Infineon Technologies AG

Investor Presentation • Nov 9, 2020

Fourth Quarter FY 2020 Quarterly Update

Infineon Technologies AG Investor Relations

Infineon at a glance

0

• › IoT (incl. data center, 5G, sensing, connectivity)
• › electro-mobility
• › assisted driving, autonomous driving
  • › energy efficiency, renewable energies
  • › security

Addressing long-term high-growth trends Illustrative aggregated FY20 revenue by segment

• Automotive (ATV)
• Industrial Power Control (IPC)
• Power & Sensor Systems (PSS)
• Connected Secure Systems (CSS)

Financials Illustrative aggregated FY20 revenue by product category

Illustrative aggregated FY20 revenue including contribution from Cypress of ~€1,900m from 1 Oct 2019 through 30 Sep 2020

Illustrative aggregated FY20 revenue of ~€9,600m by target application

Infineon offers a unique portfolio that links the real and the digital world

Infineon is a global top-10 player, #1 in power semiconductors, and ranked #3 in the overall microcontroller market

* including contribution from Cypress

** Renesas acquired Integrated Device Technology in March 2019. Both companies were combined as Renesas in the 2019 ranking.

1) Based on or includes research from Omdia: Annual 2001-2019 Semiconductor Market Share Competitive Landscaping Tool – Q4 2019 v2. March 2020

2) Based on or includes research from Omdia: Power Semiconductor Market Share Database – 2020. September 2020 Results are not an endorsement of Infineon Technologies AG. Any reliance on these results is at the third party's own risk.

Infineon remains top player in its target markets: security ICs, NOR Flash, and MEMS microphones

Tight customer relationships, based on system know-how and application understanding

Infineon expands supply base for SiC boules with GT Advanced Technologies

• › Based on GTAT's high-quality boules, Infineon is now enabling an additional source for competitive SiC wafers
• › Supply agreement for 150 mm SiC boules to secure growing base material demand
• › Contract has an initial term of five years

Key facts of the deal From powder to application: the main SiC process steps

Reaping of synergies on track

Planned ramp-up of cost synergies

Expected integration and restructuring costs equivalent to ~1x cost synergies one-off over time.

* Expected cost synergies of €180m p.a. gradually ramping up over approximately three years after closing (16 April 2020).

Examples for revenue synergies across all divisions

Automotive Power Domain Controller Air conditioning

› Customer: ATV joint account for intelligent multi-channel high-side switches

› Revenue synergies: TRAVEO™ 2, SEMPER™ NOR Flash

Wireless Charging Gaming

• › Notebook customer for MOSFETs, GaN switch, driver ICs, voltage regulators, authentication, XMC microcontroller
• › Revenue synergies: Bluetooth, PSoC™, USB Type-C
• › Offering: "ready-to-use" system solutions

• › Strongly growing IPC customer for IPMs and IGBTs
• › Revenue synergies: PSoC™4 for inverterized fan control
• › Infineon considered as top player with excellent roadmap and global support

› Existing customer for BT/BLE and Wi-Fi

› Security opportunities identified, e.g. authentication and secured communication

› Combination of customer access and intimacy, plus security reputation

Further improvement of through-cycle target operating model

	Outlook Q1 FY21*	Outlook FY21*
Revenue	€2.4bn – €2.7bn	~ €10.5bn plus or minus 5%
Segment Result Margin	At the mid-point of the revenue guidance: ~16%	At the mid-point of the revenue guidance: ~16.5%
Investments in FY21	€1.4bn – €1.5bn
D&A in FY21	€1.5bn – €1.6bn**
Free cash flow in FY21		> €700 million

• * Based on an assumed average exchange rate of \$1.15 for €1.00
• ** Including the effects of the purchase price allocation for Cypress and, to a lesser extent, International Rectifier

ESG: targets and achievements

Our products and innovations together with an efficient production are key elements to deal with climate change

We contribute a CO² reduction of more than 54 million tons*

Our net ecologic CO² benefit is equal to …

The savings of a 1,795 km² photovoltaic powerplant.3)

For footnotes please see page "ESG footnotes" in the appendix.

