AI assistant
Infineon Technologies AG — Investor Presentation 2017
May 4, 2017
222_ip_2017-05-04_5311efd2-f4b7-45ea-b1f1-b294f916d6ca.pdf
Investor Presentation
Open in viewerOpens in your device viewer
Second Quarter FY 2017 Quarterly Update Infineon Technologies AG
Investor Relations
Table of Contents
Please regard the "Notes" and "Glossary" at the end of the presentation.
Disclaimer: This presentation contains forward-looking statements about the business, financial condition and earnings performance of the Infineon Group.
These statements are based on assumptions and projections resting upon currently available information and present estimates. They are subject to a multitude of uncertainties and risks. Actual business development may therefore differ materially from what has been expected.
Beyond disclosure requirements stipulated by law, Infineon does not undertake any obligation to update forwardlooking statements.
Infineon at a glance
2017-05-04 Copyright © Infineon Technologies AG 2017. All rights reserved. 3
Our strategy is targeted at value creation through sustainable organic growth
| Focus | Technology leadership | System understanding | ||
|---|---|---|---|---|
| Auto | Power | RF and sensors |
Security | |
| System leader in automotive |
#1; system and technology leader |
Broad RF and sensor technology portfolio |
Leader in security solutions |
Average-cycle financial targets
~8% p.a. revenue growth
~17% Segment Result Margin ~13%
investment-to-sales (thereof capex*: ~11%)
Continued value creation for shareholders
Organic RoCE ~ 2x WACC
- › paying out at least a constant dividend even in periods of slower growth
- › continuous EPS increase
* Infineon reports under IFRS and has therefore to capitalize development assets which represents currently ~2% of sales.
2017-05-04 Copyright © Infineon Technologies AG 2017. All rights reserved. 4
Infineon increased relative market share in power and outperformed chip card market
Source: Strategy Analytics, April 2017 Source: IHS Markit, October 2016 Source: IHS Markit, July 2016
Tight customer relationships are based on system know-how and app understanding
2017-05-04 Copyright © Infineon Technologies AG 2017. All rights reserved. 6
Infineon's organic revenue development clearly outperformed total semi market
Revenue Infineon* [lhs]
* Based on Infineon's portfolio (excl. Other Operating Segments and Corporate & Eliminations) per end of FY16.
** If International Rectifier had been consolidated since 1 Oct 2014, Infineon would have recorded revenues of €6,059m in FY15. Source: Infineon; WSTS (World Semiconductor Trade Statistics), November 2016
Accelerated investments in FY17 to maximize margin contribution and customer satisfaction
Incremental investments in PPE of €100m help accommodate strong order entry in major growth areas, such as xEV, ADAS and power
Organic RoCE as the key value metric typically amounts to ~2x WACC
2017-05-04 Copyright © Infineon Technologies AG 2017. All rights reserved. 9
Our promise to investors: Continued value creation through growth
Total cash return to shareholders
- › Increase of dividend from €0.20 to €0.22.
- › Payment of €248m on 21 Feb 2017.
Guidance for Q3 FY17 and FY17
| Outlook Q3 FY17* (compared to Q2 FY17) |
Updated Outlook FY17* (compared to FY16) |
|
|---|---|---|
| Revenue | Increase of 3% +/- 2%-points |
Increase of 8% to 11% (prev.: "Increase of 6% +/- 2%-points") |
| Segment Result Margin |
At the mid-point of the revenue guidance: ~17.5% |
At the mid-point of the guidance: ~17% revenue (prev.: "16%") |
| Investments in FY17 |
€1,050m About (prev.: "About €950m") |
|
| D&A in FY17 |
€830m*** About |
- * Based on an assumed average exchange rate of \$1.10 for €1.00.
- ** Including approximately €35m for a new building at Infineon's headquarters in Neubiberg near Munich.
- *** Including D&A on tangible and intangible assets from purchase price allocation of International Rectifier.
Table of Contents
Q2 FY17 Group and Division Performance
* Individual small product groups were transferred to other segments with effect from 1 October 2016. The previous year's figures have been adjusted accordingly.
