Infineon Technologies AG

Investor Presentation • Nov 15, 2022

Fourth Quarter FY 2022 Quarterly Update

Infineon Technologies AG Investor Relations

Infineon at a glance

Financials FY22 revenue by product category

~5%	memory ICs
~10%	RF & sensors
~30%	embedded control and connectivity
~55%	power semi conductors
of total revenue		ATV	IPC	PSS	CSS

Infineon is a global player, clear #1 in power semiconductors, and ranked #4 in the overall microcontroller market

MCU suppliers 2021 total market: USD 22.0bn¹ Power discretes and modules 2021 total market: USD 27.5bn² Semiconductor suppliers 2021 total market: USD 592bn¹ 12.9% 12.7% 6.2% 5.0% 4.9% 3.6% 3.5% 2.9% 2.9% 2.7% 2.3% 2.2% Intel Samsung SK Hynix Qualcomm Micron Broadcom nVidia MediaTek Texas Instr. AMD Infineon Apple 17.2% 16.6% 15.3% 13.8% 12.5% 6.8% 2.0% 1.8% 1.2% 1.1% NXP Renesas STMicro Infineon Microchip Texas Instr. Nuvoton GigaDevice Samsung 2.4% Silicon Labs 2.4% 2.5% 3.6% 4.0% 4.3% 5.2% 6.6% 7.5% 19.7 Rohm Nexperia Renesas Vishay Toshiba Fuji Electric Mitsubishi STMicro onsemi Infineon

1 Based on or includes research from Omdia: Annual 2001-2021 Semiconductor Market Share Competitive Landscaping Tool – 2Q22. August 2022. 2 Based on or includes research from Omdia: Power Semiconductor Market Share Database – 2021 – Final V2. October 2022. Results are not an endorsement of Infineon Technologies AG. Any reliance on these results is at the third party's own risk.

Well-balanced portfolio among segments and key applications, highest growth coming from Decarbonization and Digitalization

FY22 revenue of €14,218m by segment and key application

Supported by …
P2S From product thinking to system understanding	Software capability	Digital marketing and sales Eye-level strategic partnerships

Leader in Power Systems: Infineon enabling decarbonization by delivering maximum value to customers with holistic system approach

POL (point of load): PMIC + Driver IC + MOSFETs | Power stage: Driver IC + MOSFETs

Infineon at the core of IoT – driving digitalization by serving strongly growing multi-application markets

Upgraded Target Operating Model: committing to more ambitious financial goals and being the sustainability leader

Double-digit growth ahead – five key applications account for ~60% of growth; well-diversified divisional split

Upgraded Target Operating Model: Significant margin expansion through the cycle

Free Cash Flow generation increasing over the cycle, driven by profitable growth and better asset efficiency

• › Accretive investments into high organic growth
• › Operating cash flow expected to outgrow investments
• › Differentiated in-house manufacturing complemented by ~40% outsourcing share over time
• › FY23-27: ~€3.5bn cum. investments into major frontend buildings

Adj. Free Cash Flow target: 10-15% of sales, excl. major frontend buildings

Outlook for Q1 FY23 and FY23

	Outlook Q1 FY231	Outlook FY231
Revenue	~€4.0 bn	€15.5 bn +/- €500 m
Adj. Gross Margin		~45%
Segment Result Margin	~25%	~24%
FCF/adj. FCF		~€0.8 bn/~€1.5 bn
Investments		~€3.0 bn
D&A		~€1.9 bn2

1 Based on an assumed average exchange rate of \$1.00 for €1.00 2 Including the amortization of around 450 million Euros from purchase price allocations

ESG: targets and achievements

Our 2030 carbon neutrality goal is aligned with the Paris Climate Agreement's 1.5° target

Net ecological benefit: CO² emissions reduction of more than 97 million tons

On the road to carbon neutrality³ we achieved significant milestones by

• › Using green electricity in Europe and North America
• › Completing abatement system in Kulim

