AI assistant
Infineon Technologies AG — Investor Presentation 2018
Jan 31, 2018
222_ip_2018-01-31_f3c4ca0a-3ea4-4db2-aee7-de03ab421895.pdf
Investor Presentation
Open in viewerOpens in your device viewer
First Quarter FY 2018 Quarterly Update
Infineon Technologies AG Investor Relations
Agenda
| 1 | Infineon at a glance |
|---|---|
| 2 | Quarterly highlights |
| 3 | Growth drivers |
| Automotive | |
| Power Management | |
| Security | |
| 4 | Selected financial figures |
Please regard the "Notes" and "Glossary" at the end of the presentation.
Infineon at a glance
2018-02-01 Copyright © Infineon Technologies AG 2018. All rights reserved. 3
Our strategy is targeted at value creation through sustainable organic growth
| Focus | Technology leadership | System understanding | ||||
|---|---|---|---|---|---|---|
| › Focus on fastest growing segments of semi market ›Tackle global megatrends |
Leverage core competencies › in different end markets to maximize ROI |
›Create value for customers through system under standing |
||||
| Auto | Power | RF & Sensors | Security | |||
| System leader in automotive |
#1; system and technology leader |
Broad RF and sensor technology portfolio |
#1 in Security Solutions |
|||
| Average-cycle financial targets | ||||||
| ~13% ~17% ~8% p.a. Investment-to-sales Segment Result margin Revenue growth (thereof capex*: ~11%) |
||||||
| Continued value creation for shareholders |
||||||
| › Organic RoCE ≙ continuous EPS increase › |
~2x WACC; paying out at least a constant dividend even in periods of slower growth | |||||
| * Infineon reports under IFRS and has |
therefore | to capitalize | development costs which |
represents | currently ~2% of sales. |
Infineon increased relative market share in power and outperformed the chip card market
- Source: Strategy Analytics, "2016 Automotive Semiconductor Vendor Share", April 2017
- Source: Based on or includes content supplied by IHS Markit, Technology Group, "Power Semiconductor Annual Market Share Report", August 2017
- Source: Based on or includes content supplied by IHS Markit, Technology Group, "Smart Cards Semiconductors Report", July 2017
Tight customer relationships, based on system know-how and application understanding
2018-02-01 Copyright © Infineon Technologies AG 2018. All rights reserved. 6
Infineon's organic revenue development clearly outperformed the total semi market
* Based on Infineon's portfolio (excl. Other Operating Segments and Corporate & Eliminations) per end of FY17.
** Source: WSTS (World Semiconductor Trade Statistics) in EUR, October 2017
Organic RoCE as the key value metric typically amounts to ~2x WACC
Our commitment to investors: Continued value creation through growth
Total cash return to shareholders
› Policy of sustainable dividend payout
- › Increase of dividend from €0.22 to €0.25*
- › Payment of €283m*
- * Proposal to the AGM to be held on 22 February 2018
Outlook for Q2 FY18 and FY18
| Outlook Q2 FY18* | Outlook FY18* (compared to FY17) |
|
|---|---|---|
| Revenue | Increase of 4% +/- 2%-points |
Increase of 5% +/- 2%-points (prev.: "Increase of 9% +/- 2%-points"**) |
| Segment Result Margin |
At the mid-point of the revenue guidance: ~16% |
At the mid-point of the revenue guidance: ~16.5% (previously: 17% **) |
| Investments in FY18 |
€1.1bn to €1.2bn | |
| D&A in FY18 |
€880m*** About |
* Based on an assumed average exchange rate of \$1.25 for €1.00. ** Previously based on \$1.15 for €1.00.
