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Infineon Technologies AG

Quarterly Report Nov 30, 2009

222_ip_2009-11-30_64c7d3e3-3d4c-4fab-bb9c-71eede20eaae.pdf

Quarterly Report

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Fourth Quarter FY 2009

Quarterly Update

Infineon Technologies AG Investor Relations

ÎInfineon Results and Outlook

ÎBusiness Highlights

Q4 FY09 Revenue Increased to EUR 855m; Segment Result On Par With Year-Ago Levels

Q4 FY09 Revenue and Result by Segment: All Operating Segments Profitable

Strong Net Cash Position After Capital Increase and Initial Debt Repayments

CapEx Significantly Below D&A in FY 2010

1) For definition please see slide 25 in appendix.

Strong Working Capital Management

Trade and other receivables

Trade and other payables

Reduction of OpEx under IFX10+

S and G&A excl. WLC

R&D excl. WLC

Q1 FY10 Outlook (IFRS)

Reflecting the sale of the WLC business, Infineon will classify WLC as discontinued operations in its consolidated financial statements for Q4 FY09 and fiscal year ending September 30, 2009, effective as of the fourth quarter. The closing of the sale has been announced on November 06, 2009.

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FY 2010 Outlook (IFRS)

Reflecting the sale of the WLC business, Infineon will classify WLC as discontinued operations in its consolidated financial statements for Q4 FY09 and fiscal year ending September 30, 2009, effective as of the fourth quarter. The closing of the sale has been announced on November 06, 2009.

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-

ÎInfineon Results and Outlook

ÎBusiness Highlights

Focus Areas and Target Markets Revenue Split by Focus Area

Automotive Segment (ATV)

Revenue and Segment Result for FY08 and FY09

Major recent developments

  • Revenue was driven by markets picking up again and partly by re-stocking in the supply chain, most notably in the US. Auto production and demand in China experience particularly strong growth due to government stimulus program.
  • National scrappage and incentive programs had positive impact on demand.
  • HEV (hybrid electric vehicles): Five important design-wins for power semiconductors.
  • SPT9 (Smart Power Technology): First design-wins in safety and body.

Three Major Applications in Electric Cars: Drive Train, Battery Management, Charger

Drive Train

Components: – HybridPACK1 for mild hybrids (≤ 30 kW) HybridPACK2 for full hybrids (up to 150 kW) discrete IGBTs for electric vehicles

What counts? – highest power density

innovative material combination

Battery Management

Components: CoolMOS, voltage regulators, µCs, sensors

  • What counts? extension of battery lifetime
  • efficient DC/AC and AC/DC conversion
  • monitoring and control of battery pack's state by smart algorithms

Charger

Components: CoolMOS, discrete IGBT

What counts? – efficient AC/DC conversion short charging time handling of high currents

Electric Drive Train is Gaining Momentum – Numerous Vehicle Launches Expected 2010 through 2014

November 19, 2009 Copyright © Infineon Technologies 2009. All rights reserved. Page 15

Industrial & Multimarket Segment (IMM)

Revenue and Segment Result for FY08 and FY09

Major recent developments

  • Number 1 in power semiconductors with 10.2% market share. (IMS Research, August 2009)
  • The sequential increase in revenues reflects both seasonal strength and re-stocking.
  • In terms of products, growth has been seen in power transistors for computing, consumer, and industrial products, and in high-power products for solar inverters and industrial drives.
  • In terms of regions, growth was driven mostly by Asia.

Technically Superior Power Semiconductors in Prestigious Buildungs

Vatican's Auditorium

Location: Auditorium Paolo VI, Rome, Italy Key data: – 220 kW power generation, saving of 225 t CO2 / year Efficiency: more than 98% Components: CoolMOS, discrete IGBT, IGBT modules Customer: SMA Solar Technology

2009 World Games Kaohsiung Stadium

The stadium built for the 8th World Games 2009 is the world's first such facility to generate all its power needs through solar modules. Infineon was comissioned by Delta Group as the main supplier of power semiconductors for the inverters.

  • Location: Kaohsiung, Taiwan
  • Key data: 14,155 m² solar panal area
  • 1.1 MWh of electricity per year
  • saving of 660 t CO2emission per year

Efficiency: ~98%

Components: CoolMOS C3 (70% of power semis provided by IFX.)

Customer: DeltaSol, a subsidiary of Delta Group

Renewable Energy Projects Powered by Infineon's Power Semiconductors

BARD Offshore 1

Germany's first off-shore wind park.

