INX — Investor Presentation 2025

Aug 1, 2025

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群創光電 2025年下半年法人說明會 2025年8月1日

免責聲明

• 群創光電股份有限公司對於現狀期待與預測的陳述是前瞻性的 陳述，實際的結果可能因為已知或未知之風險、不確定性及其 他之因素，而與前瞻性陳述所包含或暗示的內容有明顯出入。 這些前瞻性陳述並不是群創光電對未來履行的保證，因此您不 應依賴此前瞻性陳述。除非法律有所要求，否則群創光電不負 責更新、更正任何前瞻性陳述，不論日後有發生新資訊、事件 等。

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會議議程

市場概況 1 公司營運策略 2 財務報表摘要 3 Q&A 4

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重點摘要

經營方針

1. 調適法規與市場波動影響

2. 關稅議題– 與客戶密切合作

3. • 新台幣匯率走強– 多元化產品別及增加高附加價值產品

2. 穩步邁向轉型

• 持續擴大高利潤產品佔比

• 發展半導體業務及掌握AI契機

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市況摘要

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TV Notebook
•
16:10 NB: market share continues
•
Size Growth: 2025 Global LCD TV
to grow in 2025 with to reach 53%
expected average size growth 0.7”
in 2025
YoY
•
AI PC: market share to reach 22%
•
Balanced Capacity: Ultra large-
in 2025
size (>85”) TV shipment grows
•
Enhanced spec: Commercial and AI
38% YoY and help digest existing
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• Balanced Capacity: Ultra largesize (>85”) TV shipment grows 38% YoY and help digest existing capacity

• Enhanced spec: Commercial and AI PC emphasize light weight, low power consumption and better duration

Non commodity (Industrial)

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• System integration: one-stop solution to embed panel and touch module

• On-Cell touch adoption in industrial product to enhance integration and cost efficiency

• Mini LED for industrial, marine and casino gaming aspect; and Micro LED for transparent application

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工業顯示市場溫和成長

Edge AI 成為工業顯示市場的重要驅動力

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推升顯示互動需求 & 內容即時辨識
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Smart Healthcare
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Smart Museum
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Smart Education
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Smart Office
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Smart Transportation
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W/W Industrial Display Shipment
Unit: M_pcs YoY%
183.0
181.3 2024 2025 (F) 2026 (F)
177.3
新興利基應用推動需求逐步上升
5.4%
2.2% 1.3%
0.9%
3.6%
0.6%
0.5% 0.4% 0.2% 0.3%
66.2
62.0 62.8
市場飽和
成長趨緩
18.4 18.5 18.6
8.7 8.8 9.0 12.3 12.3 12.4
Smart home&Office Industrial Transportation Retail Health care
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Source: Omdia, INX Marketing

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Innolux Micro LED 發展計劃

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Transparent Display
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High Brightness Display (HUDs)
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1 2 3 4

會議議程

市場概況 公司營運策略 財務報表摘要 Q&A

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創造股東價值的長期策略

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Profit
Margin
Increasing
Maximize
ROE & Capital
Capacity
High-Margin Allocation Shareholder
Business Return
Return
Agile
Product Mix
Competitive Profitability
Lean Capex
Core Fabs
Optimized
Capacity
Supply Chain
Facility Management
Capacity
Convergence
Optimal
Asset
Utilization
Asset-Light
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CarUX 與Pioneer 攜手打造引領全球的智慧座艙體驗

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Key rationale and synergies
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Benefit to CarUX / customers
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Customer Landscape / Cross-Selling Opportunities

• Pioneer’s strong relationships with key Japanese OEMs complement CarUX’s existing US & EU customer portfolio

Expanded customer base and opportunity for cross-sell

• Serving global OEMs across segments, with significant cross-selling aligned to both businesses’ growth strategies

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Joint Product Development

• Strong joint product development potential, particularly in IC solutions by combining R&D resources

Enhanced technological offering and solution line-up

• Combined entity positioned as a leader with cutting-edge and comprehensive solutions for OEMs and consumers

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Vertical Integration and Procurement Synergies

• Vertical integration with CarUX display units direct supply to Pioneer for operation efficiency and potential cost savings

Optimized and cost competitive sourcing

• Significant procurement synergies by procuring overlapping materials on a larger scale from a shared supplier base

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Manufacturing Capacity

• Pioneer’s manufacturing capacity outside of the Greater China offers strategic production flexibility for global operations

• Optimize combined manufacturing capacity through integrated, reorganized production lines

Robust product quality and consistent supplying capability

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AI 推動產業革命

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非面板領域的策略發展藍圖

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 HPC/ AI IC
 High-end display
application
(ex. AR Glasses)
Micro LED
FOPLP
(Fan-out Panel Level Packaging)
As a next-generation light source
advanced IC packaging
1.Chip-First
2.RDL-First
3. TGV
AI
As a more reliable light
Enhance the speed of source to reduce heat and
optical transceiver material cost
modules
CPO
Shareholder of
(Co-Packaged Optics 矽光子), for better
computing performance and lower power
consumption
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群創定位為扇出型封裝玻璃解決方案的供應商

• TGV for AI and HPC IC

• Chip-First for PMIC and RF IC Low contact resistance, high breakdown voltage

• IC package in RF, PMIC, Audio, Automotive Radar, for shorter interconnection and cost efficiency

• RDL-First for Consumer AP

Fine pitch pattern for AI and HPC chip-let packaging

• RDL fan-out substrate provides a cost-competitive solution for chip-let applications with fine pitch patterns.

