Infineon Technologies AG

Investor Presentation • Nov 15, 2023

Fourth Quarter FY 2023 Quarterly Update

Infineon Technologies AG Investor Relations

1

Infineon at a glance

Addressing long-term high-growth trends

FY23 revenue by segment

• Automotive (ATV)
• Green Industrial Power (GIP)
• Power & Sensor Systems (PSS)
• Connected Secure Systems (CSS)

Financials FY23 revenue by product category

Infineon is a global player, clear #1 in power semiconductors, and ranked #5 in the overall microcontroller market

¹ Based on or includes research from Omdia: Annual 2001-2022 Semiconductor Market Share Competitive Landscaping Tool – 1Q23. May 2023.

² Based on or includes research from Omdia: Power Semiconductor Market Share Database – 2022. September 2023.

Results are not an endorsement of Infineon Technologies AG. Any reliance on these results is at the third party's own risk.

Well-balanced portfolio among segments and key applications, highest growth coming from Decarbonization and Digitalization

FY23 revenue of €16,309m by segment and key application

Undisputed power systems leadership mastering all three key materials

Leadership in Power Systems across all materials and technologies

Silicon Diode – MOSFET – IGBT – Driver – Controller

Silicon carbide Diode – MOSFET

Gallium nitride HEMT – Driver

GaN Systems acquisition successfully closed

Strengthening GaN portfolio, reinforcing global leadership in Power Systems

Addressing fast-growth applications with highly complementary strengths in IP, application understanding, customer access and project pipeline

Significant roadmap acceleration through unmatched R&D resources and application expertise

Leadership in Power Systems through mastery of all relevant power technologies – Si, SiC, GaN

Infineon at the core of IoT – driving digitalization by serving strongly growing multi-application markets

Consumer IoT Industrial IoT Automotive IoT

Products: MCU – Connectivity (Wi-Fi, BLE, NFC) – Sensors – Security – Power supply & switches

Infineon and Vitesco intensify long-term partnership: AURIX™ TC4x MCUs for E/E architecture to reach volume of > €1bn

AURIX™ TC4x MCU family in new E/E architectures

• ‒ The multi-year agreement takes effect starting in 2027 and will last until mid of next decade
• ‒ The high-performance AURIX™ TC4x MCUs combine power and performance enhancements for use in
  • ‒ next-generation master and zone controllers
  • ‒ next-generation software-defined vehicle
  • ‒ xEV: traction inverter, OBC, DC-DC converter, BMS
  • ‒ power distribution, cybersecurity, network functions

master controller unit	zone controller unit	DC-DC converter	High-voltage electronics	e-motor electronics

Infineon acquires Ultra-Wideband (UWB) pioneer 3db Access to further strengthen its connectivity portfolio

The acquisition of 3db Access enables Infineon to:

• − add UWB to its connectivity range, including Wi-Fi, Bluetooth/Bluetooth Low Energy, and NFC solutions
• − strengthen its portfolio for secured smart access, precise localization and enhanced sensing
• − accelerate its IoT roadmap for leveraging the market opportunities of secured, connected devices
• − create full system solutions with unique features that combine low-power consumption, enhanced physical layer security, feature-rich RF front-end configurations and localization-optimized hardware architecture

UWB Chipset Market Growth¹ [USD bn]

− Infineon's target applications in automotive, industrial and consumer IoT are expected to drive significant growth in the UWB market in the next years

¹Source: ABI Research – Wireless Connectivity Technologies (Q3-2023)

Decarbonization and digitalization are accelerating structural growth of Infineon's target markets

Infineon serving all target markets as leader in Power Systems and IoT

Supported by …

Our Target Operating Model: committing to ambitious financial goals and being the sustainability leader

Target Operating Model

through cycle

	Revenue growth	>10%
	Segment Result Margin	25%
	Adj. Free Cash Flow Margin1	10-15%
CO 2	Sustainability leader neutrality 2030

Double-digit growth ahead – five key applications account for ~60% of growth; well-diversified divisional split

Through cycle growth rates by division >10% PSS ~10% CSS ~10%

Our Target Operating Model: significant margin expansion through the cycle

Free Cash Flow generation increasing over the cycle, driven by profitable growth and better asset efficiency

• ‒ Accretive investments into high organic growth
• ‒ Operating cash flow expected to outgrow investments
• ‒ Differentiated in-house manufacturing complemented by ~40% outsourcing share over time
• ‒ FY24-28: ~€4.5bn cum. investments into major frontend buildings

Adj. Free Cash Flow target: 10-15% of sales, excl. major frontend buildings

Outlook for Q1 FY24 and FY24

	Outlook Q1 FY241	Outlook FY241
Revenue	€3.8bn ~	€17bn +/-500m
Adj. Gross Margin		~45%
Segment Result Margin	~22%	~24%2
FCF/adj. FCF		~€400m/~€2.2bn
Investments		~€3.3bn
D&A		~€2.1bn3

¹ Based on an assumed average exchange rate of \$1.05 for €1.00

² At the mid-point of revenue guidance

³Including the amortization of around 400 million Euros from purchase price allocations

ESG: Targets and achievements

Our 2030 carbon neutrality goal is aligned with the Paris Climate Agreement's 1.5°C target

On the road to carbon neutrality³ we achieved significant milestones by

• ‒ Using green electricity in Europe and North America and our main sites Kulim and Melaka in Malaysia
• ‒ Installation start of PFC abatement system in Austin

Infineon's CO² target³ by 2025 and 2030

Net CO² emissions in million tons of CO² equivalents

Net ecological benefit: CO² emissions reduction of more than 113 million tons

1, 2, 3 For further explanation see "ESG footnotes" in the appendix

External recognitions confirm our engagement in contributing to a sustainable society

	Rating/Score	Scale	Date
MSCI ESG	AA	CCC to AAA	05/2023
CDP	A- climate scoring B water scoring	F to A	12/2022
Ecovadis	99th percentile "Platinum" award	0 to 100	03/2023
Dow Jones Sustainability™ Index	83 Dow Jones Sustainability™ World and Europe Index listing	0 to 100	12/2022
ISS ESG Corporate Rating	Prime Status	D- to A+	03/2023
FTSE4Good Index	Index member	–	06/23

Infineon's wide bandgap strategy

30% market share target in SiC by end of decade underpinned by significant capacity expansion