Location: 90 km northwest of Borkum, North Sea, Germany

Key data: – 80 wind turbines of 5 MW each

400 MW total power generation

completion exp. end of CY 2010

Components: Power module IHM 1700V

Customer: Loher GmbH

Bavaria Solar Park

The world's largest solar photovoltaic power system in 2006.

  • Location: Mühlhausen, Bavaria, Germany
  • Key data: 10 MW solar tracking system
  • saving of 10,000 t CO2emission per year

Components: Power module IHM

Customer: Siemens AG

Chip Card & Security Segment (CCS)

Revenue and Segment Result for FY08 and FY09

Major recent developments

  • Number 1 in chip card IC market for 12 consecutive years with 26% market share. (F&S, Oct 09)
  • China selects Infineon's security chips for its new electronic passports. Infineon is now part of the two world's biggest ePassport projects: USA and China.
  • Architectural license agreement for 32-bit ARM cores ARMv6M and ARMv7M.
  • SLE 78CL: High-security dual-interface (contactc-based and contactless) µC family introduced.

Three Core Competencies at CCS

Tailored Security

Focus on: implementation of made-to-measure security functions which fulfill application-specific security needs

Applications: – brand protection

object identification

Pay-TV

Embedded Control

Focus on: right trade-off between computing power, power consumption, level of security, and cost.

Applications: – M2M (cellular machine-to-machine communication) digital tachograph

Contactless Excellence

Focus on: fast, reliable and secure transfer of the data stored on the card or the identification document. A high data transfer rate is key to achieving a high level of acceptance and user friendliness.

Applications: – mass transit, payment identification

Wireless Solutions Segment (WLS)

Revenue and Segment Result for FY08 and FY09

Major recent developments

  • Revenue growth was driven mainly by ULC and entry-phone solutions as well as by increased demand for RF transceivers. Demand for HSDPA platform remained strong.
  • HSUPA platform XMM 6160: Design-wins at four major customers.
  • EDGE platform XMM 2130: Entered volume production at a top-3 handset manufacturers.
  • Strong design-win pipeline in ULC and entry-phone segment at both tier-1 and tier-2 customers.

Recent Product Launches

HSUPA Platform XMM 6160

Features: 65nm technology; power management unit (PMU) and baseband monolithically integrated.

Status: – ramp at major customers in CY 2010

EDGE Platform XMM 2130

  • Features: 65nm technology; PMU, baseband, RF transceiver, and memory monolithically integrated.
  • Status: already in volume production at a top-3 handset manufacturer
  • ramp at Nokia expected in 2H CY 2010

ULC Platform XMM 1100

  • Features: 65nm technology; PMU, baseband, RF transceiver, and memory monolithically integrated.
  • Status: first shipments to tier-1's and further major customers ramp at Nokia upcoming

Wireline Communications (WLC) Sold – WLC Has Become Lantiq

Sale of WLC closed on November 06, 2009

  • Sale of WLC to Golden Gate Capital closed on November 06, 2009.
  • Purchase price amounted to EUR 243m.
  • Book gain of more than EUR 100m will be recorded in Q1 FY10.
  • Product supply agreements with Infineon for a mid to high doubledigit million Euro amount in FY 2010. Gradual phase-out from Villach, Dresden and Altis over years.
  • Additional service level agreements with Infineon within Operating Expenses for approximately EUR 20-25m in FY 2010.

WLC has become Lantiq

  • Headquartered in Neubiberg, Germany.
  • Approx. 900 employees.
  • More than 20 years of experience; over 800 patents.
  • Among the world's top-15 fabless semiconductor companies.
  • Number 1 in the broadband access market with a market share of 27%. (source: Gartner, Infineon)

Notes

CapEx =

  • 'Purchase of property, plant and equipment'
    • 'Purchase of intangible assets, and other assets' incl. capitalization of R&D expenses

Working Capital =

  • ('Total current assets'
  • 'Cash'
  • 'Available-for-sale financial assets'
  • 'Assets classified as held for disposal')
  • ('Total current liabilities'
  • 'Short term debt and current maturities of long-term debt'
  • 'Liabilities associated with assets classified as held for disposal')
  • DoI (days of inventory; quarter-to-date) = ('Inventories' / 'Cost of goods sold') * 90
  • DSO (days of sales outstanding; quarter-to-date) = ('Trade and other receivables' / 'Revenue') * 90