The average annual electricity consumption of about 86 million people living in Europe.4)

48,700 fully occupied flights of an Airbus A380 from Munich to Singapore.5)

Infineon will become carbon-neutral by 2030

70% CO² emissions reduction target in 2025 (Scope 1 and 2 emissions)

• 1. Avoiding direct emissions and further reducing energy consumption
• 1. Purchasing green electricity with guarantees of origin for unavoidable emissions
• 1. Compensate the smallest part by certificates that combine development support and CO² abatement

Abatement of Perfluorinated Compounds (PFCs)1) is one of the most important measures avoiding direct emissions.

Normalized PFC emissions rate in tons of CO² equivalent per m² wafer area2)

Historically, Infineon's normalized emission rate has been below WSC 2020 target of 2.2 tons of CO² equivalent per m² wafer area.

1) Namely perfluorinated and polyfluorinated carbon compounds, sulfur hexafluoride (SF⁶ ) and nitrogen trifluoride (NF³ ) 2) Updated figurers will be available on 23 Nov 2020 – as part of the new sustainability report

External recognitions confirm our engagement in contributing to a sustainable society

	Rating/Score	Scale	Date
MSCI ESG	AA	CCC to AAA	02/2020
CDP	B climate scoring B- water scoring	F to A	02/2020
Ecovadis	98th percentile "Gold" award	0 to 100	11/2019
Dow Jones Sustainability Index	79 DJ Sustainability™ World Index listing	0 to 100	09/2019
Ethibel Sustainability Index Excelence Europe"	Index member	-	06/2020
ISS ESG Corporate Rating	C+ Prime Status	D- to A+	06/2020
FTSE4Good Index	Index member	-	07/2020
Euronext Vigeo Eurozone 120 Index Euronext Vigeo Europe 120 Index	Indices member	-	06/2020
Sustainalytics	77 "Outperformer" level	0 to 100	06/2020

Automotive

› Further increase in L1 and L2 penetration expected

› L2+ shipments still at the inital phase

Infineon's top market position is built on system competence based on an industry-leading product portfolio

Automotive semiconductors (2019 total market: \$37.2bn)

• › New #1 in the total market post acquisition of Cypress
• › Solid #1 in power despite xEV subsidies cut in China in H2 CY19
• › Undisputed #1 in automotive NOR Flash memory
• › Fostering #2 in sensors (from 10.4%CY12 to 13.5%CY19)
• › Significant market share gain in microcontroller both organically (strong demand for AURIX™) and via Cypress acquisition

Sensors		Microcontrollers		Power semiconductors
Bosch	14.1%	NXP	27.2%	Infineon	25.5%
Infineon	13.5%	Renesas	27.0%	STMicro	13.9%
ON Semi	8.0%	Infineon	16.2%	Bosch	9.1%
NXP	7.0%	TI	9.8%	TI	8.2%
Melexis	6.7%	Microchip	6.6%	ON Semi	5.4%

Source: Strategy Analytics: Automotive Semiconductor Vendor Market Shares v2. May 2020. The market shares shown here are the combined market shares of Infineon and Cypress based on their individual figures.

Electro-mobility

Trends toward electrification of cars remain unchanged; driven by more stringent legal guidelines

Source: The International Council on Clean Transportation (ICCT): Passenger vehicle fuel economy. May 2020.