Infineon's CO² target³ by 2025 and 2030

Net CO² emissions in million tons of CO² equivalents

1, 2, 3: For further explanation see "ESG footnotes" in the appendix

	Rating/Score	Scale	Date
MSCI ESG	AA	CCC to AAA	05/2022
CDP	B climate scoring B water scoring	F to A	12/2021
Ecovadis	99th percentile "Platinum" award	0 to 100	02/2022
Dow Jones Sustainability Index	83 Dow Jones Sustain ability™ World and Europe Index listing	0 to 100	11/2021
Ethibel Sustainability Index Excelence Europe"	Index member	-	05/2020
ISS ESG Corporate Rating	B Prime Status	D- to A+	01/2021
FTSE4Good Index	Index member	-	06/2021
Euronext Vigeo Eurozone 120 Index Euronext Vigeo Europe 120 Index	Indices member	-	05/2021
Sustainalytics	Top ESG performer	-	01/2022

Infineon's wide bandgap strategy

Transition to WBG will vastly differ by application with Si expected to remain technology of choice for many of them

30% market share target in SiC by end of decade underpinned by significant capacity expansion

Infineon is well positioned for strong SiC market growth

Steep ramp enables market share gains

SiC momentum further accelerating: significant new design-wins in auto, continuous leadership in industrial applications

Close to €3bn design-win volume in last 4 months

More than 3,600 active customers being served

With its comprehensive SiC strategy Infineon is mastering all key success factors

SiC raw material supply

• › 4 qualified SiC wafer and boule suppliers – more to come
• › Cold Split technology increases productivity, especially in 8 inch

Superior trench technology

• › 1 2 generations ahead of competition
• › 30% more chips per wafer than planar

Packaging portfolio

• › Best-in-class in-house packaging solutions
• › New .XT technology for highest power density

Deep system understanding

• › Decades of experience in automotive and industrial power
• › Broadest portfolio: off-the-shelf plus customized solutions

than one product in the test are shown with the best performing device

Reliability

planar

High

Infineon trench

Gen 1

Gen 2

Our Cold Split technology leads to significant reduction of raw material losses during SiC manufacturing

GaN: immense market opportunity with Infineon achieving significant design-wins across key power applications

GaN market overview

for power and RF (GaN-on-Si) applications

Source: Yole: Compound Semiconductor Market Monitor-Module 1 Q3 2022.

GaN design-wins of around €1.5 bn

Strong design-win momentum for power and RF applications

Charger	Adapter	Power	Server
		antennas for 5G	(High voltage)
	Infineon key success factors
› Integrated device manufacturer › #1 patent portfolio for GaN – around 300 patent families

› Enable dual-site 8-inch in-house production

Automotive

ATV at a glance

ATV revenue and Segment Result Margin FY22 revenue split by product group

Key customers

$\cdot$ APTIV $\cdot$	Astemo	$\circledR$ BOSCH		DENSO
HYUNDAI MOTOR GROUP		veoneer	vilesco TECHNOLOGIES

Automotive semiconductor market expected to continue its growth journey

• › Positive momentum for xEVs expected to continue: more models, denser charging infrastructure, regulations

• › However, further increase in battery raw material contract prices (esp. for Li, Ni, Co) may trigger next round of xEV car price increase

• › Growth of L1, L2 and L2+ expected to continue

• › L3 shipments will grow from a rather small base supported by additional L3 model launches
• › First commercial robotaxi projects in operation; roll-out in more and more cities

Infineon's top market position is built on system competence based on an industry-leading product portfolio

Automotive semiconductors (2021 total market: \$46.7 bn; +31.5% yoy)

• › total market grew by 31.5% yoy, reaching all-time-high of \$46.7bn, exceeding previous high in 2018 of \$38.2bn
• › growth clearly supported by content-per-car growth
• › #1 in power semiconductors; gaining 1.3%-pt thanks to outstanding position in booming xEV business
• › Undisputed #1 in automotive NOR Flash memory ICs

Strategy Analytics: Automotive Semiconductor Vendor Market Shares. March 2022.

