IZMO Limited — Capital/Financing Update 2024

Sep 10, 2024

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September 10, 2024

The Manager The Manager – Listing Department Corporate Relationship Department National Stock Exchange of India Limited Bombay Stock Exchange Limited Exchange Plaza, 5th Floor Floor 25, Phiroze Jeejeebhoy Tower Plot No. C/1, G Block, Dalal Street, Mumbai-400001 Bandra Kurla Complex, Bandra(E), Mumbai-400051 BSE Scrip Code : 532341 NSE Symbol: IZMO

Subject: Business Update Release.

Dear Sir/Madam,

Pursuant to the applicable regulations of SEBI (Listing Obligations and Disclosure Requirements) Regulation 2015, we are sending herewith the copy of Business Update Release titled “ izmo Ltd. Launches izmo Micro: India’s Leading System-in-Package (SiP) Manufacturing Facility, Now Operational in Bangalore” . The Business release is self-explanatory.

The above information shall also be made available on the Company’s website www.izmoltd.com.

Kindly take the same on record and acknowledge.

Yours faithfully,

For IZMO Limited

SONA Digitally signed by SONAL JAJU Date: L JAJU 2024.09.10 16:31:24 +05'30'

Sonal Jaju

Company Secretary and Compliance Officer

Encl: As Above

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BUSINESS UPDATE RELEASE

izmo Ltd. Launches izmo Micro: India’s Leading System-in-Package (SiP) Manufacturing Facility, Now Opera�onal in Bangalore

Bangalore, India – September 10[th] , 2024 – izmo Ltd., a global leader in automo�ve so�ware solu�ons, proudly announces the launch of izmo microsystems (www.izmomicro.com), a subsidiary focused on cu�ng-edge semiconductor packaging and manufacturing.

This new venture marks the establishment of a state-of-the-art, System-in-Package (SiP) manufacturing facility in Bangalore, solidifying India’s role in the global semiconductor supply chain.

The izmomicro facility will offer fully integrated SiP solu�ons that cater to high-density, highperformance systems across mul�ple industries. With a focus on innova�on, miniaturiza�on, and performance, izmomicro’s SiP solu�ons are poised to meet the growing demand for compact, efficient, and high-performance electronic devices in sectors such as consumer electronics, automo�ve, telecommunica�ons, and green energy. This development marks a milestone in our role in India’s rapidly growing semiconductor industry.

IC Packaging and SiP Solu�ons

izmomicro provides a comprehensive range of services, including:

• Custom SiP & IC Packaging for complex assemblies

• High-reliability components and RF/MW packaging solu�ons

• Co-packaged op�cs and EV/green energy power modules

• Advanced system design and manufacturing capabili�es

• State-of-the-art facili�es featuring a Class 1000 Clean Room, 3D die stacking, and finepitch wire bonding

This is a unique facility, integra�ng design and manufacturing processes under one roof. The setup enables izmomicro to accelerate �me-to-market for its clients, giving them a compe��ve edge in a market where speed and efficiency are cri�cal.

Suppor�ng India’s “Make in India” Ini�a�ve

izmomicro’s launch aligns with the Indian government's "Make in India" ini�a�ve, reinforcing India’s capabili�es in semiconductor manufacturing. As one of the first companies to offer endto-end SiP solu�ons, izmomicro is set to play a crucial role in India’s semiconductor revolu�on.

Mee�ng Industry Demand for Miniaturiza�on and Performance

izmomicro’s solu�ons are designed to address some of the industry's biggest challenges:

• Time to market: SiP technology offers an alterna�ve to custom ASICs, enabling miniaturiza�on without compromising on design integrity.

• Cost efficiency: Local manufacturing in India provides cost savings through Just-in-Time (JIT) delivery and reduced logis�cs expenses.

• Integrated solu�ons: izmo micro’s fully integrated SiP facility provides a seamless transi�on from design to manufacturing, offering clients greater control over their products’ development and produc�on.

Market Opportunity

With the global SiP market expected to grow from $16 billion in 2020 to $29 billion by 2026, izmo micro is well-posi�oned to lead this sector's growth in India. The company is proud to offer advanced packaging capabili�es that are in high demand globally, while contribu�ng to the growth of the local economy and India’s posi�on in the global semiconductor supply chain.

For further informa�on, please contact:

	Marcomm Department		Ms. Savli Mangle / Mr. Rahul Trivedi
	izmo LimitedEmail: marcomm@izmocars.com www.izmoltd.com		Adfactors PR
			Email:savli.mangle@adfactorspr.com/
			rahul.trivedi@adfactorspr.com
			www.adfactorspr.com

Cau�on Concerning Forward- Looking Statements: Certain statements in this document may be forward-looking statements. Such forward-looking statements are subject to certain risks and uncertain�es like regulatory changes, local poli�cal or economic developments, and many other factor s that could cause our actual results to differ materially from those contemplated by the relevant forward-looking statements. Further, past performance is not

necessarily indica�ve of future results. Given these risks, uncertain�es and other risk factors, viewers are cau�oned not to place undue reliance on these forward-looking statements. The Company will not be in any way responsible for any ac�on taken based on such statements and undertakes no obliga�on to publicly update these forward-looking statements to reflect subsequent events or circumstances.