*** Including D&A on tangible and intangible assets from purchase price allocation of International Rectifier.
Agenda
| 1 | Infineon at a glance |
|---|---|
| 2 | Quarterly highlights |
| 3 | Growth drivers |
| Automotive | |
| Power Management | |
| Security | |
| 4 | Selected financial figures |
Q1 FY18 Group and Division Performance
We are part of world's 1st series production car with L3 autonomous driving features
Infineon supplies key components for Audi A8. Examples:
- › 77 GHz radar sensor chips of our RASIC™ family are installed in the front and corner radar
- › Audi's zFAS ("zentrales Fahrerassistenzsystem" = sensor fusion ECU) features AURIX™ microcontroller
- › Power semiconductors are used in the 48 V board system
Innovative drivetrain topologies push demand for more power semiconductors, see NIO ES8
- › End of 2017, NIO launched its first mass production car, the ES8 electric SUV
- › Innovative drivetrain concept:
- › dual-electric motor
- › 6-phase motor on each axle
- › Infineon provides all major semis for the drivetrain: 4x IGBT modules, 48x drivers, 2x AURIX™ microcontrollers
Front and rear motor with total 480 kW system performance
2x HybridPACK™ Drive for 6-phase front motor
2x HybridPACK™ Drive for 6-phase rear motor
› Very high semiconductor content per car: > \$900
Infineon secured SiC design-win for ultra highpower charging station network
› Total SiC-based power semiconductor content per charging point: more than \$3,500
PMM is unlocking further growth potential by extending its power IC portfolio
Latest example: XDP™ – solution for digital power control
More than 60m pieces shipped since market launch in 2015; shipment of another 60m pieces expected in FY18
- › XDP™ is addressing key industry needs, i.e. high efficiency, size reduction, flexibility in design and production
- › High-profile customer base has already adopted XDP™ controllers: Focus on high-density adapters for TV, chargers for PC/notebooks and commercial lighting
- › Many customers combine the controller with Infineon CoolMOS™ transistor
Agenda
| 1 | Infineon at a glance |
|---|---|
| 2 | Quarterly highlights |
| 3 | Growth drivers |
| Automotive | |
| Power Management | |
| Security | |
| 4 | Selected financial figures |
Reference to web presentations
10 Oct 2017: ATV Division Call by Peter Schiefer, Division President Automotive www.infineon.com/atv-call
- 29 Jun 2017: PMM Division Call by Andreas Urschitz Division President Power Management & Multimarket www.infineon.com/pmm-call
- 11 May 2017: Deutsche Bank AutoTech Conference by Dr. Jürgen Rebel, CVP Investor Relations www.infineon.com/db-autotech
- 16 Mar 2017: Bernstein xEV and Energy Storage Conference by Hans Adlkofer, VP Automotive System Group www.infineon.com/bernstein
Infineon benefits from industrial and auto, the by far fastest growing segments
CAGR 2017 – 2021** by Semiconductor Industry Segment
- * Market size in calendar year 2017
- ** Source: Based on or includes content supplied by IHS Markit, Technology Group, "Worldwide Semiconductor Shipment Forecast", December 2017
- *** Source: ABI Research, "Secure Smart Card & Embedded Security IC Technologies", August 2017; microcontroller ICs
Infineon's long-term growth is based on sustainable growth drivers
~8% p.a. through-cycle growth
Agenda
| 1 | Infineon at a glance |
|---|---|
| 2 | Quarterly highlights |
| 3 | Growth drivers |
| Automotive | |
| Power Management | |
| Security | |
| 4 | Selected financial figures |
Infineon is system leader in automotive; making cars clean, safe and smart
2 with market share gains in power and sensors:
- › #1 in power semiconductors*
- › #2 in sensors*
- › #4 in microcontrollers* (#1 in powertrain**)
Most balanced portfolio with sensors, microcontrollers and power for system approach
Leader in electric drivetrain and CO2 reduction - making cars clean
Leader in ADAS - making autonomous driving safe and reliable
Leading product portfolio of sensors and security ICs for individual convenience and connectivity - making cars smart
Focus on sustainable high-bill-of-material areas: powertrain, safety/ADAS/autonomous cars, body
* Source: Strategy Analytics, April 2017; ** Infineon estimate.