Electromobility

xEV (PHEV + BEV) penetration continues on all-time high level globally in Q3 CY22, China with strongest increase

Source: Based on or includes content supplied by S&P Global Mobility, October 2022; EV Volumes, October 2022.

Infineon addresses 100% of power semiconductors for all drivetrains; BEV semi content expected to grow from ~\$1,000 to ~\$1,500 by 2027

1 Based on Strategy Analytics: Automotive Semiconductor Demand Forecast 2019 - 2028. July 2022; Infineon. "power" includes voltage regulators, ADCs and ASICs. 2 Due to missing ICE engine in BEV the weighted incremental semiconductor content for PHEV and BEV starts below the "~\$500" line.

Infineon offers the most comprehensive system solutions addressing all xEV segments: pure EV and all types of hybrids

Infineon offers a full portfolio for the control loop of an electric car

In 5 years, every second car will be fully or partially electrified; SiC to take lead over silicon in the 2027-2030 period

Based on or includes content supplied by S&P Global Mobility, September 2022; Infineon

Around 20 design-wins in SiC across all auto applications: traction inverter, OBC, DC-DC

Rapid execution of our BMS strategy showing great success

Infineon's comprehensive BMS portfolio Selected balancing IC customers

PMIC	Wireless communications ICs			High-volume OEM
Transceiver	Battery monitoring ICs
MCU F-RAM				Premium car OEM
Power switch Pressure sensor				Chinese bus OEM
Gas sensor Current sensor
Auxiliaries for thermal management (e.g., fan, pump etc.) MOSFET	Motor control IC	Security IC		NETA Auto
BMS BoM of ~€100 per vehicle

Automated Driving

Growth of L1/L2/L2+ is the main driver of ADAS semiconductor content until 2027

Market research companies; Infineon

The number of radar systems is expected to grow by 24% annually, driven by new applications and increasing penetration

We are shaping the transition to CMOS-based radar solutions; leader in radar ICs today and in MCUs by 2026

Yole: Radar for Automotive Database 2022. May 2022; Infineon

Growth of Infineon's CMOS-based radar ICs

• › Infineon's 28 nm CMOS radar IC is currently sampling
• › Overwhelming customer feedback regarding key performance indicators, especially signal-to-noise ratio and linearity which improves the operating range and object separability
• › CMOS radar IC market will take off by mid of the decade
• › Different partitioning options allow for tailor-made solutions

All major OEMs decided for Infineon radar solutions

User experience meets electrical/electronic (E/E) architecture

Software-defined cars will become a reality through architectural transformation; Infineon's MCUs to win big here

New E/E architectures offer benefits of

• › Hierarchical software
• › Fail-operational power distribution
• › Optimized power management
• › Reduced wiring harnesses

... leading to

• › More smart actuators
• › More smart sensors
• › Higher redundancy
• › Dependable electronics

... further fueling Infineon's MCU growth

Game changing innovations from Infineon are defining the digital cockpit of tomorrow

Augmented head-up display based on MEMS mirrors

Example #2 Emergency vehicle detection

Industry-leading, premium lighting technology offers enhanced user experience on the road

Key facts

• › Infineon driver IC controls each of the 16K µLEDs individually with outstanding luminous intensity
• › Lead customer: EU premium OEM ("Best light ever!")
• › Start of production: early 2023

Nichia high-definition micro-pixel light source (HD µPLS)

Advantages: Enhanced driving experience, higher safety, more energy efficient

Courtesy: Nichia Courtesy: Audi AG

Infineon's suite of motor control ICs lead the way to address fastgrowing comfort features

• › Comfort features making further inroads into cars; e.g., seats in a mid-range car feature about seven motors today
• › Up to ~€80 semiconductor BoM per vehicle for comfort features
• › Infineon's leading suite of motor control ICs fits ideally for all comfort applications