Building the world's largest and most competitive 200-millimeter SiC power fab

Rationale

• ‒ Undisputed leadership position in power systems across all materials based on technology and scale
• ‒ Expanding the third module at the existing site in Kulim offers significant advantages – economies of scale, competitive local cost position, implementation speed and reliability from existing employees and infrastructure
• ‒ Modular setup allows for flexibility in ramp-up phase

1 Total revenue potential comprises Villach, Kulim 3 phase 1 and phase 2 incl. 200-millimeter conversion

With a world-scale fab complementing existing strengths, Infineon will be the industry's most competitive provider of SiC technology

SiC raw material supply + Cold Split technology

• ‒ More than 5 qualified SiC wafer and boule suppliers
• ‒ Increased productivity through Cold Split

Superior trench technology

• ‒ 30% more chips per wafer than planar
• ‒ Unmatched reliability with zero field returns

Packaging portfolio

• ‒ Best-in-class in-house packaging solutions
• ‒ New .XT technology for highest power density

Deep system understanding

• ‒ Decades of experience
• ‒ Broadest portfolio: off-the-shelf plus customized solutions

World-scale 200-millimeter fab with industry-leading cost position

P2S

Expansion of Kulim 3 backed by strong long-term customer commitments

Automotive		Industrial (incl. PV and ESS)
	A total of 6 OEMs		A total of 5 major customers
		Design-wins: ~ €5bn
		Related customer pre-payments: ~ €1bn

• ‒ Phase 2 of Kulim module 3 expansion is backed by numerous customer commitments
• ‒ Significant design-wins in automotive and renewable applications
• ‒ About €1bn of customer pre-payments contribute to our free cash flow in FY24 and FY25

GaN Systems acquisition positions Infineon to be a leading GaN player

Leading
patent
portfolio
for GaN –
>350 patent
families

~450 strong GaN team high double-digit USD m GaN R&D p.a.

Best-in-class application understanding incl. automotive

Leading IP & strongest R&D force Leveraging foundry + IDM advantages

We own key IP and all frontend process steps

We combine

foundry partnerships and dualsite in-house production, ready for 200 mm

We target

a leading market position

GaN market accelerating, driven by key power applications

Yole: Power GaN Report 2022 & Compound Semiconductor Market Monitor-Module I Q4 2022.

Combined platform features leading GaN IP and the industry's strongest R&D force, to speed up time-to-market 100 150 200 250 300 350 400 Leverage ability to scale learnings and significantly accelerate roadmap No. of patent families in GaN power Combined team of ~450 GaN experts Combined R&D budget high doubledigit USD m p.a.

for shorter time-to-market

Source: Infineon analysis

0

50

Foundry Peer 1 Peer 2

GaN expected to be the preferred technology in multiple core applications by 2030, different transition paths shaping up

2020 2030 Si SiC GaN GaN tipping point reached/in sight GaN transition coming up 2020 2030 HV HV HV DCDC DCDC DCDC HV DCDC Low-power motor control Residential Solar On-board charger Server Charger More applications likely to transition to GaN over time

Strong position to offer all relevant power semiconductor technologies creates clear customer benefits

Automotive

ATV at a glance

ATV revenue and Segment Result Margin FY23 revenue split by product group

Key customers

· APTIV·	Astemo	(ન) Bosch	BHD	(Ontinental 12	DENSO
FORVIA	НҮШПОЯІ MOTOR GROUP	Valeo	veoneer	vitesco TECHNOLOGIES

-3%

7%

17%

27%

37%

0 1.000 2.000 3.000 4.000 5.000 6.000 7.000 8.000 9.000

Infineon's top market position is built on system competence based on an industry-leading product portfolio

Automotive semiconductors (2022 total market: \$59.4bn; +27.4% y-y)

• ‒ Total market grew by 27.4% y-y, reaching all-time-high of \$59.4bn; market growth clearly supported by content-percar growth
• ‒ #1 in power semiconductors due to high exposure in xEV
• ‒ #2 in MCUs for the first time ever, driven by outstanding success in AURIX™ design-win momentum
• ‒ Undisputed #1 in automotive NOR Flash memory ICs

TechInsights (formerly Strategy Analytics): Automotive Semiconductor Vendor Market Shares. March 2023. Sensors: S&P Global: Automotive Semiconductor Market Shares 2022. May 2023.

Automotive semiconductor market expected to continue its growth journey even at flat light vehicle production growth

Applications	Market outlook for CY24
Automotive	‒ Macroeconomic weaknesses in some key markets may stall car production growth in 2024 ‒ Vehicle affordability concerns persist, despite recent OEM price cuts ‒ No major semiconductor shortage is expected
e-mobility	‒ Continued momentum for xEV expected ‒ Availability of xEV models in different price and feature segments may alleviate some concerns about affordability ‒ New or extension of existing incentives, e.g. in China will provide further tailwind to the xEVs
Autonomous driving	‒ Growth of ADAS/AD continues – also driven by higher xEV share which usually offer higher levels of car autonomy and more advanced E/E architecture platforms ‒ Further small-scale robotaxi projects will take place, especially in China and the US

Several strong content growth drivers for Infineon, even at flat LV production

xEV

Infineon is the world leader in automotive semis, serving all key applications and benefiting strongly from content growth

Semiconductor bill-of-material in a car in 2023 and 2030

• Semis for drivetrain function (e.g. Inverters, on-board chargers, BMS, etc.)
• Semis for non-drivetrain functions

Based on TechInsights: Global xEV System Semiconductor and Sensor Demand Forecast 2019-2028. July 2023; Infineon

‒ Infotainment

Infineon has the ideal footprint to participate in worldwide growth; revenue share of North America expected to grow

~20% ~25% ~25% ~30% Today Short-term to mid-term Asia Pacific incl. Japan China Europe N. America

Infineon Automotive revenue split by region

• ‒ Infineon's automotive business remains well-balanced across regions
• ‒ Infineon is ranked #1 in China and South Korea, and ranked #2 in Europe and Japan
• ‒ In the US market, new design-wins propel strong growth and will lead to higher share of revenue
• ‒ Decreasing relative share of European sales following re-location and off-shoring by market players
• ‒ Stable share of revenue in the fast-growing Chinese market

Infineon benefits disproportionally from Chinese OEMs, at the same time portfolio breadth, quality and innovation ensure stickiness

Infineon is present in a multitude of different applications

Exemplary Chinese OEM model

‒ >40 different applications, covering all segments: ADAS, traction inverter, BMS, standard safety, and comfort etc.

