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Infineon Technologies AG Investor Presentation 2007

May 30, 2007

222_ip_2007-05-30_031dbde0-8985-4536-936f-98e15a0820af.pdf

Investor Presentation

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Infineon Communications Solutions

Lehman Brothers Wireless and Wireline Conference, New York, 30-May-2007

Prof. Dr. Hermann EulExecutive Vice President andMember of the Management Board President Business Group Communication Solutions

Disclaimer

This presentation was prepared as of May 30, 2007 and is current only as of that date.

This presentation includes forward-looking statements about the future of Infineon's business and the industry in which it operates. These include statements relating to future developments in the world semiconductor market, including the market for memory products, Infineon's future growth, the benefits of research and development alliances and activities, Infineon's planned levels of future investment in the expansion and modernization of its production capacity, the introduction of new technology at its facilities, the continuing transitioning of its production processes to smaller structure sizes, cost savings related to such transitioning and other initiatives, Infineon's successful development of technology based on industry standards, Infineon's ability to offer commercially viable products based on its technology, Infineon's ability to achieve its cost savings and growth targets, and the impact of the carve-out of Qimonda, the group's memory products business, its initial public offering, and any further sales of Qimonda shares or other corporate financing measures in that regard.

These forward-looking statements are subject to a number of uncertainties, including trends in demand and prices for semiconductors generally and for Infineon's products in particular, the success of Infineon's development efforts, both alone and with partners, the success of Infineon's efforts to introduce new production processes, the actions of competitors, the availability of funds for planned expansion efforts, and the outcome of antitrust investigations and litigation matters, as well as the other factors mentioned in this presentation and those described in the "Risk Factors" section of the annual report of Infineon on Form 20-F filed with the U.S. Securities and Exchange Commission on November 30, 2006 or contained in the company's quarterly reports. As a result, Infineon's actual results could differ materially from those contained in these forward-looking statements. You are cautioned not to place undue reliance on these forward-looking statements.

Infineon does not undertake any obligation to publicly update or revise any forward-looking statements because of new information, future events or otherwise.

COM - Market Leader in Broadband and RF; Turning Around Mobile Platform Business

COM revenues by segment in FY 2006 Total: EUR 1.2 bn

1) Source: Gartner Dataquest, 2006

Q3 FY 2007

  • Revenues to grow strongly q-o-q; EBIT to improve strongly.
  • Executing on shipment ramp out of strong mobile platform backlog; growing baseband shipments to LG and other customers.
  • Wireless revenue to grow, broadband sales seen about flat.
  • Wireless design win momentum encouraging.

FY 2007 and beyond

FY 2007: expect sales decline y-o-y; expect EBIT before charges to remain broadly flat y-o-y.

Beyond FY 2007: Wireless business to break-even in Dec Q 2007; expect strong sales growth versus FY 2007 and positive EBIT.

Update: Mobile Phone Platforms

Major COM Growth Opportunities: Mobile Phone Platforms

Key Cellular Market Trends

Mobile music, mobile video, mobile internet

Mobile communication in emerging markets

Ongoing consolidation Ongoing BoM optimization

Infineon's Advantage: Mobile Platform System Competence

Advantages:

  • Small platform footprint
  • Low component count
  • Low power consumption
  • Time-to-market

Infineon's ULC2 is Benchmark in Component Count and Footprint

ULC2 features:

  • Color display
  • Text messages
  • MP3 quality ring tones
  • Applications such as integrated handsfree and speaking clock

"Nokia aims to further improve the power performance in our entry level phones and reduce their size. Adding Infineon's single-chip solution to Nokia's portfolio of chipset suppliers helps us ensure access to optimized solutions …"

Soren Petersen, Senior Vice President, Entry Business Unit, Nokia

Introducing the MP-Elite EDGE Single-Chip Platform

2006MP-E2006MP-E

MP-E and MP-Elite features:

  • Video and audio playback and recording
  • Video streaming
  • Dual color display
  • Camera modules
  • Enhanced security features

2007MP-Elite2007MP-Elite

Up to 30% lower eBoM Up to 20% lower footprint 15% lower component count

Complete Mobile Phone Platform Solutions for Major Growth Markets

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Successful Launch of Platforms in Major Target Markets

Plus:

Design win at NOKIA with E-GOLDvoice single-chip for entry level phones.

Design wins across our ULC, EDGE and 3G platforms at other major customers.

Key mobile phone platform introductions

Update: RF Transceivers

Major COM Growth Opportunities: RF Transceiver

Source: ABI Research, Q1 2007; IFX

Market Leader in RF Transceivers

IFX market share and ranking in RF transceivers

Major contributors

  • Successful ramp-up of new RF transceiver for a major OEM
  • Complete product and roadmap conversion to CMOS technology
  • CMOS transceiver in volume production since 2004
  • Excellent RF performance
  • Focus on customer cost of ownership

Source: Gartner, Strategy Analytics; IFX

RF TransceiverCMOS Leadership Turns Into Design-Wins

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65 nm CMOS Solutions Will Pave the Way for Cost, Size and Performance Improvements in '08

Update: Broadband

Major COM Growth Opportunities: Broadband

The "Domino Effect"Market Trends

Market Share and Market Growth Achievements in 2006

Source:

for 2005: Gartner Dataquest, June 2006 for 2006: Infineon Estimates

Product PorfolioAccess Market Focus

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Broadband Design-Win Momentum Continues SHDSL.bis"SOCRATES®-4e" Leading SLAM customers in Europe and AsiaVoIP"VINETICTM" ADSL2+"GEMINAXTM-MAX" VDSL2"VINAXTM" ADSL & VoIP"AMAZON, DANUBE" Design-Win at major EU carrier for ADSL IAD World's first VDSL2 roll-out with Deutsche Telekom on CO- and CPE-side in Germany continues as planned Design-Wins in APAC and NAFTA for profile 17a and 30a Design-Win at two customers based in APAC Major European customer Extension of customer & technology base by positioning VINTETICTM in alternative access technologies Major global customer

Q & A

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