2017-05-04 Copyright © Infineon Technologies AG 2017. All rights reserved. 13
2017 marks the market entry of Infineon with SiC MOSFETs and full SiC modules
- › Infineon owns industry's broadest power semiconductor portfolio with regard to products, packages and technology
- › Infineon offers "best-fit solutions" based on Si-based and SiC-based components
- › Infineon's SiC MOSFET is based on its innovative trench concept with highest reliability
Villach (Austria) › SiC manufacturing runs on standard manufacturing lines, i.e. no capacity constraints
Infineon SiC MOSFET already revenue potential of triple-digit €m in industrial applications
More and more applications will gradually reach their tipping point
2017-05-04 Copyright © Infineon Technologies AG 2017. All rights reserved. 15
Hybrid SiC and full SiC power modules will show highest growth
Source: IHS Markit, "World Market for SiC and GaN Power Semi", Feb 2016; Infineon Source: Yole, "Power SiC 2016", Jul 2016
Table of Contents
Infineon benefits from industrial and auto, the by far fastest growing segments
CAGR 2016 – 2021 by Semiconductor Industry Segment
Source: IHS Markit, "Worldwide Semiconductor Shipment Forecast", April 2017
- * Market size in calendar year 2016
- ** Source: ABI Research, "Smart Cards and Secure ICs", February 2017; smart card and embedded secure microcontroller ICs
Infineon is system leader in automotive; making cars clean, safe and smart
2 with market share gains in power and sensors:
- › #1 in power semiconductors*
- › #2 in sensors*
- › #3 in microcontrollers* (#1 in powertrain**)
Most balanced portfolio with sensors, microcontrollers and power for system approach
Leader in electric drivetrain and CO2 reduction - making cars clean
Leader in ADAS - making autonomous driving safe and reliable
Leading product portfolio of sensors and security ICs for individual convenience and connectivity - making cars smart
Focus on sustainable high-bill-of-material areas: powertrain, safety/ADAS/autonomous cars, body
* Source: Strategy Analytics, April 2016; ** own estimate.
Infineon is ideally positioned to benefit from ADAS/AD, xEV, connected cars and to gain further market share in Automotive
For full automotive story please refer to:
16 Mar 2017: Bernstein xEV and Energy Storage Conference by Hans Adlkofer, VP Automotive System Group www.infineon.com/bernstein
11 Oct 2016: ATV Division Call by Peter Schiefer, Division President Automotive www.infineon.com/atv-call
2 Aug 2016: ATV Presentation www.infineon.com/auto-slides
Infineon first partner in Volkswagen's "TRANSFORM 2025+" strategy program
Peter Schiefer, Division President Automotive at Infineon (left); Dr. Volkmar Tanneberger, Head of Electrical and Electronic Development at Volkswagen (Courtesy: Volkswagen AG)
"TRANSFORM 2025+"
- › Volkswagen secures its position in the field of future vehicle innovations such as automated and fully electric driving cars
- › The company is cooperating directly with semiconductor manufacturers to further shorten development and innovation cycles
- › Infineon is Volkswagen's first partner here
- › Cooperation between automotive OEMs and semiconductor manufacturers is becoming increasingly important for further innovation
- › Infineon is strengthening the bond to customers, getting involved even more deeply in the development processes
- › Infineon benefits from longer planning horizon and higher stickiness of the business
Infineon's position in the automotive semiconductor universe
* Divestiture of NXP's Standard Product business ("Nexperia") closed on 16 Feb 2017; hence included in the 2016 ranking. Source: Strategy Analytics, "Automotive Semiconductor Vendor Market Shares", April 2017
m.s. trend
m.s. trend – 24 / 77 GHz radar – REAL3™ sensor
– ADAS/AD – Powertrain – xEV penetration
– EPS
m.s. trend
– Lighting
Key market trends significantly drive increasing semiconductor content per car
› ADAS and AD are critical enabler to reduce the number of fatalities and serious injuries ("Vision Zero")
ADAS/AD Clean cars
- › To reach CO2 emission goals, the automotive industry has to focus on
- a higher efficiency of the classic ICE, and
- the electrification of the drivetrain (xEV)
Connectivity/security
- › Advanced connectivity is driven by making the car part of the internet
- › Connectivity must be secure
ADAS/AD and clean cars will generate half of the 8% trendline growth of ATV
ADAS/AD semi growth driven by radar and camera sensor modules over the next 5 years
Bill of material estimates include all type of semiconductors**
* Source: Strategy Analytics, IHS Markit, Infineon; ** e.g. radar includes µC
Infineon's product portfolio fosters revenue growth in ADAS/AD for the next decade
All types of xEV will significantly increase power semiconductor content per car
2017-05-04 Copyright © Infineon Technologies AG 2017. All rights reserved. 26
Power semiconductor demand for different levels of electrification