Passenger car CO² emission development and regional regulations CO² emission by degree of electrification

CO² emission: Tank-to-wheel

• › EU continues towards stringent emission standards
• › Recently, the governor of California signed an executive order mandating that all new cars to be sold in California from 2035 must be zero-emission vehicles

The incremental content of power semiconductors in xEV is a significant opportunity for Infineon

2020 average xEV semiconductor content by degree of electrification

48 V / Mild Hybrids Full & Plug-in Hybrids and Battery Electric Vehicles

* Non-Powertrain: average semiconductor content in body, chassis, safety and infotainment application segments

** "power" includes voltage regulators and ASIC; "others" include opto, small signal discretes, memory

Source: Infineon; based on or includes content supplied by IHS Markit, Automotive Group: Alternative Propulsion Forecast. July 2020; Strategy Analytics: Automotive Semiconductor Demand Forecast 2018-2027 and Automotive Sensor Demand 2018-2027. July 2020

Automated Driving

Radar/Lidar modules and sensor fusion will grab the lion's share of semiconductor BoM in ADAS/AD-equipped cars

Incremental average semiconductor content per car by level of automation at the given years

Source: Strategy Analytics: Automated Driving Semiconductor Market Estimate. August 2020; Infineon BoM contains all type of semiconductors (e.g. radar modules include µC); sensor fusion does not include memory. BoM are projected figures for the respective time frame.

The Infineon AURIX™ µC family has become the first-choice automotive architecture for high-growth and safety-critical applications

Infineon AURIX™ revenue development over time

Source: Infineon; Strategy Analytics: Automotive Semiconductor Demand Forecast. February 2020. Covering Infineon target markets; excl. body, comfort, infotainment.

Strong microcontroller footprint in next-generation high-volume platforms

Infineon's Power Strategy

Infineon's portfolio covers the entire range of power and frequency

* excluding drivers and control ICs

SiC is switching gears: industrial still holds the biggest share, but about half of the incremental revenue contributed by automotive

Strong CoolSiC™ portfolio expansion: by packages and by voltages

Broadest and best-in-class SiC portfolio

	Industrial					Automotive grade
	CoolSiC™ Diode	CoolSiC™ Hybrid		CoolSiC™ MOSFET			CoolSiC™ Diode	CoolSiC™ MOSFET
	Discrete	Discrete	Module	Discrete	IPM	Module	Discrete	Discrete	Module
voltages
600 V
650 V		Expected in 2020
1200 V					Expected in 2020				Exp. in 2020
1700 V
Continuous expansion of portfolio

Second generation (2nd Gen.) CoolSiC™ Trench MOSFET will increase the addressable market

1 st Gen. CoolSiC™ Trench MOSFET has set the industry benchmark

2 nd Gen. CoolSiC™ Trench MOSFET will significantly enlarge the market size for SiC MOSFETs

Process tools	Clean room	Process flow
› Design and production of semi automated process tool park completed in Dresden	› Clean room ready for manufacturing by end of calendar year 2020	› Integration of individual process steps into complete work flow

1/3 of the industrialization journey accomplished

Wafer splitting	Boule splitting
› Wafers for splitting are already available › Wafer splitting increases # of wafers up to a factor of 2	› Supply agreement for 150 mm boules signed › Boule splitting increases # of wafers by a factor of 2.0 in a first step, with potential for a factor of 2.6

Combining boule splitting and wafer splitting will make the most efficient process

Industrial Power Control

Mid-term market outlook for IPC division's target applications

Clear leader in discrete IGBTs and IGBT modules; fostering position in IPMs

1) Including standard (non-integrated) IGBT modules and power integrated modules (PIMs) / converter inverter brake (CIB) modules Source: Based on or includes research from Omdia: Power Semiconductor Market Share Database 2020. September 2020

Growth in home appliances supported by ongoing inverterization and sustained growth of overall number of RACs

Total room air-conditioner (RACs) shipments vs inverterized shipments

• › Inverterization of home appliances driven by energy efficiency regulations
• › Room air-conditioners accounting for roughly half of IPC's addressable HA market (based semiconductor TAM)
• › Room air-conditioners and washing machines currently stand at ~75% inverterization penetration rate
• › Growth of inverterized room air-conditioners also sustained by overall shipment figures (> 5% y-y) with demand expected to further increase due to ongoing population growth and urbanization in warmer climate zones
• › Inverterization of cooling appliances (fridges, freezers, coolers; third most-important appliances type for weighted semiconductor TAM) still < 50%

Source: Based on or includes research from Omdia, "Major Home Appliance Market Report 2019", August 2019