Application examples

Infineon's suite of motor control ICs

On average ~7 motors per seat

Industrial Power Control

IPC at a glance

IPC revenue and Segment Result Margin FY22 revenue split by product group

Key customers

Renewable energy generation, infrastructure & EV-charging continue to see very strong growth momentum

Applications (% of FY22 segment revenue)	Market Outlook for CY23
Automation and Drives ~35%	› Analysts have reduced unit growth while still forecasting market growth rates above long-term average › Customer market expectations remain optimistic for 2023
Renewable Energy Generation ~26%	› Growth rates remain strong for PV installations (24% YoY) › Wind growth rates will be weaker compared to PV, but project delays from 2022 are expected to be recovered during 2023 (18% YoY)
Power Infrastructure ~10%	› Growth in EV charging infrastructure is expected to remain strong (~50% YoY), supported by enhanced government programs › Further growth of ESS (34% YoY) and T&D due to energy infrastructure needs
~17%	› Strong demand for heat pumps and further potential for inverterisation act as growth drivers › We do not expect overall MHA demand recovery (e.g. global RAC output: -2%YoY)
Transportation ~5%	› Strong growth opportunities for CAV electrification and OBC expected › Traction market to stabilize, increased demand growth expected beyond CY23
Others ~7%	› Long-term positive outlook driven by general trend of electrification in emerging applications (e.g. eAviation, eMarine)

Clear leader in discrete IGBTs and IGBT modules

1 Including MOSFET-based IPMs and IGBT-based IPMs | 2 Including standard (non-integrated) IGBT modules and power integrated modules (PIMs) / converter inverter brake (CIB) modules. Based on or includes research from Omdia: Power Semiconductor Market Share Database 2021 – Final V2. October 2022. Results are not an endorsement of Infineon Technologies AG. Any reliance on these results is at the third party's own risk.

Infineon is the key enabler for Power Systems that are needed at every step of the entire power transformation chain

Renewable energy generation #1 semi enabler

powering ~50% of currently installed wind/solar capacity

Energy infrastructure

#1 semi enabler for ~2/3 of grid infrastructure incl. EV charging

Energy conversion and usage

#1 semi enabler

broadest portfolio covering all verticals leader in power density and efficiency #1 in vehicle electrification

Sources: Based on or includes research from Omdia: Power Discrete and Module Market Tracker – 2021, September 2022. Infineon market model.

Infineon will benefit from all CO² saving measures

Green energy generation provides large business opportunities

1 IEA: Net Zero by 2050 - A Roadmap for the Global Energy Sector. May 2021 | 2 Based on or includes content supplied by IHS Markit Climate and Sustainability Group: Grid Connected Energy Storage Market Tracker H1 2021. August 2021 3 Extrapolation; conservative assumption of equal ratio renewable generation to storage capacity

Increasing share of renewables requires stronger grid

Planned grid expansion in Germany

Source: Bundesnetzagentur

Infineon's 4.5 kV IGBT modules enable HVDC lines

• › HVDC High Voltage Direct Current lines are the technology of choice to strengthen the grid
• › Converter stations are equipped with power semiconductors
• › Infineon offers highly robust, low-loss 4.5 kV IGBT solutions
• › 6.5 kV IGBT is in development and will complement offering

4.5 kV IGBT module in IHV-B housing

Converter station

Source: Siemens Energy

Power & Sensor Systems

PSS at a glance

PSS revenue and Segment Result Margin FY22 revenue split by product group

Key customers

Long-term drivers are still valid but impact of current macro environment leads to persist in 2023