• ‒ Hundreds of different products, incl. >20 MCUs incl. software
• ‒ System solution (P2S) levering combined Infineon product advantages, e.g., motor control MCU + driver + MOSFETs; MCU for signal pre-processing + radar

‒ Infineon value: >€800/car

Infineon auto sales track record in China
FY	ATV y-y sales growth
FY22	+35%
FY23e	>25%

High innovation pace and at the same time platform stickiness of up to 10 years

High quality suppliers are key for Chinese export ambitions

Content growth even excluding power semis

A very broad portfolio with >300 product families is backing the market leadership of Infineon in Automotive

Infineon ATV division revenue by product families:

Major categories¹ : AURIX™ families, CoolSiC™, IGBT 750V, IGBT 1200V, MOSFETs, PROFET™, Radar, TRAVEO™ – none more than ~10%

Unmatched customer value creation and portfolio resilience

Leading technologies	System competence (P2S)	Broadest portfolio

1 In alphabetical order

Number of power MOSFETs per car continues to increase, and drives accelerated growth for the leading portfolio

Examples of MOSFET applications

Infineon's revenue growth

• ‒ Infineon offers broadest portfolio (>600 products) and eco-system to address specific and high-margin applications:
  • ‒ embedded control, gate driver, MOSFETs, software, P2S
  • ‒ entire eco-system with digital twins
  • ‒ simulation environment (esp. for motor control)

Electromobility

xEV (PHEV + BEV) sales continuously strong driven by China; in Oct CY23, BEV sales crossed the monthly 1 million mark

In units k Penetration

Based on or includes content supplied by S&P Global Mobility. October 2023; EV Volumes. October 2023.

Infineon's broad product portfolio and system understanding enable higher BoM and allows for compact designs and fast T2M

Infineon inverter reference design, covering up to 95% of value

P2S (product-to-system approach)

• ‒ Reference design for up to 300 kW, further customization possible
• ‒ System solution for easy implementation
• ‒ Fast time-to-market (T2M)

Freedom of choice

• ‒ IGBT and SiC in 750/1,200 V scale up to preferred power class
• ‒ HybridPACK™ Drive CoolSiC™ Gen2 continuous operation at 175°C
• ‒ EiceDRIVER™ gate driver Gen3 optimized for CoolSiC™
• ‒ Optimized 32-bit AURIX™ MCU

Leading the growth in IGBTs (bare die, discrete and modules) including Si/SiC hybrid designs

0 12 9 6 3 kW 0 - 24 25 - 49 50 - 74 75 - 99 100 - 124 125 - 149 150 - 174 175 -199 200 - 224 225+ [m units] Infineon estimates based on S&P Global Mobility. September 2023 mainly IGBTs for 2nd motor Si/SiC hybrid module optionality mainly SiC

Electric motor power, grouped by 25 kW increments First SiC-MOSFET/IGBT fusion module

Infineon's revenue growth

‒ IGBTs will still account for ~40% of power semis in traction inverters in 2030; also benefitting from Si/SiC hybrid (fusion) solutions and modules

• ‒ IGBTs are essential for the growth of affordable electric cars
• ‒ Infineon can leverage scale effects in packaging R&D and S&M for SiC

More than 20 design-wins in SiC across all auto applications: traction inverter, OBC, DC-DC

World's leading IGBT supplier Latest CoolSiC™ design-wins including traction inverter, OBC, DC-DC Renault Volkswagen Cadillac SAIC Mini Nissan NIO Hyundai (front axle) 2 EU OEMs US OEM German Luxury OEM Genesis (front axle) 3 Chinese Tier 1s SAIC Zeekr Xpeng Hozon 2 EU Tier 1s Stellantis Li Auto Japanese OEM 6 Distribution partners Hyundai Changan Genesis 4 US OEMs Ford Chery

World-scale capacity, unmatched portfolio breadth and our worldwide customer base lead to accelerated growth in SiC

‒ Unrivaled productivity with worldscale fab and most diversified supplier network ‒ Superior trench technology and highest reliability ‒ Extensive packaging portfolio and complete system competence Leading SiC technology and production efficiency Most scalable SiC auto portfolio 650 V 750 V 1,200 V Module DSC/SSC Bare die module Discrete

Continued strong SiC design-win momentum

US BEV OEM

Infineon's extended BMS (battery management system) product portfolio paves the way for an exceptional growth story

BMS semi market growth is driven by xEV unit and battery capacity

BMS analog frontend IC

Infineon's revenue growth

• ‒ Drivers for BoM: increasing battery capacity, more cells, more channels
• ‒ Triple-digit million € design-win in pipeline
• ‒ Additional upside from non-automotive markets: ESS, street lighting, forklifts

Automated Driving

AURIX™ MCU is the gold standard for ADAS/AD, control, safety, and high-speed in-vehicle network

Total automotive MCU market development, excl. MPUs and SoCs

Infineon's revenue growth

€19bn MCU design-win volume secured

• ‒ Total automotive MCU design-win volume in the last four years exceeded €19bn
• ‒ Design-wins covering current and next decade ensuring robust and long lasting growth
• ‒ Up to 40 MCUs per vehicle awarded to Infineon
• ‒ Strongest momentum in essential MCUs for E/E architecture, ADAS/AD, and xEV
• ‒ Around €3bn of revenues already in 2023

AURIX™, TRAVEO™, and PSoC™ families

The new 28nm CMOS radar from Infineon enables autonomous truck driving for L4 truck platforms

Design-win details

• ‒ 4D imaging radar for autonomous driving truck platform
• ‒ Infineon's highest-resolution radar sensor ICs enable the next level of autonomous driving
• ‒ Triple-digit million € design-win over lifetime

Key product information

• ‒ CMOS 28 nm CTRX radar sensor family
• ‒ 76 GHz 81 GHz MMIC
• ‒ Best-in-class RF performance
• ‒ Zero-defect quality enables dependable systems
• ‒ Scalability and cascadability enable radar solutions for all SAE levels

Growth of L1/L2/L2+ is the main driver of ADAS semiconductor content until 2027

‒ Standard radar is the technology to detect distance and speed

‒ High-resolution radar significantly improves angle and classification

Market research companies; Infineon

2021 2027

The number of radar systems is expected to grow by 24% annually, driven by new applications and increasing penetration

Market research companies; Infineon

E/E architecture

Infineon strongly benefits from new E/E architectures that drive centralization of data and decentralization of power distribution

E/E architecture in a software-defined vehicle

New E/E architectures lead to more centralized processing of data and signal while more decentralized power distribution.

