Infineon Technologies AG — Investor Presentation 2007

Feb 12, 2007

Infineon Wireless Solutions3GSM, Barcelona, February 13, 2007

Prof. Dr. Hermann Eul Executive Vice President andMember of the Management Board President Business Group Communication Solutions

Please note that while you are reviewing this information, this presentation was created as of the date listed, and reflected management views as of that date.

This presentation contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements.

Such risks and uncertainties include, but are not limited to the Risk Factors noted in the Company's Earnings Releases and the Company's filings with the Securities and Exchange Commission.

Key Cellular Market Trends

Ongoing consolidation Ongoing BoM optimization

Infineon's Market Opportunity is Significant

Source: ABI Research, Mobile Device Market Data, Q4 2006

COM - Market Leader in Broadband and RF; Turning Around Mobile Platform Business

Update: RF Solutions

IFX market share and ranking in RF transceivers

Major contributors

• Successful ramp-up of new RF transceiver for a major OEM
• Complete product and roadmap conversion to CMOS technology
• CMOS transceiver in volume production since 2004
• Excellent RF performance
• Focus on customer cost of ownership

Source: Gartner, Strategy Analytics; IFX

Comprehensive CMOS RF SMARTi® Transceiver Portfolio

All wireless standards in single CMOS technology platform

Copyright © Infineon Technologies 2007. All rights reserved. Page 8

Introducing the Next Generation of 3G and EDGE CMOS RF Transceivers

New 3G CMOS RF transceiver: SMARTi® UE

• World's first single-chip HEDGE RF transceiver with DigRF baseband interface
• Incorporates analog baseband functions
• Supports HSDPA and HSUPA, three UMTS bands, quadband EDGE (6x6mm²)

New EDGE CMOS RF transceiver: SMARTi® PM+

• World's smallest GPRS/ EDGE quadband RF CMOS transceiver (3x3mm²)
• Based on successful SMARTi PM architecture used by Samsung and others

Update: Mobile Phone Platforms

Successful Launch of Platforms in Major Target Markets

Infineon's Advantage: Mobile Platform System Competence

Advantages:

• Small platform footprint
• Low component count
• Low power consumption
• Time-to-market

Complete Mobile Phone Platform Solutions for Major Growth Markets

TtTtargeargektktmaresmares	/GG225/GSMGPRS		G275GEDE		G3UMTS	G35HSDPA
lfPtPlftaormaorm	ULC1	CUL2	MPE-	MP-liEte	MPEU-	MPEH-
BbdbdBaseanasean	o3idarDL	3ec	3	3o	3	3
RFitiRFtransceverransceerv	O3G-E	iov3DLOG-	3	ida3rDLOG	3	3
PPowerowertmanagementmanagemen	3	E3	3	-S3	3	3
lkPttPlkttroocosacroocosac	3	3	3	3	3	3
RRampp-uamp-up	3	3	3	2HCY07	3	CY2007+

Integrated in one chip

Copyright © Infineon Technologies 2007. All rights reserved. Page 13

Infineon's ULC2 is Benchmark in Component Count and Footprint

ULC2 features:

• Color display
• Text messages
• MP3 quality ring tones
• Applications such as integrated handsfree and speaking clock

"Nokia aims to further improve the power performance in our entry level phones and reduce their size. Adding Infineon's single-chip solution to Nokia's portfolio of chipset suppliers helps us ensure access to optimized solutions …"

Soren Petersen, Senior Vice President, Entry Business Unit, Nokia

Nokia selects Infineon's E-GOLDvoice single-chip

Nokia Selects Single-Chip from Infineon for Entry Level Mobile Phones

7 Feb 2007

Munich, Germany – February 7, 2007 – Infineon Technologies (FSE/NYSE: IFX) today announced that Nokia has selected Infineon as a supplier of baseband and RF (Radio frequency) chips for GSM mobile handsets. The highly integrated single-chip E-GOLD™voice will be incorporated in selected future entry level phones from Nokia.

…

"In order to sustain our clear leadership position in this high volume sector, it is critical for Nokia to offer most competitive and cost-effective portfolio of mobile phones to consumers in new growth markets," said Soren Petersen, Senior Vice President, Entry Business Unit, Nokia. "Nokia aims to further improve the power performance in our entry level phones and reduce their size. Adding Infineon's single-chip solution to Nokia's portfolio of chipset suppliers helps us ensure access to optimized solutions for this important market."

E-GOLDvoicesingle-chip integrating:

• •Baseband
• •RF transceiver
• • Power management
• •SRAM

Protocol stack

Introducing the MP-Elite EDGE Single-Chip Platform

2006MP-E2006MP-E

MP-E and MP-Elite features:

• Video and audio playback and recording
• Video streaming
• Dual color display
• Camera modules
• Enhanced security features

2007MP-Elite2007MP-Elite

Up to 30% lower eBoM Up to 20% lower footprint 15% lower component count

Infineon's 7.2 Mb/s HSDPA Platform MP-EH Enables Broadband Multimedia on Less than 16cm²

Key mobile phone platform introductions

13-Feb-07

Copyright © Infineon Technologies 2007. All rights reserved. Page 18

Leading Mobile Platform Customer Base

Announced mobile platform customers

July 2006 Oct. 2006 Feb. 2007

LG

Infineon Multimedia Platform Selected by LGE for New EDGE Mobile Phones

17 Jul 2006

Munich, Germany, Infineon Technologies AG today announced that LG Electronics, Inc. (LGE), Seoul, Korea, has chosen Infineon as phone platform supplier for their new EDGE mobile handsets. Beginning with the recent introduction of new phones by LGE, the MP-E platform from Infineon will be used in a series of EDGE mobile phones from LGE, the number-four mobile phone supplier in the world.

Panasonic Nokia

Infineon's Multimedia Platform for Dual-mode Handsets Powers Newly Launched "SoftBank 705P" GPRS/UMTS 3G Phone for Japanese Market from Panasonic Mobile Communications

5 Oct 2006

Munich, Germany, Infineon Technologies AG, a leading provider of communication ICs today announced that its GPRS/UMTS multimedia platform powers Panasonic Mobile Communications Co., Ltd. newest commercially available Softbank 705P mobile handset which SOFTBANK MOBILE Corp. launched these days for the Japanese market.

Nokia Selects Single-Chip from Infineon for Entry Level Mobile Phones

7 Feb 2007

Munich, Germany, Infineon Technologies today announced that Nokia has selected Infineon as a supplier of baseband and RF (Radio frequency) chips for GSM mobile handsets. The highly integrated single-chip E-GOLD™voice will be incorporated in selected future entry level phones from Nokia.

"In order to sustain our clear leadership position in this high volume sector, it is critical for Nokia to offer most competitive and costeffective portfolio of mobile phones to consumers in new growth markets," said Soren Petersen, Senior Vice President, Entry Business Unit, Nokia. "Nokia aims to further improve the power performance in our entry level phones and reduce their size. Adding Infineon's singlechip solution to Nokia's portfolio of chipset suppliers helps us ensure access to optimized solutions for this important market."

plus design wins across our ULC, EDGE and 3G platforms at major new customers

Infineon Has All it Takes to Turn Around the Wireless Business

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Technology leadership and wireless system competence:

• RF CMOS leadership
• Single-chip solutions for GSM, GPRS and EDGE
• Complete 7.2 Mb/s HSDPA platform

Highly integrated and cost effective solutions for major growth markets:

• HSDPA
• EDGE
• ULC

Leading customer base (announced customers only):

• Nokia (ULC platform)
• Samsung (EDGE RF transceiver)
• LG (EDGE platform)
• Panasonic (3G platform)

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