[units m]

What comes next? Mid- to long-term structural growth opportunities

Power & Sensor Systems

PSS's growth is built on many applications from different sectors in power and non-power

• › data center
• › enterprise server
• › PC, notebook
• › peripherals
• › chargers and adapters

Computing Communications Smartphones Consumer Industrial

• › base stations
• › backhaul cellular infrastructure
• › 5G massive MIMO
• › telecommunication servers

• › smartphones
• › mobile devices
• › wearables
• › USB Type-C, USB Type-C PD

• › eBikes, eScooter
• › multicopter
• › LSEV
• › gaming
• › TV sets
• › smart home

• › power supplies
• › EV on-board charger
• › charging infrastructure
• › PV inverter
• › power tools
• › lighting
• › Industry 4.0
• › space

PSS – Power

Infineon is the clear leader in MOSFETs; growth potential in power ICs

* Renesas acquired Integrated Device Technology in March 2019. Both companies were combined as Renesas in 2019.

Discrete Power MOSFET market includes automotive MOSFETs, protected MOSFETs, SiC MOSFETs and GaN power transistors. Power IC market includes automotive power ICs. Source: Based on or includes research from Omdia: Power Semiconductor Market Share Database 2020. September 2020.

Transition from 3G/4G to 5G drives demand in power semis for antennas and power supplies

5G base station

• › driver #1: massive growth of data and computing power
• › driver #2: higher number of base stations due to dense network
• › driver #3: ~4x higher power semi content per radio board: from ~\$25 for MIMO antenna to ~\$100 for massive MIMO antenna array
• › driver #4: fog computing data center as a completely new market

What comes next? Mid- to long-term structural growth opportunities

Copyright © Infineon Technologies AG 2020. All rights reserved. 2020-11-09 45 Core Adjacent New area power tools new material home appliances class D audio on-board charger collaborative robots hyperscale AI data center 5G infrastructure smart speaker

PSS – RF and Sensing

Main applications addressed by PSS sensors portfolio

Sensor markets targeted by PSS

3D ToF image sensor market Environmental sensor market*

Different market dynamics of selected PSS sensors

MEMS microphone

• › Market growth in MEMS microphones is mainly driven by hearables. New headset features like active noise cancellation or transparent hearing require 4 to 6 microphones. Traditional wired headsets had only one microphone.
• › Drop of microphone demand for flagship smartphones due to COVID-19 stopped and is starting to recover.

3D ToF image sensor

• Radar ICs (24 GHz and 60 GHz only)
• › In order to allow secure social distancing in public buildings Infineon has developed a smart entrance counter solution within three months. As the closed system with integrated software is based on our 60 GHz radar sensor instead of a camera it is 100% anonymous. Expected volume amounts to 90 million units globally.

Environmental sensors

• › With its XENSIV™ REAL3™ 3D ToF image sensors, Infineon serves the mobile device market since 2016. AR use cases like instant AR expected to drive strong market growth from 2021 onwards.
• › The market for face authentication is expected to grow, and also the consumer market for robotics and vacuum cleaner.
• › Market entry in CO² sensor market with first revenues expected in FY21.
• › XENSIV™ PAS CO2 sensors support reducing the risk of virus transmission by enabling better and clean indoor air quality.

Sweeping success of our XENSIV™ MEMS microphones driven by unparalleled audio characteristics catapulted Infineon to new #1

Infineon's market share development in MEMS microphones (by units)

Based on or includes research from Omdia: MEMS Microphones Dice Market Shares 2020. October 2020

Technological progression of Infineon XENSIV™ MEMS microphones

New 3D ToF image sensor with improved long range to be launched in Q3 FY21

› Serves applications like gaming, virtual e-Commerce, 3D online education, facial recognition.

