com.tw

金力泰國有限公司

Kinik - Thai Co., Ltd.

225 Moo 7, Khok Pip, Simahosot,

Prachinburi 25190 Thailand

TEL: +663 727 6954

Email: [email protected]

www.kinikthai.co.th

Electroplated Diamond Wheel 電鑄砂輪

Resin and Ceramic Wheel 樹脂砂輪&陶瓷砂輪

KINIK

Acquired MKS (Japan) & MGT (Thailand) as subsidiaries on April 2025

中砂KINIK集團創業72周年慶

歡喜迎接新紀元

日本MKS及泰國MGT公司正式加入，開創全球發展新篇章

活動日期：2025/04/01
出刊日期：2025/04/01

2025年4月1日，是中砂KINIK集團歡慶創業72周年的日子，同時也是集團迎來重要的里程碑——原在日本三井倉庫鐵業集團旗下的日本MKS公司和泰國的MGT公司正式加入KINIK集團邁向全球化發展的新階段。

今天舉辦的正式收購交割及更名揭牌儀式標誌著 KINIK 集團在精密研磨與半導體材料研磨領域的全球體驗，並開啟了集團進一步提升技術創新和市場競爭力的嶄新篇章。

MKS、MGT新名創新局

自2025年4月1日起，MKS公司正式更名為マックスキニック精密株式会社(英文名稱:Max Kinik Seimitsu Co., Ltd.), MGT公司更名為Max Kinik Grinding Technology Co., Ltd.。

此次更名由KINIK集團股東提出，新名稱中的"Max"代表規模最大化，"Kinik"承載著KINIK集團在研磨領域的專業精神，象徵著公司將專注於最大化其潛力及市場影響力。而"Seimitsu"及"Grinding Technology"則代表對精密加工技術的極致追求。MKS替MGT社長坂井正博表示：「今天是我們公司歷史中的一個重要時刻，作為KINIK集團的一員，我們將繼承百年來積累的技術實力與市場聲譽，並結合KINIK集團的全球資源，共同創造更多的發展機會。」

強化全球市場競爭力

此次MKS和MGT加入KINIK集團，不僅是KINIK集團對這兩家公司的肯定，更是集團邁向全球市場的重要步伐。

KINIK集團林伯全董事長表示：「今天，MKS和MGT正式成為KINIK集團的一員，這不僅是KINIK集團對兩家公司過去努力的肯定，更是大家一起面對未來挑戰的新起點。我們將繼續傳承三井研創的卓越技術，並結合KINIK集團的資源，推動全球市場的拓展，不斷創新、挑戰行業的更高標準。」

跨越百年，凝聚力量創新發展，攜手磨出共好大未來

KINIK集團謝榮哲執行長在數碼中指出：「砂輪產品雖然看似不超眼，但其在汽車、航空、機械加工及半導體等關鍵領域扮演著至關重要的角色。隨著MKS和MGT的加入，KINIK集團在台灣、泰國、日本設有生產基地、在該三國及中國大陸設有營業單位，產品行銷全球五十多個國家，集團內公司將發揮彼此的技術優勢，提升品牌影響力，開創新的成長契機。」

謝執行長表示：「新公司名稱的揭牌象徵著新時代的開始。我們希望在擁有百年歷史的『MKS』優秀傳統基礎上，與各位共同發揮相互的優勢，建立互信關係，攜手邁向更美好的未來。今後，我們一起努力磨出共好大未來。」

共好：你好、我好、大家好！讓我們攜手磨出共好大未來！

KINK

榮耀記事 Milestone

2021年11月榮獲行政院「第26屆國家品質獎全面卓越類－績優經營獎」。

Nov. 2021, Honored with “BUSINESS MERIT AWARD of Total BUSINESS EXCELLENCE” at the 26th NATIONAL QUALITY AWARD from the Executive Yuan, R.O.C. https://nqa.cpc.tw/NQA/Web/Awards26th_Content.aspx?p=f2b6e812-92aa-49c3-8149-1e005a0fe706