Components of E/E architecture and corresponding applications addressed by Infineon

High Performance Computing (HPC)	Safety companion MCU for service oriented SoCs, secure trust anchor, fail-safe power supply
Zone	Zone controller, gateway controller, incl. protocol translation, smart power distribution
Control	Smart real-time mechatronics (e.g. transmission, motor control, power steering, braking), BMS
Complex sensors and actuators	Radar, incl. signal pre-processing, bus connections, dedicated AI accelerators, camera
Simple sensors and actuators	Smart functional ECU (e.g. seat adjustment, power window, central lock, wiper), touch pad

~€800m NOR flash memory design-win in new E/E architecture for software-defined vehicle platform of North American OEM

› NOR flash memory designated a "key component" by OEM

SPI: Serial Peripheral Interface

Power distribution becomes a critical aspect of the E/E architecture and the SW-defined vehicle

Smart switches are mandatory for SAE L3 and above Infineon's revenue growth

• ‒ Superiority of semiconductors over fuses and relays:
  • ‒ Fast failure isolation (< 500 µs) and activation of an alternative supply
  • ‒ Configurable wire protection
  • ‒ Diagnosis and non-destructive recovery
• ‒ Mandatory for SAE levels L3, L4 and L5
• ‒ Growth of smart switches per car:
  • ‒ Volume OEMs: from today's ~50 pieces/car towards ~200 pieces/car by 2028+
  • ‒ Innovator OEMs: already ~200 pieces/car today

Industry-leading, premium lighting technology offers enhanced user experience on the road

Key facts

• ‒ Infineon driver IC controls each of the 16K µLEDs individually with outstanding luminous intensity
• ‒ Lead customer: German premium OEM
• ‒ Next-generation lighting technology under development

Nichia high-definition micro-pixel light source (HD µPLS)

Courtesy: Nichia Courtesy: Audi AG

Infineon and Continental to cooperate in the development of server-based vehicle E/E (electrical/electronic) architectures

Continental using Infineon's AURIX™ TC4x MCU for its zonal platform

• ‒ Organized and efficient E/E architecture with central highperformance computers (HPC) and a few, powerful zone control units (ZCU) instead of up to a 100+ individual control units
• ‒ The AURIX™ TC4x was designed for usage in ZCUs and as support unit in HPCs
• ‒ Architecture allows essential software programs to be almost constantly on stand-by
• ‒ State-of-the-art cybersecurity functions, developed according to the ISO/SAE 21434-certified process
• ‒ RRAM (Resistive Random Access Memory) technology allows performance expansion, power consumption
• reduction, and cost improvement ‒ In the E/E architecture of the future, a ZCU bundles all electronic and electrical connections in a local section of the vehicle
  • ‒ Bundling the software components centrally will thereby increase cybersecurity and updatability

Infineon awarded for BYD's new E/E architecture based on zonal platform

Design-win for three zones

‒ New E/E architecture enabling efficient MCU setup and smart power distribution

• ‒ MCU: TRAVEO™ 2G (2 MB to 8 MB on-chip memory)
• ‒ Intelligent power devices (IPDs): PROFET™ +2 high-side switch

P2S solution levering combined Infineon product advantages

Green Industrial Power

GIP at a glance

GIP revenue and Segment Result Margin FY23 revenue split by product group

Key customers

0 500 1.000 1.500 2.000 2.500

Clear leader in discrete IGBTs and IGBT modules

1 Including MOSFET-based IPMs and IGBT-based IPMs

2 Including standard (non-integrated) IGBT modules and power integrated modules (PIMs)/converter inverter brake (CIB) modules. Based on or includes content supplied by Omdia, "Power Semiconductor Market Share Database 2022", Final Version V2 September 2023. Results are not an endorsement of Infineon Technologies AG. Any reliance on these results is at the third party's own risk.

Positive outlook in Green & Efficient Energy applications and moderate growth in Drives confirm positive GIP market outlook

Applications % of FY23 segment revenue1	Market outlook for CY24
~26% Renewable Energy Generation	‒ Photovoltaic installations continue to grow supported by demand for green hydrogen ‒ Growth in wind installations mainly relies on onshore projects (85% onshore, 15% offshore)
~11%	‒ Growth in EV charging infrastructure is further fueled by government programs
Power Infrastructure	‒ Grid requirements for expansion, modernization and flexibility drive growth in Transmission & Distribution as well as storage solutions
~12%	‒ Rail transportation units expected to grow high single digits
Transportation	‒ E-bus outpacing EV adoption rate and rapid improvement in economics of e-trucks
~28%	‒ Market research expects to enter a period of adjustment with drives demand bottoming in H2 CY24
Automation & Drives	‒ Global diversification of manufacturing operations support midterm growth
~11% Heating, Ventilation,	‒ Steady residential and commercial demand growth for air condition expected, government support for the housing in China would be an additional stimulus
Air condition	‒ Focused policies in several countries support heat pump demand
~6% Home	‒ Limited visibility for a recovery overall
Appliance	‒ Green shoots in selected areas such as smart appliances

Decarbonization & Digitalization are the driving forces for

Cutting CO2 emissions in all sectors

*Depending on IEA scenario (STEPS or NZE)

Electricity 28-52%*

IEA, Global energy-related CO2 emissions by sector, IEA, Paris

https://www.iea.org/data-and-statistics/charts/global-energy-related-co2-emissions-by-sector, IEA. License: CC BY 4.0 (Status: 26 October 2022), https://www.iea.org/news/global-co2-emissions-rose-less-

than-initially-feared-in-2022-as-clean-energy-growth-offset-much-of-the-impact-of-greater-coal-and-oil-use (Status: 2 March 2023)

* EJ (Exajoule) = 278 TWh

Increasing electricity demand

IEA (2022), World Energy Outlook 2021, IEA, Paris https://www.iea.org/reports/world-energy-outlook-2022, p 414 for STEPS and p 447 for NZE by 2050 scenario.