Infineon is well positioned to benefit from ADAS/AD, xEV, and connected cars and to gain further market share in the automotive market
Infineon's position in the automotive semiconductor universe
* Divestiture of NXP's Standard Product business ("Nexperia") closed on 16 Feb 2017; hence included in the 2016 ranking. Source: Strategy Analytics, "Automotive Semiconductor Vendor Market Shares", April 2017
Megatrends shaping the automotive market; significantly increasing semi content per car
Enabling safety towards Vision Zero Enabling CO2 reduction
Enabling security in connected cars
ADAS/AD semi growth driven by radar and camera sensor modules over the next 5 years
L2 vehicles in 2020:~8m L3 vehicles in 2025: ~3m L4/L5 vehicles in 2030: ~4m
Source: Strategy Analytics; Infineon.
Bill of material contains all type of semiconductors (e.g. radar modules include µC).
More sensors required for any next level of automation will lead to sensor cocoon in L4/5
| Level of automation | |||
|---|---|---|---|
| Level 2 | Level 3 | Level 4/5 | |
| Automatic emergency brake/ forward collision warning | |||
| Application* | Parking assist | Valet parking | |
| Lane keep assist | Highway assist | Highway and urban chauffeur | |
| Radar # of modules** |
≥ 3 | ≥ 6 | ≥ 10 |
| Camera # of modules** |
≥ 1 | ≥ 4 | ≥ 8 |
| Lidar # of modules** |
0 | 1 |
≥ 1 |
| Others | Ultrasonic | Ultrasonic Interior camera |
Ultrasonic Interior camera V2X |
* Source: VDA (German Association of the Automotive Industry); Society of Automotive Engineers ** Market assumption
CO2 emission targets are the key triggering points for increase in semiconductors
Source: The International Council for Clean Transportation, 2017
(1) Higher efficiency of the 'classic' ICE:
- › EPS (electric power steering)
- › start-stop
- › dual-clutch
- › alternator
(2) Energy efficiency of body applications:
- › power distribution
- › electric motors for pumps and fans
(3) Electrification of the drivetrain:
- › main inverter
- › auxiliary inverter
- › onboard charger
- › battery management
The incremental demand of power semiconductors is a significant opportunity
Source: Strategy Analytics, "Automotive Semiconductor Content", May 2017; Infineon * "power" includes linear and ASIC; "others" include opto, small signal discrete, memory With the transition from ICE to xEV the power semi content in powertrain increases by ~15x
Source: Strategy Analytics, "Automotive Semiconductor Content", May 2017; Infineon
Power semiconductor demand for all different levels of electrification
Infineon has unparalleled package expertise for high-power main inverter applications
2018-02-01 Copyright © Infineon Technologies AG 2018. All rights reserved. 31
ADAS/AD, clean cars, and adoption of premium features drive growth
~8% p.a. through-cycle growth
Agenda
| 1 | Infineon at a glance |
|---|---|
| 2 | Quarterly highlights |
| 3 | Growth drivers |
| Automotive | |
| Power Management | |
| Security | |
| 4 | Selected financial figures |
#1 in the market* for MOSFETs, discrete IGBTs, IGBT-based modules and total market
Broad product and technology portfolio
Addressing broadest range of applications
300 mm thin-wafer manufacturing for power semiconductors
System leader with digitalization of the control loop and functional integration * Source: IHS Markit, Technology Group, "Power Semiconductor Annual Market Share Report", August 2017 Key areas of innovation
Leader in next-generation power semiconductor materials SiC and GaN
Infineon is well positioned to gain further market share and earn clearly above market-average margins in power semiconductors
Efficiency, productivity and legislation are main market drivers for power applications
IPC is perfectly positioned to outperform traditional markets and leverage emerging ones
Traditional markets with <5% p.a.