DPO (days of payables outstanding; quarter-to-date) = ('Trade and other payables' / ['Cost of goods sold' + 'Purchase of property, plant and equipment']) * 90

Infineon Condensed Consolidated Statements of Operations (IFRS) (unaudited)

Consolidated Statements of Operations

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1
8
1
)
(
1
6
)
5
fro
fo
Inc
inv
d
ing
he
i
ho
d
tm
ts
te
t
ty
t
om
e
m
es
en
ac
co
un
r u
s
e
q
u
m
e
1 2 2 4 7
In
(
los
)
fro
in
ing
io
be
fo
inc
t
t
ta
co
m
e
s
m
co
n
u
o
p
er
a
ns
re
om
e
xe
s
(
2
8
6
)
(
2
1
)
2
3
(
1
6
5
)
(
2
6
8
)
f
(
)
Inc
be
i
tax
t
om
e
ne
ex
p
en
se
(
)
1
2
(
)
5
1 (
)
3
9
(
)
5
In
(
los
)
fro
in
ing
io
t
t
co
m
e
s
m
co
n
u
o
p
er
a
ns
(
2
9
8
)
(
2
6
)
2
4
(
2
0
4
)
(
2
3
)
7
(
)
fro
f
Inc
los
d
isc
inu
d o
ion
inc
t
t
t o
tax
om
e
s
m
on
e
p
er
a
s,
ne
om
e
es
(
)
5
8
6
3 (
)
1
0
(
)
3,
5
4
3
(
)
3
9
8
Ne
in
(
los
)
t
co
me
s
(
8
8
4
)
(
2
3
)
1
4
(
3,
4
)
7
7
(
6
1
)
7
A
i
bu
b
le
t
tr
ta
to
:
M
ino
i
in
ty
te
ts
r
res
(
)
1
7
3
1 - (
)
8
1
2
(
)
4
8
S
ha
ho
l
de
f
In
f
ine
Te
hn
log
ies
A
G
re
rs
o
on
c
o
(
1
1
)
7
(
2
4
)
1
4
(
2,
9
3
)
5
(
6
2
3
)

Basic and diluted earnings (loss) per share attributable to shareholders of Infineon Technologies AG (in Euro)*:

(
) –
W
ig
h
d a
ha
d
ing
in
i
l
l
ion
ba
ic
d
d
i
lu
d
te
ts
ta
te
e
ve
rag
e
s
res
o
u
n
m
s
an
8
1
3
8
1
3
9
7
7
8
1
3
8
5
5
Ba
ic
d
d
i
lu
d e
ing
(
los
)
ha
fro
inu
ing
ion
te
t
t
s
an
ar
n
s
s
p
er
s
re
m
co
n
o
p
er
a
s
(
)
0.
3
2
(
)
0.
0
3
0.
0
3
(
)
0.
2
3
(
)
0.
3
2
Ba
ic
d
d
i
lu
d e
ing
(
los
)
ha
fro
d
isc
inu
d
ion
te
t
t
s
an
ar
n
s
s
p
er
s
re
m
on
e
op
er
a
s
(
0.
5
5
)
- (
0.
0
1
)
(
3.
3
8
)
(
0.
4
1
)
(
)
Ba
ic
d
d
i
lu
d
in
lo
ha
te
s
an
ea
rn
g
s
ss
p
er
s
re
(
)
0.
8
7
(
)
0.
0
3
0.
0
2
(
)
3.
6
1
(
)
0.
7
3

* Quarterly earnings (loss) per share may not add up to year-to-date earnings (loss) per share due to rounding.

Infineon consolidated Balance Sheet (IFRS) (unaudited)