Applications (% of FY22 segment revenue)1	Market Outlook for CY23
Computing ~18%	› Enterprise server in slowdown, while hyperscaler still healthy, reduction in hyperscaler CapEx may follow › PC market expected to further slow down
Communication ~9%	› While slowing down in China, other geographies like North America, EU and India to continue 5G roll-out › MNO capex may be negatively impacted by macro
Smartphone ~12%	› Risk of continued weak smartphone market remains on the back of deteriorating macro environment with limited signs of recovery
Consumer ~25%	› Global decline in consumer confidence continues to create headwinds for consumer spending
Industrial ~32%	› Demand in renewable energy, EVs and EV charging expected to further accelerate › Stimuli packages for renewables and respective infrastructure to support growth in CY23

1 Does not sum up to 100% due to other applications not shown here

PSS's growth is built on many applications from different sectors in power and non-power

• › data center
• › enterprise server
• › PC, notebook
• › peripherals

• › chargers and adapters

• › base stations

• › backhaul cellular infrastructure
• › 5G massive MIMO
• › telecommunication servers

Computing Communications Smartphones Consumer Industrial

• › smartphones
• › mobile devices
• › wearables

• › USB Type-C, USB Type-C PD

• › eBikes, eScooter

• › multicopter
• › gaming
• › TV sets

• › smart home

• › power supplies

• › EV on-board charger
• › charging infrastructure
• › PV inverter
• › power tools
• › lighting
• › Industry 4.0
• › aerospace

PSS – Power

Infineon is the clear leader in MOSFETs; market share gains in MOSFETs as well as in power ICs, further growth potential in power ICs

1 Discrete Power MOSFET market includes automotive MOSFETs, Si Power MOSFETs, SiC Power MOSFETs, Si Protected MOSFETs and GaN Power Transistors | 2 Power IC market includes automotive power ICs. 3 Analog Devices acquired Maxim in August 2021 | 4 Renesas acquired Dialog Semiconductor in August 2021. Based on or includes research from Omdia: Power Semiconductor Market Share Database 2021 – Final V2. October 2022. Results are not an endorsement of Infineon Technologies AG. Any reliance on these results is at the third party's own risk.

Data center – AI hyperscaler and telecom/edge computing are driving the growth

Exponential increase in AI Training & Networking (ASIC/SoC/FPGA/CPU/ GPU) power level requires cutting-edge innovation in Device & Packaging technologies to solve power efficiency and density challenges

→ The bill of material is outpacing unit growth by a factor of ~1.3x.

1 Normalized overall power requirement per server board for x-comparison

Based on or includes research from Omdia: Data Center Server Equipment Market Tracker – 2Q21 Database. September 2021

Transition from 3G/4G to 5G drives demand in power semis for antennas and power supplies

• › driver #1: massive growth of data and computing power
• › driver #2: higher number of base stations due to dense network
• › driver #3: ~4x higher power semi content per radio board: from ~\$25 for MIMO antenna to ~\$100 for massive MIMO antenna array
• › driver #4: fog computing data center as a completely new market

PSS – RF and Sensing

Main applications addressed by PSS sensors portfolio

Sensor markets targeted by PSS offer attractive growth potential

3D ToF image sensor market Environmental sensor market*

* Infineon is addressing smart building, smart home, smart appliances, consumer IoT devices and automotive Source: Infineon estimates

Source: Infineon estimates

Infineon's market share development in MEMS microphones (by units)

Based on or includes research from Omdia: MEMS Microphones Report Dice Market Shares 2022. October 2022. Results are not an endorsement of Infineon Technologies AG. Any reliance on these results is at the third party's own risk.