Characteristics:

• › Long range up to 10 meters
• › High resolution up to 40k depth points
• › Lowest power, reduction of 40% at the imager
• › Accurate and robust depth data under all light conditions
• › Smallest 3D camera; 35% smaller footprint
• › Lowest system BoM due to high integrated CMOS image sensor and Infineon VCSEL driver component

Connected Secure Systems

Connected Secure Systems – comprehensive systems for a secure, connected world

Positioned to benefit from major growth trends	Top player in key markets

• › Security, connectivity and compute are the essential ingredients for IoT
• › Digitalization unlocks new opportunities
• › CSS supports other divisions with the integration of security, connectivity, and compute

Payment, identification, ticketing Industrial and consumer IoT

• › Payment (credit and debit cards)
• › Electronic passports & ID cards
• › Transport tickets
• › Access cards

• › Industrial application
• › Consumer electronics
• › Infrastructure
• › Mobility and connected cars
• › Home appliances

# 1 in security ICs1,2	# 5 in Wi-Fi standalone ICs3
# 1 in payment1	# 3 in Bluetooth Standalone3

1) ABI Research: Smart Card and Embedded Security IC Technologies. October 2020.

2) excl. NFC Controllers; excl. NFC embedded Secure Element

3) ABI Research: Wireless Connectivity Technology Segmentation and Addressable Markets. November 2019.

• › Notebooks, PCs and servers
• › Smartphones and accessories
• › Smart home
• › Consumer electronics, e.g. games consoles

CSS owns the key ingredients to address the high-growth IoT market: security solutions, wireless connectivity and processing

Infineon offers the entire system for IoT − unlocking new markets and applications

Mid-term market outlook for CSS division's target applications

Sapphire crystal with payment chip from Infineon turns every watch into a contactless payment device – potential for new opportunities

› Swiss-based company Winwatch and Infineon developed a contactless payment function for traditional wristwatches

Chip module with antenna and security feature

Terminal

Differentiating electrical characteristics enable application

• › Terminal generates electromagnetic field, powers the chip and starts payment process
• › At a distance of a few centimeters, the chip uses the energy field to calculate, encrypt and transmit the data
• › NFC-based communication allows for fast and secured payment
• › Transaction completes within milliseconds

Selected financial figures

Revenue and segment result development

• › Strong fourth quarter
  • › Brightened picture in several key target markets
• › Ongoing demand recovery and improving supply dynamics
• › Accelerating adoption rates for structural drivers like electro-mobility and IoT
• › Integration of Cypress on track

* Consolidation of Cypress revenue as of 16 April 2020.

Q4 FY20 division performance

• › Q4 FY20: Revenue grew across all areas. Upturn in demand particularly in xEV, MCUs for classical vehicle applications and driver assistance systems.
• › Q4 FY20: Weaker demand for wind power turbines, home appliances and trains. Demand for photovoltaic marginally weaker. Demand for industrial drives increased.
• › Q4 FY20: DC-DC power supply, mobile devices, USB controllers with significant revenue growth. AC-DC power supplies came in weaker.
• › Q4 FY20: Revenue for industrial microcontrollers, connectivity, IoT security and authentication increased. Government identification products declined.

RoCE and adjusted RoCE

Earnings-per-share and total cash return

Development of earnings-per-share (EPS) from continuing operations

Opex development

53

5877

Trade working capital components

Trade receivables Trade payables

1,089 ^{923 883} 1,091 1,160 60 58 53 54 53 1,701 1,767 1,736 2,215 2,052 ^{115 132 120} 126 109 Q4 Q1 FY20 Q2 Q3 Q4 Inventories DIO* [EUR m] [days] [EUR m] [days] [days]

Q4 FY19 Q1 FY20 Q2 Q3 Q4

Trade payables DPO*

* For definition please see page "Notes".

** Along with the integration of Cypress refund liabilities to customers are presented under "other current liabilities" instead of "trade receivables". Prior quarters' figures were adjusted accordingly for better comparability.

D&A impacted by Cypress consolidation and PPA

Investments* Depreciation & Amortization 12.8% 14.5% 16.5% 18.1% 12.8% ~14.1% 12.9% FY16 FY17 FY18 FY19 FY20 FY21e FY16 FY17 FY18 FY19 FY20 FY21e [EUR m] 826 1,022 1,254 1,099 1,451 1.4bn - 1.5bn

* For definition please see page "Notes".