in E
illio
uro
m
n
Se
30,
08
p
Ju
n 3
0,
09
Se
30,
09
p
As
set
s
Cu
nt a
ts:
rre
sse
Ca
sh
and
sh
iva
len
ts
ca
equ
749 767 1,4
14
le-f
fin
Ava
ilab
ale
ial a
ts
or-s
anc
sse
Tra
de
and
her
eiv
abl
134 104 93
ot
rec
es
Inv
orie
ent
799
665
496
521
514
460
s
Inc
cei
vab
le
e ta
om
x re
29 13 11
Oth
nt f
ina
ncia
l as
set
er c
urre
s
19 29 26
Oth
nt a
ts
er c
urre
sse
124 113 114
Ass
ets
cla
ssif
ied
he
ld f
or d
ispo
sal
as
2,1
29
5 112
To
tal
t as
set
cur
ren
s
4,
648
2,
048
2,
744
Pro
lan
d e
ipm
ty,
t an
ent
1,3
10
1,0
11
928
per
p
qu
Go
odw
ill a
nd
oth
er i
ible
nta
set
as
s
443 423 369
ng
Inv
d fo
ing
the
uity
tho
d
est
nts
nte
me
ac
cou
r us
eq
me
20 24 27
Def
ed
tax
set
err
as
s
400 396 396
Oth
er f
ina
nci
al a
ts
sse
144 114 124
Oth
ts
er a
sse
17 21 18
To
tal
ets
ass
6,
982
4,
037
4,
606
in E
illio
uro
m
n
Se
30,
08
p
Ju
n 3
0,
09
Se
30,
09
p
Lia
bili
ties
d e
ity
an
qu
Cu
nt l
iab
ilitie
rre
s:
Sh
ort-
term
de
bt a
nd
t m
atu
ritie
f lo
term
de
bt
cur
ren
s o
ng-
20
7
634 52
1
Tra
de
and
her
ble
ot
pa
ya
s
506 365 393
Cu
isio
nt p
rre
rov
ns
424 415 436
Inc
ble
e ta
om
x p
aya
Oth
nt f
ina
ncia
l lia
bilit
ies
87
63
97
43
102
er c
urre
Oth
nt l
iab
ilitie
er c
urre
s
263 146 50
147
Lia
bilit
ies
oci
d w
ith
cla
ssif
ied
he
ld f
or d
ispo
sal
ate
ets
ass
ass
as
2,1
23
9
To
tal
t lia
bili
ties
673
700
658
cur
ren
Lon
de
bt
term
3,
963
1,
388
1,
329
g-
Pen
sio
lan
nd
sim
ilar
itm
ent
s a
co
mm
s
43 35 94
n p
Def
ed
tax
lia
bilit
ies
err
19 15 13
Lon
visi
term
g-
pro
ons
27 105 89
Oth
er f
ina
nci
al l
iab
ilitie
s
20 6 5
Oth
er l
iab
ilitie
s
76 84 85
To
tal
liab
iliti
es
4,
821
2,
333
2,
273
Sh
hol
der
s' e
ity:
are
qu
Ord
ina
har
ital
ry s
e c
ap
1,4
99
1,4
99
2,1
73
Ad
diti
l pa
id-i
ital
ona
n c
ap
6,0
08
6,0
41
6,0
48
Acc
ula
ted
de
fici
t
um
(
5,2
52)
(
5,8
89)
(
5,9
40)
Oth
f eq
uity
ent
er c
om
pon
s o
(
164
)
(
3)
(
8)
To
tal
ity
ibu
tab
le t
har
eho
lde
f In
fin
Te
chn
olo
ies
AG
attr
equ
o s
rs o
eon
g
2,
091
1,
648
2,
273
Min
orit
inte
ts
y
res
70 56 60
To
tal
ity
equ
2,
161
1,
704
2,
333
To
tal
liab
iliti
and
uity
es
eq
6,
982
4,
037
4,
606

Infineon Condensed Consolidated Statements of Cash Flows (IFRS) (unaudited)