Technological progression of Infineon XENSIV™ MEMS microphones

Connected Secure Systems

CSS at a glance

CSS revenue and Segment Result Margin FY22 revenue split by product group

Key customers

Market outlook is affected by weaker macroeconomic conditions posing risks especially for consumer segments

Infineon remains top player in security ICs

Security ICs (excl. NFC controllers; excl. NFC eSE) 2021 total market: \$3.2bn

Security ICs (excl. NFC controllers; excl. NFC eSE) 2021 by application

MCU and software are key for the success in IoT as they define the functionality and time-to-market of the device

Infineon is enabling the 'IoT at a fingertip' with robust and reliable touch solutions and reconfirming Cypress revenue synergies

Infineon as the leader¹ in Touch-HMI inherited through Cypress acquisition

>6 Billion

conventional buttons replaced

>100 Patents

filed for touch solutions

5 th generation of CAPSENSE™ controller in advanced analog/mixed-signal technology available

Infineon CAPSENSE™ technology in volume production in a wide range of applications

Metal proximity

Touchless gesture control

We are fully on track to reach or even overachieve the announced Cypress revenue synergy targets

1 Infineon estimate

With a broad set of key enabling technologies, Infineon is well positioned to capture growth opportunities

1 ABI Research: Wireless Connectivity Technology Segmentation and Addressable Markets. July 2021; excluding Chromebooks, desktop PCs, feature phones, media tablets, netbooks, smartphones, white box tablets.

Selected financial figures

Strong presence in all regions; well-balanced customer portfolio; no customer represents more than 10% of total sales

Group financial performance

Automotive (ATV)

• › All-time high revenue for a single quarter achieved
• › Positive development driven by volume, favorable pricing dynamics and a supportive US-Dollar exchange rate
• › Electromobility and automotive MCUs remain on a strong growth trajectory

Industrial Power Control (IPC)

• › Positive quarterly revenue development across all applications
• › Particularly strong demand in the areas of renewable energies, energy infrastructure and industrial drives
• › Decarbonization remains a strong structural driver for renewable energies and the related power infrastructure

Power & Sensor Systems (PSS)

• › Revenue increase supported by post-Shanghai lockdown recovery
• › Dynamic business trends in the fields of microinverters for roof-top solar systems, charging stations for electric vehicles and onboard chargers
• › Slowing demand in consumer products like silicon microphones for smartphones or power supply for PCs, notebooks, TVs and game consoles

Connected Secure Systems (CSS)

› Revenue increased in the areas of connectivity, microcontrollers, payment cards and governmental identification documents › Investments in R&D resources and subsequent cost charges burdened the segment result

Gross margin and Opex

Investments, Depreciation & Amortization and Free Cash Flow

Working Capital, in particular trade working capital components

Inventories [EUR m] [EUR m] [days] [days] [days] 61 69 69 66 66 1,569 1,682 1,777 1,863 2,260 111 113 121 124 120 Q4 FY21 Q1 FY22 Q2 FY22 Q3 FY22 2,181 2,319 2,540 2,834 Q4 FY22 3,081

Q4 FY21 Q1 FY22 Q2 FY22 Q3 FY22 Q4 FY22

1 For definition please see page "Notes"

2 Along with the integration of Cypress refund liabilities to customers are presented under "other current liabilities" instead of "trade receivables". Prior quarters' figures were adjusted accordingly for better comparability.

Return on capital employed

Earnings-per-share and total cash return

36 35 35 40 56 ^{41 41 44 49} 63 Q4 Q1 FY22 Q2 Q3 Q4 EPS basic EPS adjusted [EUR cent]

Development of earnings-per-share (EPS) from continuing operations

Total cash return to shareholders via dividends

[EUR m]

• › Proposed dividend for FY22: €0.32 per share
• › Proposed dividend payout of €417m for FY22

Liquidity development

Historical liquidity development

[EUR m]

Maturity profile

Maturity profile from 2022 to 2033

Graph excludes additional debt with maturities between 2022 and 2023 totaling €3m.

1) On 1 Oct 2019, Infineon issued a perpetual hybrid bond with two tranches: €600m with first call date in 2025 and €600m with first call date in 2028; both are accounted as equity under IFRS.