- › Portfolio for automation application to compensate low demand in drives
- › Strong position in stable wind market
- › Broad traction portfolio including highspeed trains, metro, trams, and urban transportation
- › Weakest level of growth in oil & gas (process automation) passed as capex slowly recovers
Emerging markets with >5% p.a.
- › Comprehensive offering and expertise in innovative material SiC
- › Ongoing inverterization of home appliances
- › Long-term high-growth applications like PV, transmission & distribution, and commercial, construction and agricultural vehicles
- › Emerging applications like energy storage, EV charging, and robotics
Industrial Power Control to grow ~8% p.a.
+
PMM's growth is built on many applications from different sectors
2018-02-01 Copyright © Infineon Technologies AG 2018. All rights reserved. 37
Product-to-System approach opens growth opportunities beyond MOSFETs
Essential parts of any electronic system (e.g. in an SMPS); can be realized with separate components or as an integrated power stage as system-on-chip
* Infineon estimates
Strengthening IC business allows for faster growth in power than market average
PMM is a leader in core technologies for ambient sensing, thus driving innovation
- › #2 in the market (33.5%) for silicon microphones*
- › World's best signal-tonoise ratio
-
› Integration of additional sensing functions
-
› 60 GHz radar sensors e.g. for gesture sensing (example: Google Soli)
- › 24 GHz radar sensors e.g. for automotive, robotics and smart home
Sensor fusion
› Combination of microphone and radar with audio processor from XMOS enables far-field voice capture by audio beamforming combined with radar target presence detection
MEMS Radar Time of Flight
- › XENSIV™ REAL3™ image sensor for AR/VR applications in smartphones and automotive driver monitoring
- › High-resolution 3D image sensor available with 19k, 38k and 100k pixels
- › Measuring brightness and distance for every single pixel
* Source: IHS Markit, Technology Group, "MEMS microphone database", October 2017
Tailored growth strategies help maintain leadership position in both major segments
› Scale and technology leader in power MOSFETs › Broadest portfolio: 25 V – 900 V › Addressing all applications › #1 holding ~1/3 of the market Current position
Growth levers
- › Capitalize on scale and technology leadership in discretes
- › Double TAM by pushing into power management ICs
› Core technologies enable broad portfolio of products for even more applications.
Growth of ~8% p.a.
Growth of ~8% p.a.
2018-02-01 Copyright © Infineon Technologies AG 2018. All rights reserved. 41
Agenda
| 1 | Infineon at a glance |
|---|---|
| 2 | Quarterly highlights |
| 3 | Growth drivers |
| Automotive | |
| Power Management | |
| Security | |
| 4 | Selected financial figures |
Infineon is the leader in security solutions for the connected world
1 in microcontroller-based smart card ICs*
Complete portfolio of hardware, software, services and turnkey solutions
controller market Leading in growth segments payment, government ID, connected car security, IoT, and Information and Communications Technology security
Infineon is well positioned to benefit from the growth trends in the security
* Source: IHS Markit, Technology Group, "Smart Card Semiconductors Report", July 2017
Tailored embedded security µC portfolio for applications in the hyper-connected IoT world
› Infineon AURIX™ microcontroller with HSM for onboard communication › Security microcontrollers (e.g. eSIMs, TPMs) enable various functions like eCall, software over-the-air, vehicle-to-infrastructure, and on-board multimedia
› Security microcontroller for Infineon MIPAQ™ Pro IPM enabling authentication › Security chips are integrated in solutions for Industry 4.0 applications, e.g. robots
› OPTIGA™ TPM and OPTIGA™ Trust for devices like smart home routers and gateways (e.g. Google OnHub), smart meters, smart lighting etc.