Liquidity development

› Q3 FY20: - Closing of the acquisition of Cypress; entire acquisition financing facility drawn

• Raising €1.0bn via ABB and €2.9bn via bond issuance
• Repayment of the entire bridge facility; term loans remaining outstanding
• › Q4 FY20: Early repayment first term loan of €476m (\$555m)

Maturity profile

€750 €750 €750 €650 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 2032 \$350 \$235 \$555 [EUR m; US\$ m; nominal values] €171 €⁵⁰⁰ €600 €600 Eurobond (Mar 2022) Term loans (Sep 2022, Sep 2023, Jun 2024) Corporate bonds under the EMTN program (Jun 2023, Jun 2026, Jun 2029, Jun 2032) US PP Notes (Apr 2024, Apr 2026, Apr 2028) Hybrid bonds* (Jan 2025, Jan 2028) \$1,110 \$1,110 \$350

Note: Graph excludes pre-existing Cypress convertibles of ~\$382m repayment value, maturing latest 2022, and additional debt with maturities between 2020 and 2023 totaling €11m. Final Campeon repayment of €171m in Oct 2020.

* On 1 Oct 2019, Infineon issued a perpetual hybrid bond with two tranches: €600m with first call date in 2025 and €600m with first call date in 2028; both are accounted as equity under IFRS.

Glossary (1 of 2)

ABB	accelerated book building
AC	alternating current
AC-DC	alternating current - direct current
AD	automated driving
ADAS	advanced driver assistance system
AEB	automatic emergency braking
AFS	advanced frontlight system
AI	artificial intelligence
AR	augmented reality
ASP	average selling price
BEV	battery electric vehicle
BGA	ball grid array
BLE	Bluetooth Low Energy
BoM	bill of material
BT	Bluetooth
CPU	central processing unit
CRC	cyclical redundancy check
DC	direct current
DC-DC	direct current - direct current
DIY	do it yourself
DPM	digital power management
eCall	emergency call
ECC	error correction code

ECU	electronic control unit
EPS	electric power steering
eSIM	embedded subscriber identity module
EV	electric vehicle
FHEV	full hybrid electric vehicle
FPGA	field programmable gate array
G2M	go-to-market
GaN	gallium nitride
GPS	global positioning system
GPU	graphics processing unit
HEV	mild and full hybrid electric vehicle
HMI	human machine interaction
HSM	hardware security module
HST	high-speed train
HVAC	heating, ventilation, air conditioning
HW	hardware
IC	integrated circuit
ICE	internal combustion engine
IGBT	insulated gate biploar transistor
IoT	Internet of Things
IPM	intelligent power module
IVN	in-vehicle networking
iPol	image processing line

Glossary (2 of 2)

IRF	International Rectifier
IVN	in-vehicle networking
LCD	liquid crystal display
LDO	low dropout voltage regulator
LED	light-emitting diode
LSEV	low-speed electric vehicle
LSPS	LS Power Semitech Co. Ltd.
µC	microcontroller
Mb	megabit
MCU	microcontroller unit
MEMS	micro electro-mechanical systems
MHA	major home appliances
MHEV	mild hybrid electric vehicle
MIMO	multiple input, multiple output
micro-hybrid	vehicles using start-stop systems and limited recuperation
mild-hybrid	vehicles using start-stop systems, recuperation, DC-DC conversion, e-motor
MOSFET	metal-oxide silicon field-effect transistor
MPU	microprocessor unit
OBC	on-board charger
OEM	original equipment manufacturer
P2S	Infineon's strategic product-to-system approach
PAS	photoacoustic spectroscopy
PFC	power factor correction
PHEV	plug-in hybrid electric vehicle
PMIC	power management IC