Infineon has all elements and unparalleled package expertise for all xEV applications
2017-05-04 Copyright © Infineon Technologies AG 2017. All rights reserved. 28
Infineon is well positioned globally to benefit disproportionately from xEV boom
In 2016, 8 out of 10 top selling xEVs were powered by Infineon
| World's top 10 selling xEVs | type | Sold cars in 2016 |
Drivetrain powered by Infineon |
|---|---|---|---|
| Tesla Model S | EV | 50,935 | |
| Nissan Leaf | EV | 49,818 | |
| BYD Tang | PHEV | 31,405 | |
| Chevrolet Volt | EV | 28,295 | |
| Mitsubishi Outlander | PHEV | 27,850 | |
| BMW i3 | EV | 25,576 | |
| Tesla Model X | EV | 25,372 | |
| BYD Qin |
PHEV | 21,868 | |
| Renault Zoe | EV | 21,626 | |
| BYD e6 | EV | 20,609 | |
Source: EVvolumes.com, Infineon
ADAS/AD, clean cars, and adoption of premium features drive growth
~8% p.a. through-cycle growth
1 in the market*
for MOSFETs, discrete IGBTs, and total market
Broad product and technology portfolio
Addressing broadest range of applications
300 mm thin-wafer manufacturing for power semiconductors
System leader with digitalization of the control loop and functional integration * Source: IHS Markit, "Power Semiconductor Discretes & Modules Report – 2016", October 2016 Key areas of innovation
Leader in next-generation power semiconductor materials SiC and GaN
Infineon is ideally positioned to gain further market share and earn superior margins in power semiconductors
Ramp of 300 mm thin-wafer manufacturing technology on schedule
Advantages of 300 mm manufacturing of power semiconductors
- › When fully loaded, frontend manufacturing cost per unit will be 20 – 30% lower than on 200 mm
- › Capital intensity is 30% lower than for 200 mm
Current status of Dresden 300 mm fab
- › Headwind from 300 mm-related expenses (process development, product qualification and manufacturing infrastructure) decreasing in FY17
- › Cost cross over versus 200 mm expected by end of CY17 when reaching 25 – 30% area utilization
As system leader in power, Infineon has broadest application and technology reach
2017-05-04 Copyright © Infineon Technologies AG 2017. All rights reserved. 34
Efficiency and digitalization are main market drivers for power applications
Tailored growth strategies maintain leadership position in both major segments of PMM
Infineon is the leader in security solutions for the connected world
2 in microcontroller-based smart card ICs*
1 in embedded digital security**
Complete portfolio of hardware, software, services and turn-key solutions
Leading in growth segments payment, government ID, connected car security, IoT, and Information and Communications Technology security
Infineon is ideally positioned to benefit from the growth trends in the security controller market
** Source: IHS Markit, December 2015
* Source: IHS Markit, July 2016
CCS is enabling security for the connected world
Source: IHS Markit, Dec 2015, July 2016; * based on units; USD-ranking not provided
Infineon's long-term growth is based on sustainable growth drivers
~8% p.a. through-cycle growth
Table of Contents
SG&A includes noticeable Wolfspeed acquisition-related costs
* Target range for SG&A: "Low teens percentage of sales".
** Target range for R&D: "Low to mid teens percentage of sales".
All figures on a healthy level
* For definition please see page "Notes".
Investments increase to €1,050m from €950m due to higher full-year growth above trendline
- * For definition please see page "Notes".
- ** The figure includes approximately €35m for a new building at Infineon's headquarters. Excluding this amount the percentage rate is approximately 14.3%.
Net cash decreased due to dividend payment
- › Free Cash Flow from continuing operations was €82m.
- › Debt decreased by €26m due to repayment of €11m long-term debt and a change in FX-rates used for valuing US\$-based debt.
- › Dividend payment of €248m on 21 Feb 2017.
Infineon has a balanced maturity profile and a solid investment grade rating (BBB) from S&P
Note: Additional debt with maturities between 2017 and 2023 totaling €178m of which €41m repayments related to Campeon.
Infineon is a long-standing member of Europe's leading sustainability indices
Infineon's most recent achievements
- › Jan 2017: Infineon is listed in the Sustainability Yearbook for the 7th consecutive year and, according to RobecoSAM, among the top 15% most sustainable companies worldwide.
- › Sep 2016: Infineon is listed in the Dow Jones Sustainability Europe Index for the 7th consecutive year and in the World Index for the 2nd time – both achievements this year as the only European semiconductor company.
› Sep 2016: Infineon is listed in the STOXX® Global ESG Leaders Indices, which serves as an indicator of the quality of Infineon's performance in the governance, social and environmental areas (ESG).
› Infineon was added to the FTSE4Good Index Series in 2001 and has been confirmed as a member since then.
› Jul 2016: Most recent review.