(€ m
illion
s)
Sep
30,
08
3 m
ont
hs e
nde
d
Jun
30,
09
Sep
30,
09
For
the
yea
Sep
30,
08
nde
d
rs e
Sep
30,
09
(los
s)
Net
inco
me
Les
et (
inco
me)
los
s fro
m d
isco
ntin
ued
ratio
net
of in
e ta
s: n
ope
ns,
com
xes
(884
)
586
(23)
(3)
14
10
(3,7
47)
3,54
3
(67
1)
398
y (u
in)
Adj
ustm
ents
to r
ncile
net
los
s to
h pr
ovid
ed b
sed
ratin
tivit
ies:
eco
cas
ope
g ac
Dep
reci
atio
d am
ortiz
atio
n an
n
for
ubtf
137 128 114 552 513
Prov
ision
(rec
f) do
ul a
unts
ove
ry o
cco
Los
ales
of c
vail
able
-for-
sale
fina
ncia
l as
nt a
sets
3 (1)
2
-
1
3
1
(2)
3
(ga
ins)
ses
on s
urre
(ga
ins)
Los
ales
of b
usin
nd i
nter
ests
in s
ubs
idiar
ies
ses
on s
ess
es a
-
(14)
- - (80) 16
Los
(ga
ins)
on d
ispo
sals
of p
rty,
plan
t, an
d eq
uipm
ent
ses
rope
- 1 - 10 1
Inco
from
inv
ted
for
usin
g th
uity
hod
estm
ents
met
me
acc
oun
e eq
(1) (2) (2) (4) (7)
Imp
airm
cha
ent
rges
137 (2) 4 137 3
Stoc
k-ba
sed
sati
com
pen
on
1 1 - 5 2
Def
d in
e ta
erre
com
xes
19 - (5) 19 (6)
Cha
s in
ratin
and
liab
ilitie
sets
nge
ope
g as
s:
Tra
de a
nd o
ther
eiva
bles
rec
(31) 6 (19) 31 137
Inve
ies
ntor
48 23 20 (48) 152
Oth
nt a
ts
er c
urre
sse
32 1 (6) (12) (23
)
Tra
de a
nd o
ther
able
pay
s
28 68 18 (71) (104
)
Prov
ision
s
82 (4) (2) 53 (11
1)
Oth
nt lia
biliti
er c
urre
es
Oth
ts a
nd l
iabil
ities
71
46
(12)
16
30
10
99
88
(44
)
23
er a
sse
Inte
rest
eive
d
rec
14 1 5 39 21
Inte
pai
d
rest
(8) (35) (3) (62) (49
)
Inco
ived
tax
me
rece
(12) (4) 1 (16) 16
Net
h pr
ovid
ed b
ing
acti
vitie
s fro
onti
nuin
ions
erat
erat
cas
y op
m c
g op
254 161 190 540 268
Net
h pr
ovid
ed b
y (u
sed
in)
ratin
tiviti
es f
dis
tinu
ed o
tion
cas
rom
con
s
(226
)
1 (1) (624
)
(380
)
ope
g ac
pera
Net
h pr
ovid
ed b
y (u
sed
in)
ratin
tiviti
cas
es
28 162 189 (84) (112
)
ope
g ac
Cas
h flo
ws f
inv
esti
ctiv
ities
rom
ng a
:
Pur
cha
of a
vail
able
-for-
sale
fina
ncia
l as
sets
ses
3 (31) - (574
)
(31
)
Pro
ds f
sal
f av
aila
ble-
for-s
ale
fina
ncia
l as
sets
cee
rom
es o
270 48 6 601 64
Pro
ds f
sal
f bu
sine
d in
tere
sts
in s
ubs
idia
ries
cee
rom
es o
sse
s an
24 - - 121 4
Bus
ines
quis
ition
f ca
sh a
ired
et o
s ac
s, n
cqu
- - - (353
)
-
Pur
cha
of i
gibl
d ot
her
ntan
sets
ets
ses
e as
, an
ass
(117
)
(12) (18) (149
)
(51
)
Pur
cha
of p
rty,
plan
t an
d eq
uipm
ent
ses
rope
(83) (13) (22) (308
)
(103
)
Pro
ds f
sal
f pr
rty,
plan
t an
d eq
uipm
ent,
and
oth
ts
cee
rom
es o
ope
er a
sse
2 7 1 10 103
Net
h pr
ovid
ed b
y (u
sed
in)
inve
stin
tivit
ies f
tinu
ing
ratio
cas
g ac
rom
con
ope
ns
99 (1) (33) (652
)
(14
)
Net
h pr
ovid
ed b
y (u
sed
in)
inve
stin
tivit
ies f
dis
tinu
ed o
tion
cas
g ac
rom
con
pera
s
49 (1) (4) (10) 27
Net
h pr
ovid
ed b
y (u
sed
in)
inve
stin
tivit
ies
cas
g ac
148 (2) (37) (662
)
13
Cas
h flo
ws f
fina
ncin
tiviti
rom
g ac
es:
Net
cha
in s
hort
-ter
m d
ebt
(13) (68)
nge
Net
cha
in r
elat
ed p
fina
ncia
l rec
eiva
bles
and
able
arty
nge
pay
s
-
2
- -
-
(5) -
(1)
Pro
ds f
iss
f lon
rm d
ebt
g-te
cee
rom
uan
ce o
41 181 - 149 182
Prin
cipa
l rep
of l
m d
ebt
ents
-ter
aym
ong
(62) (86) (18
7)
(226
)
(455
)
Cha
in r
icte
d ca
sh
estr
nge
- (7) - (7)
Pro
ds f
iss
f ord
inar
y sh
cee
rom
uan
ce o
ares
- - -
680
- 680
Divi
den
d pa
inor
ity in
nts
to m
tere
sts
3 (80) (3)
yme
Cap
ital c
ibut
ion
ontr
- - (5)
Net
h pr
ovid
ed b
y (u
sed
in)
fina
ncin
tivit
ies f
tinu
ing
ratio
cas
rom
con
ns
(19) - -
75
-
496
-
(230
)
391
g ac
ope
Net
h pr
ovid
ed b
y (u
sed
in)
fina
ncin
tivit
ies f
dis
tinu
ed o
tion
cas
g ac
rom
con
pera
s
96 - - 343 (40
)
y (u
in)
Net
h pr
ovid
ed b
sed
fina
ncin
tivit
ies
cas
g ac
77 75 496 113 351
Net
incr
e (d
) in
h an
d ca
sh e
quiv
alen
ts
eas
ecre
ase
cas
253 235 648 (633
)
252
Effe
ct o
f for
eign
han
ate
cha
h an
d ca
sh e
quiv
alen
ts
exc
ge r
nge
s on
cas
Cas
h an
d ca
sh e
alen
t be
erio
d
10 - (1) (6) (8)
quiv
ginn
ing
of p
ts a
Cas
h an
d ca
sh e
alen
d of
iod
ts a
t en
907
0
532
767
767
14
1,80
9
0
1,17
0
4
quiv
per
s: C
Les
ash
and
h eq
uiva
lent
s at
end
of p
erio
d cl
ified
held
for
disp
l
cas
ass
as
osa
1,17
421
- 1,4
-
1,17
421
1,41
-
Cas
h an
d ca
sh e
quiv
alen
ts a
t en
d of
iod
per
749 767 1,4
14
749 1,41
4