Conservative financial policy and strict commitment to investmentgrade rating are the basis for through-cycle flexibility

	Financial Policy Targets	Status Quo (LTM 30 September 2022)
Cash1 Gross	€1bn + at least 10% of revenues → €2.2bn	€1bn + 20% of revenues → €3.7bn
Debt2 Gross	≤ 2.0x EBITDA	1.3x EBITDA
Comfortable liquidity position	› Flexibility for financing operating activities and investments through the cycle › Cushion for net pension liabilities and contingent liabilities
Balanced debt position	› Gross debt target commensurate with investment-grade rating › De-leveraging after Cypress acquisition completed one year ahead of schedule
Rating	Investment grade	BBB stable outlook (by S&P Global)

1 Gross cash position is defined as cash and cash equivalents plus financial investments | 2 Gross debt is defined as short-term debt and current maturities of long-term debt plus long-term debt. EBITDA is calculated as the total of earnings from continued operations before interest and taxes plus scheduled depreciation and amortization

Disclaimer

Disclaimer

This presentation contains forward-looking statements and/or assessments about the business, financial condition performance and strategy of the Infineon Group. These statements and/or assessments are based on assumptions and management expectation resting upon currently available information and present estimates. They are subject to a multitude of uncertainties and risks, many of which are partially or entirely beyond Infineon's control. Infineon's actual business development, financial condition, performance and strategy may therefore differ materially from what is discussed in this presentation.

Beyond disclosure requirements stipulated by law, Infineon does not undertake any obligation to update forward-looking statements.

Specific disclaimer for S&P Global reports, data and information referenced in this document:

The S&P Global reports, data and information referenced herein (the "S&P Global Materials") are the copyrighted property of S&P Global Inc. and its subsidiaries ("S&P Global") and represent data, research, opinions or viewpoints published by S&P Global, and are not representations of fact. The S&P Global Materials speak as of the original publication date thereof and not as of the date of this document. The information and opinions expressed in the S&P Global Materials are subject to change without notice and neither S&P Global nor, as a consequence, Infineon have any duty or responsibility to update the S&P Global Materials or this publication. Moreover, while the S&P Global Materials reproduced herein are from sources considered reliable, the accuracy and completeness thereof are not warranted, nor are the opinions and analyses which are based upon it. S&P Global and the trademarks used in the Data, if any, are trademarks of S&P Global. Other trademarks appearing in the S&P Global Materials are the property of S&P Global or their respective owners.

Glossary

AC	alternating current
AD	automated driving
ADAS	advanced driver assistance system
AI	artificial intelligence
AR	augmented reality
ASIC	application-specific integrated circuit
ASIL-D	automotive safety integrity level D
BEV	battery electric vehicle
BLE	bluetooth low energy
BMS	battery management system
CMOS	complementary metal-oxide-semiconductor
CPU	central processing unit
DC	direct current
DSP	digital signal processor
E/E	electrical/electronic architecture
eSIM	embedded subscriber identity module
EV	electric vehicle
FHEV	full hybrid electric vehicle
FPGA	field programmable gate array
GaN	gallium nitride
GPU	graphics processing unit
HMI	human machine interaction
HVAC	heating, ventilation, air conditioning
IC	integrated circuit
ICE	internal combustion engine
IGBT	insulated gate bipolar transistor
IoT	internet of things
IPM	intelligent power module
LED	light-emitting diode

Mbps	megabit per second
MCU	microcontroller unit
MEMS	micro electro-mechanical systems
MHEV	mild hybrid electric vehicle
MIMO	multiple input, multiple output
MOSFET	metal-oxide silicon field-effect transistor
MPU	microprocessor unit
OBC	on-board charger
OEM	original equipment manufacturer
P2S	Infineon's strategic product-to-system approach
PAS	photo-acoustic spectroscopy
PD	power delivery
PHEV	plug-in hybrid electric vehicle
PSoC	programmable system-on-chip
PV	photovoltaic
RAM	random-access memory
RF	radio frequency
RISC	reduced instruction set computer
SDK	software development kit
Si	silicon
SiC	silicon carbide
SMD	surface mounted device
SNR	signal-to-noise ratio
SoC	system-on-chip
SOTA	software over-the-air
SWP	single wire protocol
ToF	time-of-flight
USB	universal serial bus
VR	virtual reality
WBG	wide band gap, specifically referring to SiC and GaN based devices
xEV	all degrees of vehicle electrification (EV, HEV, PHEV)