Huge potential along entire green energy chain until 2030 according to IEA Net Zero scenario

Photovoltaic	+4,200 GW
Wind power	+2,400 GW

Generation	Infrastructure	Consumption
------------	----------------	-------------

Grid network	\$600bn annual investments
Grid storage	+660 GW	H Fuel Cell1 2
EV Charging	+32m chargers	eAviation eMarine
Electrolysis	+720 GW (pipeline: 240 GW)

Heat pump	+420m units
Fuel Cell1 H 2	+200k FC EV +200k FC Trucks

Note: Based on Net Zero Scenario (IEA) | Source: IEA, ¹ Internal Analysis

Green energy generation provides large business opportunities

Power semiconductor content by application

1 IEA: Net Zero by 2050 – A Roadmap for the Global Energy Sector. May 2021; Sector Tracking reports September 2022; internal Analysis | ²Based on 240 GW pipeline, >100% based on NZE requirements

GIP markets accelerate growth – enabling green energy and driving decarbonization

Key facts

• ‒ The acceleration of the energy transition drives GIP markets ‒ SiC penetration accelerates ‒ SiC is a key point of
  • differentiation and drives GIP profitability

Decarbonization of heating

Heat pump

• ‒ Heat pumps play a crucial role in the decarbonization of heating. EU objective: 60m heat pumps by 2030 (15m current installed base). This translates to a 22% CAGR.
• ‒ Infineon offers full solution Power: Modules, discretes, IPMs Si and SiC Control: MCU, sensors Usability: HMI Connectivity and Security

Major design-win in Europe: Low-power modules using SiC and IGBT8 for different power classes.

Energy efficient and reliable rail transport is key to reducing the greenhouse gas emissions

Traction application – Key requirements

• ‒ Energy efficiency
• ‒ High power density
• ‒ Long lifetime (> 30 years) with demanding mission profiles

3.3 kV CoolSiC™ MOSFET XHP™ 2

• ‒ 10% overall losses reduction
• ‒ 10% to 25% system volume reduction
• ‒ Robust modules with high cycling capabilities
• ‒ Less noise

Enjoy the silence

We have a complete system solution for the fast growing EV Charger market

EV charging is an attractive business opportunity Infineon extends its market leadership

[\$ m]

• ‒ Significant CRA signed for EASY 3B SiC-modules
• ‒ Infineon offers the full solution for power conversion, control and connectivity

Infineon is manifesting its leading position in the industrial SiC market with above market 5y CAGR and strong outlook

¹ Excluding Auto Drivetrain

Power & Sensor Systems

PSS at a glance

PSS revenue and Segment Result Margin FY23 revenue split by product group

Key customers

0 500 1.000 1.500 2.000 2.500 3.000 3.500 4.000 4.500

Weakness in most verticals to persist with expected improvement during the course of CY 2024

Applications % of FY23 segment revenue1		Market outlook for CY24
	~15%	‒ Server weakness continues in H1 CY24 with potential recovery in H2 – benefits from AI opportunities due to increasing semi content
	Computing	‒ PC market shipments are expected to recover in course of CY24, but to remain below pre-pandemic levels
	~10%	‒ Total telco capex is forecasted to be flattish and slightly negative in wireless
	Communications	‒ Demand in H1 CY24 expected to be weak with some upside potential in H2
	~7% Smartphones	‒ In CY24 y-o-y growth in smartphone shipments expected, recovery should increase momentum in in H2
	~24% Consumer	‒ Weak macro environment and related inventory digestion expected to persist in H1 CY24, return to growth possible in H2
	~35% Industrial	‒ Flattish y-o-y development expected as weakness in residential solar and automotive markets occurred towards end of CY23. This leads to a reduction in growth prospects

¹ Does not sum up to 100% due to other applications not shown here

PSS's growth is built on many applications from different sectors in power and non-power

• ‒ Data center
• ‒ Enterprise server
• ‒ PC, notebook
• ‒ Peripherals
• ‒ Chargers and adapters

Computing Communications Smartphones Consumer Industrial

• ‒ Base stations
• ‒ Backhaul cellular infrastructure
• ‒ 5G massive MIMO
• ‒ Telecommunication servers

• ‒ Smartphones
• ‒ Mobile devices
• ‒ Wearables
• ‒ USB Type-C,
  • USB Type-C PD

• ‒ eBikes, eScooter
• ‒ Multicopter
• ‒ Gaming
• ‒ TV sets
• ‒ Smart home

• ‒ Power supplies
• ‒ EV on-board charger
• ‒ Charging infrastructure
• ‒ PV inverter
• ‒ Power tools
• ‒ Lighting
• ‒ Industry 4.0
• ‒ Aerospace

PSS – Power

Infineon is the clear leader in MOSFETs, additional growth potential in power ICs

2.8% 3.5% 3.7% 4.1% 4.2% 4.3% 5.3% 11.0% 12.6% 26.7% Silan CR Micro Renesas Nexperia Alpha & Omega Vishay Toshiba STMicro onsemi Infineon Discrete Power MOSFETs¹ 2022 total market: USD 13.1bn

Power ICs²

2022 total market: USD 32.3bn

¹ Discrete Power MOSFET market includes automotive MOSFETs, Si Power MOSFETs, SiC Power MOSFETs, Si Protected MOSFETs and GaN Power Transistors | ² Power IC market includes automotive power ICs. Based on or includes research from Omdia: Power Semiconductor Market Share Database 2022. September 2023. | Results are not an endorsement of Infineon Technologies AG. Any reliance on these results is at the third party's own risk.

Industry-leading solutions and technology partnerships in AI and hyperscale

Infineon with full system offering from grid to GPU/CPU enabling best-in-class system performance and total cost of ownership for high performance computing platforms

Per AI board our potential BOM lies between US\$50 and US\$200

depending on architecture of customer system and products designed in

More to come at Power Roadshow end of November

Infineon components enable best power usage effectiveness for data centers

Supermicro collaborates with Infineon on green computing

Supermicro MicroBlade servers contain …

• ‒ Infineon's power stages provide the best power efficiency in the industry
• ‒ Infineon's power IC's high temperature tolerance and excellent reliability enables operations at high ambient temperature → less energy-intense external cooling needed

Example

In one use case¹ , the end customer of Supermicro's MicroBlade server saved 56% in data center space utilization, 45% in capex and \$13m/year in electricity. This led to customer's data center power usage effectiveness (PUE) of 1.061

An ideal PUE value is 1.0, which means that all the power required for a data center is in the actual computing devices, not in overhead costs such as cooling or power conversion. According to recent research² , IT and data center managers reported an average annual PUE ratio of 1.57 at their largest data centers.

¹ Source: https://www.supermicro.com/CaseStudies/CaseStudy\_Fortune100.pdf

² Statista Research Department: Data center average annual power usage effectiveness (PUE) worldwide 2007-2021. July 21, 2022.