› Dec 2016: In the Carbon Disclosure Project (CDP) climate change report, Infineon achieved a placing among the best companies in the Information Technology sector.
› Mar 2017: Infineon has been reconfirmed as a constituent of the Ethibel Sustainability Index (ESI) Excellence Europe.
Financial calendar
| Date | Location | Event |
|---|---|---|
| 11 May 2017 | San Francisco | Dt. Bank AutoTech Conference |
| 22 May 2017 | Tarrytown, NY | Berenberg European Conference USA |
| 23 – 24 May 2017 |
Boston | JPMorgan TMT Conference |
| 24 May 2017 | Milan | Equita European Conference |
| 30 May 2017 | Copenhagen | German Corporate Day by Danske Bank Markets |
| 31 May – 01 Jun 2017 |
New York | Bernstein Strategic Decision Conference |
| 01 Jun 2017 | Zurich | Berenberg TMT Conference |
| 06 – 07 Jun 2017 |
San Francisco | BoAML Global Technology Conference |
| 13 – 14 Jun 2017 |
Paris | Exane European Conference |
| 20 Jun 2017 | London | JPMorgan CEO Conference |
| 21 – 22 Jun 2017 |
Berlin | Dt. Bank German, Swiss & Austrian Conference |
| 29 Jun 2017 | London | PMM Presentation by Andreas Urschitz, Division President |
| 01 Aug 2017* | Q3 FY17 Results | |
| 31 Aug 2017 | Frankfurt | Commerzbank Sector Conference |
| 6 – 7 Sep 2017 |
New York | Citi Global Technology Conference |
| 18 Sep 2017 | Munich | Berenberg Bank and Goldman Sachs German Corporate Conference |
| 20 Sep 2017 | Munich | Baader Investment Conference |
| 10 Oct 2017 | London | ATV Presentation by Peter Schiefer, Division President |
| 14 Nov 2017* | Q4 FY17 and FY 2017 Results |
* preliminary
/ Capital Employed
DOI (days of inventory; quarter-to-date) =
('Net Inventories' / 'Cost of goods sold') * 90
Working Capital =
- ('Total current assets'
- 'Cash and cash equivalents'
- 'Financial investment'
- 'Assets classified as held for sale')
- ('Total current liabilities'
- 'Short term debt and current maturities of long-term debt'
- 'Liabilities classified as held for sale')
DSO (days sales outstanding; quarter-to-date) = ('Trade receivables' / 'revenue') * 90
Please note:
All positions in ' ' refer to the respective accounting position and therefore should be applied with the positive or negative sign used in the relevant accounting table.
Investments =
Notes
'Purchase of property, plant and equipment'
- 'Purchase of intangible assets and other assets' incl. capitalization of R&D expenses
Capital Employed =
'Total assets'
- 'Cash and cash equivalents'
- 'Financial investments'
- 'Assets classified as held for sale'
- ('Total Current liabilities'
- 'Short-term debt and current maturities of long-term debt'
- 'Liabilities classified as held for sale')
RoCE =
NOPAT / Capital Employed =
('Income from continuing operations'
– 'financial income'
– 'financial expense')
DPO (days payables outstanding; quarter-to-date) =
('Trade payables' / ['Cost of goods sold' + 'Purchase of property, plant and equipment']) * 90
Glossary
| ACC | adaptive cruise control | micro hybrid |
vehicles using start-stop systems and limited recuperation |
|---|---|---|---|
| AD | automated driving | ||
| ADAS | advanced driver assistance system |
mild hybrid |
vehicles using start-stop systems, recuperation, DC DC conversion, e-motor |
| AEB | automatic emergency braking |
OBC | onboard charger |
| BoM | bill of material | PHEV | plug-in hybrid electric vehicle |
| DPM | digital power management | SiC | silicon carbide |
| EPS | electric power steering | ||
| EV | electric vehicle | silicon germanium | |
| UPS | uninterruptible power supply | ||
| FCW | forward collision waring | ||
| HEV | mild and full hybrid electric vehicle | V2X | vehicle-to-everything communication |
| ICE | internal combustion engine | VSD | variable speed drive |
| MHA | major home appliances | xEV | all degrees of vehicle electrification (EV, HEV, PHEV) |
Institutional Investor Relations contacts
Dr. Jürgen Rebel
Corporate Vice President +49 89 234-21626
Investor Relations [email protected]
Joachim Binder
Senior Director +49 89 234-25649 Investor Relations [email protected]
Holger Schmidt
Senior Manager +49 89 234-22332 Investor Relations [email protected]
Tillmann Geneuss
Manager +49 89 234-83346 Investor Relations [email protected]