• Strip (95x240mm) or sub-panel (297x240) format delivery.

High speed for generative AI and HPC applications

• TGV process on glass substrate

• Target large-size xPU, FPGA AI and HPC applications

• Better thermal stability and mechanical stability

Ex. 77GHz Radar transceiver Chip-First for High Frequency

Ex. 650V DC/DC convertor

as a FOPLP Glass Solution Provider

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FOPLP 有助改善高階封裝的效率及成本

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FOPLP’s Larger Area Cost Savings - Wafer vs. Panels
(Area, sq.mm)
6.6x
vs. 12” Wafer Area
500,000
400,000 4.9x
3.7x
300,000
200,000
1.3x
12" Wafer 300 x 300 600 x 600
1.0x
100,000
0%
0
12" Wafer 300 x 300 510 x 510 600 x 600 620 x 750
-5%
FOPLP’s Higher Throughput
Panel 510 x 515 -10%
vs. 12” Wafer Throughput
Panel
12” Wafer -15%
300 x 300
Chip Size
-20% (sq.mm)
30x30 to 39x39
-25% 9x9 to 29x29
Reticle
< 8x8
2x 3.5x 7.5x 7.5x 7.5x
Size
-30%
Unit 28 16 6 12
35
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Source: Yole、Company Data

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1 2 3 4

會議議程

市場概況 公司營運策略 財務報表摘要 Q&A

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營運成果

領域群營收

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100%
22%
25% 24% 26% 25%
28%
80%
8%
8% 10%
14% 16%
16%
60%
40%
70%
67% 66%
60% 59%
56%
20%
0%
1Q24 2Q24 3Q24 4Q24 1Q25 2Q25
Commodity 消費性顯示器 (TV, IT, Tablet, MP) Non-commodity 商用顯示器 (commercial products)
Non-display 非顯示器領域群 (X-ray, automotive)
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領域群營收及平均毛利率

Product Type	Revenue (NT$ million)	Average GM
	2Q25 QoQ (%) % share	1H2025
Non-display (非顯示器領域 群)	15,442 9% 28%	11-15%
Non-commodity (商用顯示器)	9,114 2% 16%	16-20%
Commodity (消費性顯示器)	31,676 -3% 56%	6-10%

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合併綜合損益表摘要

新台幣百萬元 (除每股盈餘為元) 營業收入淨額 營業成本 營業毛利 營業費用 營業淨利(損) 營業外收入及支出合計 稅前淨利(損) 本期淨利(損) 歸屬於母公司業主之本期淨利(損) 每股盈餘 (1)(2) EBITDA (3) 折舊及攤銷 資本支出		2025 年第二季 56,231 100.0% 51,519 91.6% 4,712 8.4% 5,490 9.8% (778) -1.4% 244 0.4% (534) -1.0% (677) -1.2% (761) -1.4% (0.10) 6,623 11.8% 7,401 3,255	2025 年第一季		季成長 % 0.5% -0.3% 11.3% 0.3% 37.2% -91.3% - - - 6.3%	2024 年第二季 56,861 100.0% 51,150 90.0% 5,711 10.0% 5,347 9.4% 364 0.6% 1,118 2.0% 1,482 2.6% 1,184 2.1% 1,131 2.0% 0.12 8,213 14.4% 7,849 3,782
			55,932 100.0% 51,699 92.4% 4,234 7.6% 5,473 9.8% (1,239) -2.2% 2,798 5.0% 1,559 2.8% 1,084 1.9% 962 1.7% 0.12
			6,230 11.1%
			7,469 3,515

附註:

1. 每股盈餘之計算是以本期歸屬於母公司之稅後淨利(損) / 在外流通加權平均普通股股數

2. 截至2025年6月30日，普通股股本為新台幣799億元

3. EBITDA = 營業利益+ 折舊及攤銷

4. 所有數字係由群創光電依據中華民國國際財務報導準則(TIFRS)編制

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合併資產負債表摘要

新台幣百萬元 現金及短期投資 存貨 總資產 短期借款(1) 長期借款 權益總計(2) 流動比 負債權益比 淨負債比		2025.6.30		2025.3.31 48,595 40,683 345,321 19,229 4,174 235,897 152% 10% -11%	2024.6.30 50,631 38,415 360,098 9,246 28,548 234,275 155% 16% -5%
		39,280 37,549 317,451 18,259 3,974 214,964
		154% 10% -8%

附註:

1. 短期借款= 短期借款+ 一年內到期之長期借款

2. 截至2025年6月30日，普通股股本為新台幣799億元；普通股每股淨值為新台幣26.69元

3. 淨負債比= (短期借款+ 長期借款- 現金及短期投資) / 權益總計

4. 所有數字係由群創光電依據中華民國國際財務報導準則(TIFRS)編制

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Q & A

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