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Infineon Technologies AG

Regulatory Filings Mar 16, 2017

222_ip_2017-03-16_5fbcb376-5da0-4643-a450-9298e0547164.pdf

Regulatory Filings

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Bernstein Conference on EVs and Energy Storage London, 16 March 2017

Hans Adlkofer Vice President Automotive System Group

Infineon's position in the automotive semiconductor universe

* Divestment of Standard Products business announced

Source: Strategy Analytics, "Automotive Semiconductor Vendor Market Shares", April 2016

Key market trends significantly drive increasing semiconductor content per car

› ADAS and AD (automated driving) are critical enabler to reduce the number of fatalities and serious injuries ("Vision Zero")

ADAS/AD Clean cars

  • › To reach CO2 emission goals, the automotive industry has to focus on
  • a higher efficiency of the classic ICE, and
  • the electrification of the drivetrain (xEV)

Connectivity/security

  • › Advanced connectivity is driven by making the car part of the internet
  • › Connectivity must be secure

Power semiconductor demand for different levels of electrification

System cost and CO2 savings of alternative powertrain systems

Source: IHS Markit, January 2016

How to lift the full potential of SiC?

  • allow for ~5% efficiency increase vs discrete IGBTs
  • allow for ~10% efficiency increase vs IGBT modules
  • embedded into electric motor to lift full potential of ~20%

Penetration rate of SiC will be determined by cost/performance ratio at system level

Infineon has unparalleled package expertise for all xEV applications

2017-03-16 Copyright © Infineon Technologies AG 2017. All rights reserved. 8

Big business with SiC power semiconductors will be made with modules

Package technology is key to lift full potential of a semiconductor technology

Blown-up power modules are not acceptable in xEV subsystems

  • › Thermal stress, heat dissipation, degradation over life time etc. must be fully understood.
  • › 100% proofed bonding and packaging technology is a must in the automotive industry.
  • › The development of SiC modules have to go through the entire process.
  • › Due to high switching frequency of SiC, EMI issues must also be addressed.

Infineon first partner in Volkswagen's "TRANSFORM 2025+" strategy program

Peter Schiefer, Division President Automotive at Infineon (left); Dr. Volkmar Tanneberger, Head of Electrical and Electronic Development at Volkswagen (Courtesy: Volkswagen AG)

"TRANSFORM 2025+"

  • › Volkswagen secures its position in the field of future vehicle innovations such as automated and fully electric driving cars
  • › The company is cooperating directly with semiconductor manufacturers to further shorten development and innovation cycles
  • › Infineon is Volkswagen's first partner here
  • › Cooperation between automotive OEMs and semiconductor manufacturers is becoming increasingly important for further innovation
  • › Infineon is strengthening the bond to customers, getting involved even more deeply in the development processes
  • › Infineon benefits from longer planning horizon and higher stickiness of the business

All types of xEV will significantly increase power semiconductor content per car

Source: IHS Automotive, "Alternative Propulsion Forecast", January 2017; Infineon

In 2016, 8 out of 10 top selling xEVs were powered by Infineon

World's top 10 selling xEVs type Sold cars
in 2016
Drivetrain
powered
by Infineon
Tesla Model S EV 50,935
Nissan Leaf EV 49,818
BYD Tang PHEV 31,405
Chevrolet Volt EV 28,295
Mitsubishi Outlander PHEV 27,850
BMW i3 EV 25,576
Tesla Model X EV 25,372
BYD
Qin
PHEV 21,868
Renault Zoe EV 21,626
BYD e6 EV 20,609

Source: EVvolumes.com, Infineon

Infineon is well positioned globally to benefit disproportionately from xEV boom

Summary: Infineon will expand its leading position in power semi for xEV towards SiC

› In 2017, SiC will see its xEV market introduction for discretes; mass market will be on SiC modules.

  • › Infineon has industry's broadest packaging portfolio for xEV applications. To take full advantage of SiC technology optimized modules are required.
  • › Infineon is already cooperating with leading volume OEMs and is thus best prepared for mass xEV deployment in 2022+.

Glossary

AD automated driving
ADAS advanced
driver assistance system
EV electric vehicle
EMI electromagnetic interference
HEV mild and full hybrid electric vehicle
ICE internal combustion engine
IGBT insulated gate bipolar transistor
micro hybrid vehicles using start-stop systems and limited recuperation
mild hybrid vehicles using start-stop systems, recuperation, DC-DC conversion, e-motor
PHEV plug-in hybrid electric vehicle
Si silicon
SiC silicon carbide
TAM total addressable market
V2X vehicle-to-everything communication
xEV all degrees
of vehicle electrification (EV, HEV, PHEV)

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