資!中國砂輪公司榮獲「第26屆國家品質獎」

中國砂輪公司榮獲「第26屆國家品質獎」，林伯全董事長受邀曾見總統

近東部、林金鯉市場(台)：中國砂輪公司、林伯全董事長(市)→第一近東部工業發達商。

中國砂輪公司董事長、林伯全(商)：通過《榮耀記》全「第一通過獎項表」

KINIK

榮耀記事 Milestone

2021年10月榮獲經濟部「2022年第30屆台灣精品獎 - 12吋再生晶圓」。

Oct. 2021, Honored with “Taiwan Excellence Award - 12" Reclaimed Wafers” from the MOEA, R.O.C. https://www.taiwanexcellence.org/tw/award/product/1110433

TAIWAN EXCELLENCE

得獎產品：12 inches Reclaim Wafer

KINIK

桀爛記事 Milestone

榮獲經濟部第四屆卓越中堅企業獎
Honored with 4th Taiwan mittelstand Award from the MOEA, R.O.C, in 2017.

榮獲經濟部2013年第14屆
工業精銳獎機械、運輸工業類
Honored with 14th Industrial Sustainable
Excellence Award from the MOEA, R.O.C, in 2013.

TOP 100
TAIWAN BRANDS

榮獲經濟部台灣百大品牌獎
Honored with the Top 100 Taiwan Brands Award
from the MOEA, R.O.C, in 2011.

KINIK

桀爰記事 Milestone

榮獲經濟部2006年台灣優良品牌獎
Honored with the Taiwan Superior Brand Award from the MOEA, R.O.C, in 2006.

榮獲第十屆經濟部產業科技發展傑出獎
Award of Excellence, the 10th R.O.C. MOEA Industrial Technology Advancement Award in 2002.

全國第一家砂輪公司榮獲國家傑出精品獎
The first grinding wheel plant won Excellent Product Award in 1993.

AI assistant

KINIK — Investor Presentation 2026

51865_rns_2026-05-27_18b11026-80fb-47df-89c0-9a613aca94a3.pdf

KINIK

Disclaimers

Outline

Company Overview

1Q26 Consolidated Income statement

1Q26 Sales Performance by BUs

Diamond Disk Sales Ratio by Region

1Q26 Diamond Disk Sales (2/2)

1Q26 SBU Wafer Sales

Summary of Recent Key Events

2026 Outlook

ABU Grinding Wheel Business Unit and Subsidiaries

DBU CMP Diamond Disk

SBU Reclaim/Test/Specialty Wafer:

Q & A

Appendix

Major Product and Business Diagram

KINIK

中砂產品介紹

Products Introduction

What is test and reclaim wafer?

測試&再生晶圓 Test/Reclaim Wafer

CMP鑽石碟 Diamond Disk

& Kinik's Diamond Disk Share

Conventional Disk

Advanced Disk : High Performance / Long Life Time

Metal-free O-Pyradia® 鑄石碟

Semiconductor Grinding Wheel

Diamond Roller

多孔質陶瓷真空吸盤

Porous Ceramic Chuck Table

Application :

金屬精密加工刀具

Ultra Precision Machining Tools

傳統砂輪及鑽石/CBN砂輪

傳統砂輪及鑽石/CBN砂輪

傳統砂輪及鑽石/CBN砂輪

Traditional Grinding Wheel & Diamond / CBN Grinding Wheel

殿區 Plant Information

廠區 Plant Information

湖記工業股份有限公司

金力泰國有限公司

中砂KINIK集團創業72周年慶

歡喜迎接新紀元

MKS、MGT新名創新局

強化全球市場競爭力

跨越百年，凝聚力量創新發展，攜手磨出共好大未來

榮耀記事 Milestone

榮耀記事 Milestone

TAIWAN EXCELLENCE

More from KINIK

KINIK Investor Presentation 2026