Infineon is the leading supplier of eSIM for emergency call (eCall) system for cars
eSIM
- › Emergency call function (eCall) will be mandatory for all new registered cars in the EU as of 31 March 2018
- › Infineon is world's leading supplier of embedded SIMs (eSIMs) used for eCall function
- › In addition to eCall eSIMs enable various functions like
- › software over-the-air (SOTA)
- › vehicle-to-infrastructure
- › on-board multimedia
- › Infineon's related eSIM revenue almost doubled in FY17; for FY18, again strong growth expected
Agenda
| 1 | Infineon at a glance |
|---|---|
| 2 | Quarterly highlights |
| 3 | Growth drivers |
| Automotive | |
| Power Management | |
| Security | |
| 4 | Selected financial figures |
Opex level right on target
* Target range for SG&A: "Low teens percentage of sales".
** Target range for R&D: "Low to mid teens percentage of sales". In FY17, R&D expenses amounted to €776m, incl. reduction of €68m of grants received. Not included are €129m of capitalized development costs.
Increase in trade payables due to high investments
Q1 FY17 Q2 Q3 Q4 Q1 FY18 Trade receivables DSO*
* For definition please see page "Notes".
Investments between €1.1bn and €1.2bn due to strong underlying growth in demand
* For definition please see page "Notes".
Healthy gross cash and net cash position
- › Operating cash flow from continuing operations was €158m
- › Free Cash Flow from continuing operations was -€135m
- › Debt decreased by €25m due to repayments of €13m and a change in FX-rates used for valuing of US\$-based debt
Infineon has a balanced maturity profile and a solid investment grade rating (BBB) from S&P
Note: Additional debt with maturities between 2018 and 2023 totaling €61m of which €32m repayments related to Campeon.
Disclaimer
Disclaimer:
This presentation contains forward-looking statements about the business, financial condition and earnings performance of the Infineon Group.
These statements are based on assumptions and projections resting upon currently available information and present estimates. They are subject to a multitude of uncertainties and risks. Actual business development may therefore differ materially from what has been expected.
Beyond disclosure requirements stipulated by law, Infineon does not undertake any obligation to update forward-looking statements.
Specific disclaimer for IHS Markit reports, data and information referenced in this document:
The IHS Markit reports, data and information referenced herein (the "IHS Markit Materials") are the copyrighted property of IHS Markit Ltd. and its subsidiaries ("IHS Markit") and represent data, research, opinions or viewpoints published by IHS Markit, and are not representations of fact. The IHS Markit Materials speak as of the original publication date thereof and not as of the date of this document. The information and opinions expressed in the IHS Markit Materials are subject to change without notice and neither IHS Markit nor, as a consequence, Infineon have a duty or responsibility to update the IHS Markit Materials or this presentation. Moreover, while the IHS Markit Materials reproduced herein are from sources considered reliable, the accuracy and completeness thereof are not warranted, nor are the opinions and analyses which are based upon it. IHS Markit and the trademarks used in the data, if any, are trademarks of IHS Markit. Other trademarks appearing in the IHS Markit Materials are the property of IHS Markit or their respective owners.
Infineon is a long-standing member of Europe's leading sustainability indices
Infineon's most recent achievements
- › Jan 2018: Infineon is listed in the Sustainability Yearbook for the 8th consecutive year and has received the Bronze Class distinction for its excellent sustainability performance.
- › Sep 2017: Infineon is listed in the Dow Jones Sustainability Europe Index (as the only semiconductor company) for the 8th consecutive year and in the World Index for the 3rd time
› Sep 2016: Infineon is listed in the STOXX® Global ESG Leaders Indices, which serves as an indicator of the quality of Infineon's performance in the governance, social and environmental areas (ESG)
- › Infineon was added to the FTSE4Good Index Series in 2001 and has been confirmed as a member since then
-
- › Jul 2017: Most recent review
- › Since 2014, Infineon has been publishing information on opportunities and risks due to climate change through the "Carbon Disclosure Project" (CDP).
