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Infineon Technologies AG

Investor Presentation • Mar 17, 2009

222_ip_2009-03-17_f2424166-83bb-4bb1-8758-af54ef998fb2.pdf

Investor Presentation

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Infineon Wireless Solutions MWC, Barcelona, February 17, 2009

Prof. Dr. Hermann Eul Member of the Management Board Sales & Marketing, Research & Development

Disclaimer

Please note that while you are reviewing this information, this presentation was created as of the date listed, and reflected management views as of that date.

This presentation contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements.

Such risks and uncertainties include, but are not limited to the Risk Factors noted in the Company's Earnings Releases and the Company's filings with the Securities and Exchange Commission.

X-GOLD™101: Winner of the Innovation Award of German industry for the best technological innovation 2008

More than 100 million devices were sold so far!

[€ m]

Q1 FY09 Financial Figures for Wireless Solutions

Wireless Solutions – First quarter

197253 286 -22%7% 1% -20%-15%-10%-5%0%5%10%15%20%Q1 08 18 Q4 08 3 Q1 09 -44 Segment Profit

Q1 08 Q2 08 Q3 08 Q4 08 Q1 09 -25%Revenue in € million Segment Profit margin Note: Figures according to IFRS

Remarks

  • Q4 revenue peak due to high demand of one HSDPA customer.
  • Revenue decrease by 31% compared to Q4 FY08 mostly due to given market slow-down and inventory correction.
  • Segment Profit: Negative € 44 million due to revenue decline and idle cost.

Infineon is scaling up customer base and volumes significantly

Infineon wireless following up consequently on fab-light strategy

1) Excluding revenue measures

Handset growth fueled by HSxPA technology while 2/2.5 G still represent 50% of market

Comments

  • Global handset shipments are forecasted to grow at a 4-year CAGR of 4.7% (2008–2012)
  • HSxPA segment is growing the fastest (57% CAGR) to 38% of all handset shipments by 2012.
  • EDGE segment grows steadily as well, reaching ~480 mio units in 2012.
  • The WEDGE segment will decline substantially as the OEMs and operators are focusing on HSxPA handsets.
  • Growth of HSxPA is mainly driven by replacement handset sales as feature-rich handsets enabling various data services that require faster data connection.

Source: iSuppli, December 2008

High performance slim modems and cost-effective single-chip solutions will experience high demand

Infineon well positioned for success in the wireless market and prepared for further consolidation

INFINEON WIRELESS POSITIONING ALONG SUCCESS FACTORS

Infineon differentiates through four major success factors

Infineon RF Transceivers for cellular applications showed steady growth of market share

Source: Strategy Analytics, Infineon

All major wireless standards are addressed by RF CMOS solutions

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New RF products addressing growth segments 3G low cost and LTE

  • enabling lowest RF system eBOM USD 6.50
  • 130nm standard CMOS technology

Infineon drives SoC integration from GSM to full EDGE solutions and beyond

Feb 17, 2009 Copyright © Infineon Technologies 2009. All rights reserved. Page 15

Ultra-Low-Cost enables "Voice for All"

Entry phones provide "Mobile Internet for All"

Smartphones require high-performance modems

Infineon offers complete HW/SW system solutions for all major standards

INTEGRATED HW AND SW, SYSTEM DESIGN, IOT AND GCF TESTING

Ownership of each platform component simplifies completing lab tests, field tests, and operator approvals, significantly accelerating phone projects

XPOSYS™ A-GPS single-chip solution offers a sensitivity down to -165 dBm

XPOSYS™ A-GPS

  • Highly integrated single chip 65nm A-GPS
  • Integrated high sensitivity LNA
  • Package WLB47 2.8 x 2.9mm²; 0.4mm pitch; 0.8 mm height

Key Features

  • Highest sensitivity of less than -165 dBm
  • Lowest power consumption 9 mW tracking
  • TCXO shared with cellular system
  • SW for assisted modes: C-plane and User-plane (SUPL 2.0)
  • Performance margin enables low cost filters and antennas

Circuit/System

  • Less than 26 mm2 board space to maximize design flexibility
  • Only 9 external components to reduce eBOM
  • 3GPP, DoCoMo and OMA compliant for fast time-to-market
  • Lowest power consumption 6µW StdBy to successfully interact with multiple LBS applications

Rich Communication Suite (RCS) based on Comneon's IMS Device Framework

Rich Communication Suite

  • RCS is a standardized sub-set of IMS functions.
  • Seamless communication for end users.
  • Services include:
  • Presence enabled Phone Book
  • Service Capability Exchange
  • Multimedia Messaging
  • Chat
  • File Transfer
  • Video Share
  • Image Share

Comneon is a member of theGSMA RCS Group

Infineon serves the top 5 mobile phone OEMs as well as important additional players

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1) Strategy Analytics estimates, December 2008

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