PSS is a key enabler for residential solar systems

• ‒ Innovative MOSFET transistors for MV & HV applications in all technologies: OptiMOS™, CoolMOS™, CoolSiC™, CoolGaN™
• ‒ Isolated gate driver and GaN driver ICs for high system level efficiencies, excellent power density and consistent system robustness
• ‒ CoolSET™ integrated power stages for auxilliary power supply
• ‒ Digital isolaters enables safe signal transfer

Full portfolio breadth for solar Enabling residential solar energy systems

Partnering with leading customers of the industry

Securing customer and market growth by entering into long-term strategic agreements Growing above industry CAGR with the leading customers of the industry

Transition to 5G drives demand in power semis for antennas and power supplies

Massive growth of data and computing power

Driver #2

Higher number of base stations due to dense network

Driver #3

~ 4x higher power semi content per radio board: From ~\$25 for MIMO antenna to ~ \$100 for massive MIMO antenna array

Driver #4

Fog computing data center as a completely new market

PSS – RF and Sensing

Main applications addressed by PSS sensors portfolio

Main applications

• ‒ Smartphone
• ‒ True wireless stereo headsets
• ‒ Smart speaker
• ‒ Laptop & tablet
• ‒ Automotive
• ‒ Smart home
• ‒ TV
• ‒ Security camera
• ‒ Smart building
• ‒ Smartphone: World-facing and user-facing
• ‒ Robotics
• ‒ Automotive in-cabin sensing
• ‒ Payment terminals
• ‒ Heating, ventilation, air conditioning (HVAC)
• ‒ Air purifier
• ‒ Smart thermostat
• ‒ CO² /virus risk reduction

Sensor markets targeted by PSS offer attractive growth potential

1 Infineon is addressing smart building, smart home, smart appliances, consumer IoT devices and automotive. Source: Infineon estimates

MEMS microphone market Radar IC market (24 GHz and 60 GHz only)

Environmental sensor market¹ 3D ToF image sensor market

Infineon as market leader has significantly increased the distance to #2

Infineon's market share development in MEMS microphones (by units)

Based on or includes research from Omdia: MEMS Microphones Report Dice Market Shares 2022. October 2022. Results are not an endorsement of Infineon Technologies AG. Any reliance on these results is at the third party's own risk.

2.8% 3.2% 8.4% 35.6% 45.0% NJRC Omron MEMSensing Knowles Infineon total market: 6.7bn units

2021 MEMS die market share

New XENSIV™ MEMS microphone with very low power consumption

• ‒ New PDM (pulse density modulation) microphone is based on Infineon's latest Sealed Dual Membrane MEMS technology
• ‒ Offers unmatched SNR of 69 dB(A) that enables crystal-clear audio experience
• ‒ Needs half of current consumption compared with available models on the market with similar performance
• ‒ This leads to a long battery life and is therefore perfect suited for hearable applications like true wireless earbuds, over-ear headsets, and hearing enhancement devices

Connected Secure Systems

CSS at a glance

CSS revenue and Segment Result Margin FY23 revenue split by product group

Key customers

0 500 1.000 1.500 2.000 2.500

Market outlook is affected by macroeconomic conditions; risks continue especially for consumer segments

Applications % of FY23 segment revenue Market outlook for CY24 ‒ Continued macro economic risks limit growth, while trends of Industry 4.0 and Industrial IoT remain ‒ Stabilization of market growth after post-Covid peak in ePassports, while demand remains high ‒ Although penetration of smart appliances increases, potential deterioration of consumer sentiment limits growth ‒ Stabilization of macroeconomic environment could trigger growth in smart home segments, while risks related to consumer spending prevail ‒ Stabilization of macroeconomic environment could support growth in devices like smartwatches, while risks related to consumer spending prevail ‒ Overall automotive market might slow down after more positive development expected in 2023, while risks due to macroeconomic conditions persist ‒ Stabilization of market as capacities catch up with demand and signals of inventory restocking to historical levels ‒ Main consumer markets are projected to recover later in FY24 as the macroeconomic environment and consumer sentiment improve; however no sharp rebound expected ~37% Smart cards ~63% Industrial and Consumer IoT Industrial IoT Home Appliances Smart Home Health & Lifestyle Media, Game & Compute Automotive Payment Identification

CSS empowers the world to easily connect through smart and trusted solutions

Infineon's USP to capture the IoT market potential

ABI Research: Wireless Connectivity Technology Segmentation and Addressable Markets – Q2 23 June 2023; excluding Chromebooks, desktop PCs, feature phones, media tablets, netbooks, smartphones, white box tablets.

Financial synergy success marked by our journey to becoming a leading IoT solution provider

CSS offers a compelling product portfolio and roadmap for IoT

Microcontrollers (PSoC™ and XMC™) AIROC™ Wi-Fi and Combos

• ‒ PSoC™ family for general purpose, XMC™ family for industrial
• ‒ Strength in low power, high performance, and capacitive touch sensing
• ‒ Compelling roadmap focused on AI, security, and integrated connectivity

• ‒ Wi-Fi standalone and Wi-Fi & Bluetooth® Combo chips for end devices
• ‒ Focus on innovation for IoT applications: reliability and power
• ‒ Strong leader for battery-operated Wi-Fi
• ‒ Recent new product introduced Wi-Fi 6 & 6E – the first IoT-focused product in the brand new 6 GHz band

AIROC™ Bluetooth®

• ‒ Portfolio of standalone and PSoC™ integrated Bluetooth® and Bluetooth® Low Energy products
• ‒ Strong position in wearables, gaming, remote controls, HID, and automotive
• ‒ Introducing new products to support the newest smart-home industry standard: Matter

ModusToolbox™ and Software

• ‒ ModusToolbox™ is a rich embedded software development toolset to accelerate and simplify development for Infineon MCUs, and the core development platform for Infineon software
• ‒ Strong set of SW features in MCU and connectivity SDK's
• ‒ CIRRENT™ is a cloud services platform for data-driven improvement of connectivity and delivery of innovative IoT services

Intelligence moves into devices - Edge-AI is a key enabler of IoT and beyond, offering a significant market opportunity

Edge-AI and benefits

Tiny ML worldwide device shipment

Infineon's Edge-AI enabling ecosystem allows for portfolio expansion to offer differentiated solutions for smarter IoT devices

Infineon's ecosystem as an

Edge-AI optimized hardware products from Infineon

products from Infineon	enabler for Edge-AI
MCU	Infineon's software ecosystem
Connectivity	End-to-end machine learning toolchain
+ Sensors	= AI partners
Additional Infineon products	Digital CIRRENT™ services

Differentiated Edge-AI based solutions for a broad selection of use cases

Going forward, we will capture value through differentiated Edge-AI based solutions to enable new use cases for our customers

Examples for Infineon's differentiated Edge-AI based solutions

Infineon remains top player in security ICs

Security ICs (excl. NFC controllers; excl. NFC eSE)

2022 total market: \$3.6bn

Security ICs (excl. NFC controllers; excl. NFC eSE)

2022 by application

ABI Research: Smart Card and Embedded Security IC Technologies. October 2023.