Copyright © Infineon Technologies 2009. All rights reserved. Page 28

Financial Calendar and IR Contacts

Financial Calendar

  • Jan 29, 2010* Q1 FY10 Results
  • Feb 11, 2010* Annual General Meeting, Munich
  • Feb 16, 2010 Presentation at Mobile World Congress, Barcelona
  • Apr 29, 2010* Q2 FY10 Results
  • Jul 28, 2010* Q3 FY10 Results
  • Nov 16, 2010* Q4 and Full Year FY10 Results

* Preliminary Date

IR Contacts

Ulrich Pelzer

Corporate Vice President Corporate Development & Investor Relations +49 89 234-26153 [email protected]

Joachim BinderSenior Director, Investor Relations +49 89 234-25649 [email protected]

Barbara Böckelmann

Manager, Investor Relations +49 89 234-20166

[email protected]

Disclaimer

This presentation was prepared as of November 19, 2009 and is current only as of that date.

This presentation includes forward-looking statements about the future of Infineon's business and the industry in which we operate. These include statements relating to general economic conditions, future developments in the world semiconductor market, our ability to manage our costs and to achieve our savings and growth targets, the resolution of Qimonda's insolvency proceedings and the liabilities we may face as a result of Qimonda's insolvency, the benefits of research and development alliances and activities, our planned levels of future investment, the introduction of new technology at our facilities, the continuing transitioning of our production processes to smaller structure sizes, and our continuing ability to offer commercially viable products.

These forward-looking statements are subject to a number of uncertainties, such as broader economic developments, including the duration and depth of the current economic downturn and the pace of the expected recovery; trends in demand and prices for semiconductors generally and for our products in particular, as well as for the end-products, such as automobiles and consumer electronics, that incorporate our products; the success of our development efforts, both alone and with partners; the success of our efforts to introduce new production processes at our facilities; the actions of competitors; the availability of funds; the outcome of antitrust investigations and litigation matters; and the resolution of Qimonda's insolvency proceedings; as well as the other factors mentioned in this presentation and those described in the "Risk Factors" section of the registration statement of Infineon on Form F-3 filed with the U.S. Securities and Exchange Commission on July 16, 2009 and the prospectus of Infineon dated July 16, 2009 and approved by the German regulator BaFin. As a result, Infineon's actual results could differ materially from those contained in these forward-looking statements. You are cautioned not to place undue reliance on these forward-looking statements.

Infineon does not undertake any obligation to publicly update or revise any forward-looking statements in light of developments which differ from those anticipated.

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