Pol	point-of-load
PSoC	programmable system-on-chip
PV	photovoltaic
RF	radio frequency
rhs	right-hand scale
Si	silicon
SiC	silicon carbide
SiGe	silicon germanium
SMPS	switch-mode power supply
SNR	signal-to-noise ratio
SoC	system-on-chip
SOTA	software over-the-air
SPI	serial peripheral interface
SRAM	static random access memory
SW	software
TAM	total addressable memory
TCO	total cost of ownership
ToF	time-of-flight
TPM	trusted platform module
UPS	uninterruptible power supply
USB	universal serial bus
V2X	vehicle-to-everything communication
VR	virtual reality
VSD	variable speed drive
Wi-Fi	wireless fidelity
xEV	all degrees of vehicle electrification (EV, HEV, PHEV)

Disclaimer

This presentation contains forward-looking statements about the business, financial condition and earnings performance of the Infineon Group. These statements are based on assumptions and projections resting upon currently available information and present estimates. They are subject to a multitude of uncertainties and risks. Actual business development may therefore differ materially from what has been expected.

Beyond disclosure requirements stipulated by law, Infineon does not undertake any obligation to update forward-looking statements.

Specific disclaimer for Omdia – part of Informa Tech – reports, data and information referenced in this document:

The Omdia reports, data and information referenced herein (the "Omdia Materials – mostly former IHS Markit Technology Materials") are the copyrighted property of Informa Tech Research Ltd. and its subsidiaries or affiliates (together "Informa Tech") and represent data, research, opinions or viewpoints published by Informa Tech, and are not representations of fact. The Omdia Materials speak as of the original publication date thereof and not as of the date of this document. The information and opinions expressed in the Omdia Materials are subject to change without notice and neither Informa Tech nor, as a consequence, Infineon have any duty or responsibility to update the Omdia Materials or this publication as a result. Omdia Materials are delivered on an "as-is" and "as-available" basis. No representation or warranty, express or implied, is made as to the fairness, accuracy, completeness or correctness of the information, opinions and conclusions contained in the Omdia Materials. To the maximum extent permitted by law, Informa Tech and its affiliates, IHS Markit and its Affiliates and their respective, officers, directors, employees and agents, disclaim any liability (including, without limitation, any liability arising from fault or negligence) as to the accuracy or completeness or use of the Omdia Materials. Informa Tech and/or IHS Markit will not, under any circumstance whatsoever, be liable for any trading, investment, commercial or other decisions based on or made in reliance of the Omdia Materials. The "IHS Markit" brand and logo have been licensed for use by Informa Tech. The "IHS Markit" brand and logo and any third-party trademarks used in the IHS Markit Technology Materials are the sole property of IHS Markit Group or their respective third-party owners.

Specific disclaimer for IHS Markit – reports, data and information referenced in this document:

The IHS Markit reports, data and information referenced herein (the "IHS Markit Materials") are the copyrighted property of IHS Markit Ltd. and its subsidiaries ("IHS Markit") and represent data, research, opinions or viewpoints published by IHS Markit, and are not representations of fact. The IHS Markit Materials speak as of the original publication date thereof and not as of the date of this document. The information and opinions expressed in the IHS Markit Materials are subject to change without notice and neither IHS Markit nor, as a consequence, Infineon have any duty or responsibility to update the IHS Markit Materials or this publication. Moreover, while the IHS Markit Materials reproduced herein are from sources considered reliable, the accuracy and completeness thereof are not warranted, nor are the opinions and analyses which are based upon it. IHS Markit and the trademarks used in the Data, if any, are trademarks of IHS Markit. Other trademarks appearing in the IHS Markit Materials are the property of IHS Markit or their respective owners.