Security solutions: Wide-spanning offering for trusted contactless transactions, trusted identities, and authentication

Device Authentication IoT Security

• ‒ Battery authentication
• ‒ Printer authentication
• ‒ Smart inhaler
• ‒ Wireless charging
• ‒ Customized authentication solutions

• ‒ Automotive Security
• ‒ Cellular IoT Nodes
• ‒ Industrial Security
• ‒ IoT Security
• ‒ Security in PC, Laptop & Tablets
• ‒ Smart Home

Payment Solutions

• ‒ Credit and debit cards
• ‒ Dual Interface biometric cards
• ‒ Smart wearables & accessories
• ‒ Tickets for public transport
• ‒ Smart connected systems

Identity Solutions

• ‒ Electronic passports
• ‒ ID cards
• ‒ Blockchain
• ‒ NFC tags

Selected financial figures

Strong presence in all regions; well-balanced customer portfolio; no customer represents more than 10% of total sales

Group financial performance

¹ See notes for definition

Automotive (ATV)

• ‒ Further revenue increase driven by broad-based demand and market share gains in microcontrollers
• ‒ Incremental margin increase due to continuous growth trajectory, positive mix effects and stable pricing
• ‒ For FY24 we expect low double-digit sales growth and a segment result margin between 25% and 28%
• ‒ €40bn design-win volume in last 3 years exceeding expectations

Green Industrial Power (GIP)

• ‒ Revenue growth driven by renewable energy, power infrastructure, automation and drives
• ‒ Continued strong demand for applications related to decarbonization, energy storage systems, grid and charging infrastructure
• ‒ Fully confirming our SiC targets with 50% growth in FY24 both from industrial and automotive customers

Power & Sensor Systems (PSS)

• ‒ Revenue development reflecting a downswing in consumer, computing and communications markets
• ‒ Marco environment for end market applications remains weak we do not expect sales volumes to pick up before second half of FY24, following inventory digestion
• ‒ Successful completion of GaN Systems acquisition accelerating our GaN roadmap and further enhancing our leadership in power systems

Connected Secure Systems (CSS)

‒ Robust demand for security solutions offsetting a weaker development of connectivity components and general purpose microcontrollers for IoT applications

• ‒ Segment result margin step-down due to negative ship and debit effects, indirect effects from manufacturing cost and slightly higher OPEX from R&D projects
• ‒ Strong growth potential in IoT remains undiminished, successful acquisition of 3db Access complements our wireless portfolio with UWB

Gross margin and Opex

Therein non-segment result charges [EUR m]

Adjusted gross margin

Therein non-segment result charges [EUR m]

Therein non-segment result charges [EUR m]

12 10 8 12 12 56 53 54 55 57
---------------------------------------------------------

Investments, Depreciation & Amortization and Free Cash Flow

Working Capital, in particular trade working capital components

Trade receivables Trade payables

¹ See notes for definition

Inventories

Earnings-per-share and total cash return

Development of earnings-per-share (EPS) from continuing operations

Total cash return to shareholders via dividends

• ‒ Proposed dividend for FY23: €0.35 per share
• ‒ Proposed dividend payout of €456m for FY23

Return on capital employed

Historical development

Liquidity development

Historical liquidity development

[EUR m]

Conservative financial policy and strict commitment to investment-grade rating are the basis for through-cycle flexibility

	Financial Policy Targets	Status Quo (LTM 30 September 2023)
Gross Cash1	€1bn + at least 10% of revenues → €2.6bn €1bn + 16% of revenues → €3.6bn
Gross Debt2	≤ 2.0x EBITDA 0.8x EBITDA
Comfortable liquidity position	‒ Flexibility for financing operating activities and investments through the cycle ‒ Cushion for net pension liabilities and contingent liabilities
Balanced debt position	‒ Gross debt target commensurate with investment-grade rating ‒ Successful de-leveraging offers ample headroom
Rating	Investment grade	BBB positive outlook (by S&P Global Ratings)

¹ Gross cash position is defined as cash and cash equivalents plus financial investments | ² Gross debt is defined as short-term debt and current maturities of long-term debt plus long-term debt. EBITDA is calculated as the total of earnings from continued operations before interest and taxes plus scheduled depreciation and amortization

Maturity profile

Maturity profile from 2023 to 2034

[EUR m; US\$ m; nominal values]

¹ On 1 Oct 2019, Infineon issued a perpetual hybrid bond with two tranches: €600m with first call date in 2025 and €600m with first call date in 2028; both are accounted as equity under IFRS.

Disclaimer

Disclaimer

This presentation contains forward-looking statements and/or assessments about the business, financial condition performance and strategy of the Infineon Group.

These statements and/or assessments are based on assumptions and management expectation resting upon currently available information and present estimates. They are subject to a multitude of uncertainties and risks, many of which are partially or entirely beyond Infineon's control. Infineon's actual business development, financial condition, performance and strategy may therefore differ materially from what is discussed in this presentation.

Beyond disclosure requirements stipulated by law, Infineon does not undertake any obligation to update forward-looking statements.

Specific disclaimer for S&P Global reports, data and information referenced in this document:

The S&P Global reports, data and information referenced herein (the "S&P Global Materials") are the copyrighted property of S&P Global Inc. and its subsidiaries ("S&P Global") and represent data, research, opinions or viewpoints published by S&P Global, and are not representations of fact. The S&P Global Materials speak as of the original publication date thereof and not as of the date of this document. The information and opinions expressed in the S&P Global Materials are subject to change without notice and neither S&P Global nor, as a consequence, Infineon have any duty or responsibility to update the S&P Global Materials or this publication. Moreover, while the S&P Global Materials reproduced herein are from sources considered reliable, the accuracy and completeness thereof are not warranted, nor are the opinions and analyses which are based upon it. S&P Global and the trademarks used in the Data, if any, are trademarks of S&P Global. Other trademarks appearing in the S&P Global Materials are the property of S&P Global or their respective owners.