Notes and ESG footnotes

Investments =	'Purchase of property, plant and equipment' + 'Purchase of intangible assets and other assets' incl. capitalization of R&D expenses
Capital Employed =	'Total assets' – 'Cash and cash equivalents' – 'Financial investments' – 'Assets classified as held for sale – ('Total Current liabilities' – 'Short-term debt and current maturities of long-term debt' – 'Liabilities classified as held for sale')
RoCE =	Operating profit from continuing operations after tax / Capital Employed = ('Operating profit' – 'Financial result excluding interest result' – 'Share of profit (loss) of associates and joint ventures accounted for using the equity method'-'Income tax') / Capital Employed
Working Capital =	('Total current assets' – 'Cash and cash equivalents' – 'Financial investment' – 'Assets classified as held for sale') – ('Total current liabilities' – 'Short term debt and current maturities of long-term debt' – 'Liabilities classified as held for sale')
DIO (days inventory outstanding; quarter-to-date) =	('Net Inventories' / 'Cost of goods sold') x 90
DPO (days payables outstanding; quarter-to-date) =	('Trade payables' / ['Cost of goods sold' + 'Purchase of property, plant and equipment']) x 90
DSO (days sales outstanding; quarter-to-date) =	('Trade receivables' - 'reimbursement obligations')* / 'revenue' x 90
	*without debtors with credit balances

Order backlog = The total amount of orders received regardless of their current status

ESG footnotes:

• 1) This figure takes into account manufacturing, transportation, own vehicles, travel, raw materials and consumables, chemicals, water/waste water, direct emissions, energy consumption, waste, etc. as well as direct and indirect energy-related emissions by manufacturing service providers. It is based on data collected internally and publicly available conversion factors and relates to the 2021 fiscal year.
• 2) This figure is based on internally established criteria, which are described in the explanatory notes. The figure relates to the 2020 calendar year and takes into account the following application areas: automotive, LED, induction cookers, servers, renewable energy (wind, photovoltaic) and cell phone chargers as well as drives. CO2 savings are calculated based on the potential savings generated by technologies in which semiconductors are used. The CO2 savings are allocated based on Infineon's market share, semiconductor share, and the lifetime of the technologies concerned, based on internal and external experts' estimations. Despite the fact that carbon footprint calculations are subject to imprecision due to the complex issues involved, the results are nevertheless clear.

Financial calendar

Date	Event	Location
16-17 November 2022	Morgan Stanley European TMT Conference	Barcelona
22-23 November 2022	Power presentation (IPC, PSS) with Peter Wawer, Head of IPC and Adam White, Head of PSS	London
28-29 November 2022	Credit Suisse TMT Conference	Scottsdale
6 December 2022	Berenberg European Conference	London
13 December 2022	Deutsche Bank Auto Conference	virtual
2 February 20231	Q1 FY23 results
16 February 2023	Annual General Meeting
4 May 20231	Q2 FY23 results
3 August 20231	Q3 FY23 results
15 November 20231	Q4 FY23 and FY 2023 results

Institutional Investor Relations contacts

Alexander Foltin

Executive Vice President Finance, Treasury & Investor Relations

+49 89 234-23766 alexander.foltin@infineon.com

Isabell Diel

Manager Investor Relations

+49 89 234-38297 isabell.diel@infineon.com

Alexander Groschke

Director Investor Relations

+49 89 234-38348 alexander.groschke@infineon.com

Daniel Györy

Senior Director Investor Relations

+49 89 234-35078 daniel.gyoery@infineon.com

Holger Schmidt

Director Investor Relations

+49 89 234-22332 holger.schmidt@infineon.com