IZMO Limited — Capital/Financing Update 2026

Apr 1, 2026

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April 01, 2026

April 01, 2026
The Manager Corporate Relationship Department Bombay Stock Exchange Limited Floor 25, Phiroze Jeejeebhoy Tower DalalStreet,Mumbai-400001	The Manager – Listing Department National Stock Exchange of India Limited Exchange Plaza, 5th Floor Plot No. C/1, G Block, Bandra Kurla Complex, Bandra(E),Mumbai-400051
BSE Scrip Code: 532341	NSE Symbol: IZMO

Subject: Press Release

Dear Sir/Madam,

Pursuant to the applicable regulations of SEBI (Listing Obligations and Disclosure Requirements) Regulation 2015, we are enclosing Press Release “ izmomicro Builds Ongoing Defence Electronics Supply Business in Advanced Semiconductor Packaging” . The press release is self-explanatory.

The above information shall also be made available on the Company’s website www.izmoltd.com

Kindly take the same on record and acknowledge.

Yours faithfully, For IZMO Limited

Digitally signed by VARUN KUMAR VARUN KUMAR SRIDHARA SRIDHARA ADGUR ADGUR Date: 2026.04.01 09:26:02 +05'30'

Varun Kumar A S

Company Secretary and Compliance Officer

Encl: As Above

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BUSINESS UPDATE RELEASE

izmomicro Builds Ongoing Defence Electronics Supply Business in Advanced Semiconductor Packaging

Expands Ongoing Supply of Advanced Semiconductor Packaging Solutions to India’s Defence Electronics Sector

BENGALURU, INDIA — April 01, 2026 — izmomicro (izmo Microsystems Pvt. Ltd.), the advanced semiconductor packaging subsidiary of NSE/BSE-listed izmo Limited, today announced the ongoing supply of advanced semiconductor packaging solutions to India’s defence electronics sector, marking a significant expansion of its business in high-reliability, mission-critical applications.

The company is currently supplying advanced packaging technologies for defence electronics programs in two highly specialized areas: high-frequency RF module packaging, and radar receiver module assembly and packaging . These are not limited to technology development activities, but form part of izmomicro’s active supply engagement with India’s defence electronics value chain.

In the area of high-frequency RF module packaging , izmomicro supplies advanced packaging solutions for RF integrated circuits and front-end module assemblies operating at microwave and millimeter-wave frequencies, where package design directly affects electrical performance. The company’s work includes precision QFN (Quad Flat No-Lead) packaging for high-frequency devices, custom hermetic and semi-hermetic enclosures for RF module assemblies, and multi-chip integration of RF, analogue, and digital components within compact package designs.

These solutions are supplied for demanding defence applications where signal integrity, thermal performance, electromagnetic compatibility, and long-term reliability are essential across airborne, shipborne, and ground-based systems.

izmomicro is also engaged in the ongoing assembly, packaging, and supply of radar receiver module subsystems used in sophisticated radar signal chains. These assemblies are responsible for receiving, amplifying, filtering, and digitizing returned radar signals. The company’s contribution spans important elements of the receiver path, including low-noise amplification, analogue-to-digital conversion, and integration with digital processing components.

In such systems, advanced packaging is a core enabler of performance, stability, and operational reliability . This is especially important in airborne radar environments, where electronic assemblies must perform consistently under conditions of severe mechanical shock, vibration, and wide temperature variation.

The global defence electronics market is valued at more than US$130 billion and continues to grow as nations invest in next-generation radar, communications, sensing, and electronic warfare systems. In India, rising defence modernization and domestic development programs are increasing demand for indigenous suppliers with advanced electronics packaging and subsystem integration capabilities.

For izmomicro, this represents a meaningful and ongoing business opportunity in one of the most technically demanding segments of the electronics industry. By supplying advanced semiconductor packaging solutions for defence applications, the company is extending its packaging expertise into a sector where reliability, precision, and execution capability are critical.

“Advanced packaging for defence electronics is a specialized supply business that requires proven engineering capability, process control, and reliability standards. At izmomicro, we have built these competencies and are today actively supplying packaging solutions for defence electronics applications in India. This is an important business area for us and one that aligns strongly with India’s push for self-reliance in strategically important technologies,” said Dinanath Soni , Executive Director of izmo Microsystems Pvt. Ltd.

About izmomicro

izmomicro (izmo Microsystems Pvt. Ltd.) is the advanced semiconductor packaging subsidiary of IZMO Limited (NSE: IZMO | BSE: IZMO), Bengaluru, India. The company provides services in System-in-Package (SiP), IC packaging, silicon photonics, RF and microwave assembly, co-packaged optics, and high-reliability packaging. izmomicro operates a Class 1000 cleanroom facility in Whitefield, Bengaluru, and has offices in San Francisco, USA, and Cologne, Germany.

For more information, please contact:

For more information, please contact:
Media Contact izmomicro Communications Email:info@izmomicro.com	Investor Contact Ms. Savli Mangle / Mr. Rahul Trivedi Adfactors PR Email: savli.mangle@adfactorspr.com rahul.trivedi@adfactorspr.com www.adfactorspr.com

NSE: IZMO | www.izmoltd.com

Caution Concerning Forward- Looking Statements: Certain statements in this document may be forward-looking statements. Such forward-looking statements are subject to certain risks and uncertainties like regulatory changes, local political or economic developments, and many other factors that could cause our actual results to differ materially from those contemplated by the relevant forward-looking statements. Further, past performance is not necessarily indicative of future results. Given these risks, uncertainties and other risk factors, viewers are cautioned not to place undue reliance on these forward-looking statements. The Company will not be in any way responsible for any action taken based on such statements and undertakes no obligation to publicly update these forward-looking statements to reflect subsequent events or circumstances.