Glossary

AC	alternating current
ACC	adaptive cruise control
AD	automated driving
ADAS	advanced driver assistance system
AEB	autonomous emergency braking
AI	artificial intelligence
AR/VR	augemented/virtual reality
BEV	battery electric vehicle
BLE	bluetooth low energy
BMS	battery management system
BoM	bill of materials
BPA	bisphenol A
CAV	commercial, construction and agricultural vehicles
CMOS	complementary metal-oxide-semiconductor
DC	direct current
DSC/SSC	double/single sided cooling
E/E	electrical/electronic architecture
ECU	electronical control unit
eSE	embedded secure module
eSIM	embedded subscriber identity module
EMS	electronics manufacturing service
ESS	energy storage system
EV	electric vehicle
FCEV	full cell electric vehicle
FHEV/MHEV	full/mild hybrid electric vehicle
FoM	figure of merit
F-RAM	ferroelectric memory
GaN	gallium nitride
HEMT	high-electron-mobility transistor
HID	human interface device
HMI	human machine interaction
HV	high voltage
HVAC	heating, ventilation, air conditioning
IC	integrated circuit

ICE	internal combustion engine
IGBT	insulated gate bipolar transistor
IoT	internet of things
IPM	intelligent power module
LED	light-emitting diode
MCU	microcontroller uni
MEMS	micro electro-machanical systems
MHA	major home appliances
MIMO	multiple input, multiple output
ML	machine learning
MNO	mobile network operator
MOSFET	metal-oxide silicon field-effect transistor
MV	medium voltage
NFC	near-field communication
OBC	on-board charger
OEM	original equipment manufacturer
P2S	Infineon's strategic product-to-system approach
PD	power delivery
PHEV	plug-in hybrid electric vehicle
PMIC	power management integrated circuits
PoL	point of load
PSoC	programmable system-on-chip
PUE	power usage effectiveness
PV	photovoltaic
RAM	random access memory
RF	radio frequency
SAE	Society of Automotive Engineers
SDK	software development kit
Si	silicon
SiC	silicon carbide
SNR	signal-to-noise ratio
ToF	time-of-flight
UWB	ultra-wideband
WBG	wide-band gap, specifically referring to SiC and GaN based devices

Notes and ESG footnotes

Investments =	'Purchase of property, plant and equipment' + 'Purchase of intangible assets and other assets' incl. capitalization of R&D expenses
Capital Employed =	'Total assets' – 'Cash and cash equivalents' – 'Financial investments' – 'Assets classified as held for sale – ('Total Current liabilities' – 'Short-term debt and current maturities of long-term debt' – 'Liabilities classified as held for sale')
RoCE =	Operating profit from continuing operations after tax/Capital Employed = ('Operating profit' – 'Financial result excluding interest result' – 'Share of profit (loss) of associates and joint ventures accounted for using the equity method'-'Income tax')/Capital Employed
Working Capital =	('Total current assets' – 'Cash and cash equivalents' – 'Financial investment' – 'Assets classified as held for sale') – ('Total current liabilities' – 'Short term debt and current maturities of long-term debt' – 'Liabilities classified as held for sale')
DIO (days inventory outstanding; quarter-to-date) =	('Net Inventories'/'Cost of goods sold') x 90
DPO (days payables outstanding; quarter-to-date) =	('Trade payables'/['Cost of goods sold' + 'Purchase of property, plant and equipment']) x 90
DSO (days sales outstanding; quarter-to-date) =	'reimbursement obligations')1 ('Trade receivables' - /'revenue' x 90

Order backlog = The total amount of orders received regardless of their current status

ESG footnotes:

• 1) This figure takes into account manufacturing, transportation, own vehicles, travel, raw materials and consumables, chemicals, water/waste water, direct emissions, energy consumption, waste, etc. as well as direct and indirect energy-related emissions by manufacturing service providers. It is based on data collected internally and publicly available conversion factors and relates to the 2021 fiscal year.
• 2) This figure is based on internally established criteria, which are described in the explanatory notes. The figure relates to the 2020 calendar year and takes into account the following application areas: automotive, LED, induction cookers, servers, renewable energy (wind, photovoltaic) and cell phone chargers as well as drives. CO² savings are calculated based on the potential savings generated by technologies in which semiconductors are used. The CO² savings are allocated based on Infineon's market share, semiconductor share, and the lifetime of the technologies concerned, based on internal and external experts' estimations. Despite the fact that carbon footprint calculations are subject to imprecision due to the complex issues involved, the results are nevertheless clear.
• 3) Carbon neutrality is defined in terms of Scope 1 and Scope 2 emissions.

Financial calendar

Date	Event	Location
16 - 17 Nov 2023	Morgan Stanley European TMT Conference	Barcelona
27 - 28 Nov 2023	Power presentation (GIP, PSS) and roadshow with Peter Wawer, Head of GIP and Adam White, Head of PSS	Paris
28 - 29 Nov 2023	UBS TMT Conference	Scottsdale
30 Nov 2023	Société Générale The Premium Review	Paris
4 Dec 2023	Stifel Roadshow	Frankfurt
6 Dec 2023	Berenberg European Conference	Pennyhill Park
6 Feb 20241	Earnings Release for the First Quarter of the 2024 Fiscal Year
23 Feb 20241	Annual General Meeting
7 May 20241	Earnings Release for the Second Quarter of the 2024 Fiscal Year
5 Aug 20241	Earnings Release for the Third Quarter of the 2024 Fiscal Year
12 Nov 20241	Earnings Release for the Fourth Quarter of the 2024 Fiscal Year

¹ Preliminary

Institutional Investor Relations contacts

Alexander Foltin

Executive Vice President Finance, Treasury & Investor Relations

+49 89 234-23766 alexander.foltin@infineon.com

Daniel Györy

Senior Director Investor Relations

+49 89 234-35078 daniel.gyoery@infineon.com

Alexander Groschke

Director Investor Relations

+49 89 234-38348 alexander.groschke@infineon.com

Visitor address

Germany

885579 Neubiberg

Isabell Diel

Senior Manager Investor Relations

+49 89 234-38297 isabell.diel@infineon.com

Holger Schmidt

Director Investor Relations

+49 89 234-22332 holger.schmidt@infineon.com