› For 2017, Infineon has earned a spot among the three best companies in the "Information Technology" sector in the Germany, Austria and Switzerland region.
› Mar 2017: Infineon has been reconfirmed as a constituent of the Ethibel Sustainability Index (ESI) Excellence Europe
Financial calendar
| Date | Location | Event |
|---|---|---|
| 22 Feb 2018 |
Munich | Annual General Meeting |
| 26 – 28 Feb 2018 |
Barcelona | Mobile World Congress |
| 03 May 2018* | Q2 FY18 Results | |
| 12 June 2018 | London | Capital Markets Day "IFX Day 2018" |
| 01 Aug 2018* | Q3 FY18 Results | |
| 30 Aug 2018 | Frankfurt | Commerzbank Sector Conference |
| 24 Sep 2018 | Unterschleißheim nearby Munich |
Berenberg and Goldman Sachs 7th German Corporate Conference |
| 25 Sep 2018 | Munich | Baader Investment Conference |
| 12 Nov 2018* | Q4 FY18 and FY 2018 Results |
* preliminary
Capital Employed =
Notes
Investments =
'Total assets'
- 'Cash and cash equivalents'
- 'Financial investments'
- 'Assets classified as held for sale'
'Purchase of property, plant and equipment'
- ('Total Current liabilities'
- 'Short-term debt and current maturities of long-term debt'
- 'Liabilities classified as held for sale')
RoCE =
NOPAT / Capital Employed =
('Income from continuing operations'
- 'financial income'
- 'financial expense')
/ Capital Employed
DOI (days of inventory; quarter-to-date) =
('Net Inventories' / 'Cost of goods sold') * 90
Working Capital =
- ('Total current assets'
- 'Cash and cash equivalents'
- 'Financial investment'
- 'Assets classified as held for sale')
- ('Total current liabilities'
- 'Short term debt and current maturities of long-term debt'
- 'Liabilities classified as held for sale')
DSO (days sales outstanding; quarter-to-date) = ('Trade receivables' / 'revenue') * 90
Please note:
All positions in ' ' refer to the respective accounting position and therefore should be applied with the positive or negative sign used in the relevant accounting table.
DPO (days payables outstanding; quarter-to-date) =
('Trade payables' / ['Cost of goods sold' + 'Purchase of property, plant and equipment']) * 90
Glossary
| AD | automated driving | |
|---|---|---|
| ADAS | advanced driver assistance system |
|
| AEB | automatic emergency braking |
|
| AR | augmented reality | |
| BoM | bill of material | |
| DPM | digital power management | |
| eCall | emergency call | |
| EPS | electric power steering | |
| eSIM | embedded subscriber identity module | |
| EV | electric vehicle | |
| HEV | mild and full hybrid electric vehicle | |
| HSM | hardware security module |
|
| ICE | internal combustion engine |
| MHA | major home appliances |
|---|---|
| micro hybrid |
vehicles using start-stop systems and limited recuperation |
| mild hybrid |
vehicles using start-stop systems, recuperation, DC DC conversion, e-motor |
| OBC | onboard charger |
| PHEV | plug-in hybrid electric vehicle |
| SiC | silicon carbide |
| SiGe | silicon germanium |
| SOTA | software over-the-air |
| TPM | trusted platform module |
| UPS | uninterruptible power supply |
| V2X | vehicle-to-everything communication |
| VR | virtual reality |
| VSD | variable speed drive |
| xEV | all degrees of vehicle electrification (EV, HEV, PHEV) |
Institutional Investor Relations contacts
Dr. Jürgen Rebel
Corporate Vice President +49 89 234-21626
Investor Relations [email protected]
Joachim Binder
Senior Director +49 89 234-25649 Investor Relations [email protected]
Holger Schmidt
Senior Manager +49 89 234-22332 Investor Relations [email protected]
Tillmann Geneuss
Manager +49 89 234-83346 Investor Relations [email protected]