Financial calendar

Date	Location	Event
10 Nov 2020	London  virtual	UBS European Conference
17 Nov 2020	Hong Kong  virtual	JPM Global TMT Conference
17 Nov 2020	Bus Tour  virtual	Cowen Virtual Silicon Valley Bus Tour
18 - 19 Nov 2020	Barcelona  virtual	Morgan Stanley TMT Conference
23 Nov 2020	Frankfurt  virtual	DZ Bank 11th Equity Conference
30 Nov – 1 Dec	London  virtual	Infineon Power Roadshow and Call (30 Nov) − Peter Wawer, Division President IPC − Andreas Urschitz, Division President PSS
2 Dec 2020		Morgan Stanley Sustainability Call
2 – 3 Dec 2020	Scottsdale  virtual	Credit Suisse 24th Annual Technology Conference
3 Dec 2020	Paris  virtual	Société Générale Virtual Premium Review 2020
7 – 8 Dec 2020	New York  virtual	UBS Global TMT Conference
7 Jan 2021	Lyon  virtual	Oddo BHF Forum 24th Edition
4 Feb 2021*		Q1 FY21 Results
25 Feb 2021	Munich  virtual	Annual General Meeting

* preliminary

• 1) This figure considers manufacturing, transportation, function cars, flights, materials, chemicals, water/waste water, direct emissions, energy consumption, waste, etc. and is based on internally collected data and externally available conversion factors. All data relate to the 2019 fiscal year. Manufacturing service providers are not included.
• 2) This figure is based on internally established criteria, which are explained in the explanatory notes. The figure relates to the calendar year 2018 and considers the following fields of application: automotive, LED, induction cookers, server, renewable energy (wind, photovoltaic), mobile phone chargers as well as drives. CO² savings are calculated on the basis of potential savings of technologies in which semiconductors are used. The CO² savings are allocated on the basis of Infineon market share, semiconductor content and lifetime of the technologies concerned, based on internal and external experts' estimations.
• 3) Calculation based on average polycrystalline photovoltaic cells and the average yearly solar radiation of central Germany.
• 4) Based on the average electricity consumption of private households in Germany and official energy conversion factors.
• 5) Calculation based on average passenger capacity and direct flight route using externally available data and conversion factors.

Notes

• Investments = 'Purchase of property, plant and equipment' + 'Purchase of intangible assets and other assets' incl. capitalization of R&D expenses
• Capital Employed = 'Total assets' 'Cash and cash equivalents' 'Financial investments' 'Assets classified as held for sale – ('Total Current liabilities' – 'Short-term debt and current maturities of long-term debt' – 'Liabilities classified as held for sale')
• RoCE = NOPAT / Capital Employed = ('Income from continuing operations' – 'financial income' – 'financial expense') / Capital Employed
• Working Capital = ('Total current assets' 'Cash and cash equivalents' 'Financial investment' 'Assets classified as held for sale') ('Total current liabilities' – 'Short term debt and current maturities of long-term debt' – 'Liabilities classified as held for sale')
• DIO (days inventory outstanding; quarter-to-date) = ('Net Inventories' / 'Cost of goods sold') x 90
• DPO (days payables outstanding; quarter-to-date) = ('Trade payables' / ['Cost of goods sold' + 'Purchase of property, plant and equipment']) x 90

DSO (days sales outstanding; quarter-to-date) = ('Trade receivables' / 'revenue')* x 90

*without debtors with credit balances

For further reading

IPC Business Update Dr. Peter Wawer, Dr. Peter Friedrichs 7 May 2020

https://www.infineon.com/pcim\_presentation

Sustainability Report 2020 23 November 2020

coming soon

ATV Call Peter Schiefer 5 October 2020

https://www.infineon.com/2020atvcall

IFX Day 2018 Capital Markets Day London, 12 June 2018

https://www.infineon.com/ifxday\_2018

Institutional Investor Relations contacts

Alexander Foltin

Executive Vice President Finance, Treasury & Investor Relations

+49 89 234-23766 alexander.foltin@infineon.com

Joachim Binder

Distinguished Engineer Investor Relations

+49 89 234-25649 joachim.binder@infineon.com

Isabell Diel

Manager Investor Relations

+49 89 234-38297 isabell.diel@infineon.com

Alexander Groschke

Director Investor Relations

+49 89 234-38348 alexander.groschke@infineon.com

Holger Schmidt

Director Investor Relations

+49 89 234-22332 holger.schmidt@infineon.com