Stop parsing PDFs. Get the API. Request Access

AI Terminal

MODULE: AI_ANALYST
Interactive Q&A, Risk Assessment, Summarization
MODULE: DATA_EXTRACT
Excel Export, XBRL Parsing, Table Digitization
MODULE: PEER_COMP
Sector Benchmarking, Sentiment Analysis
SYSTEM ACCESS LOCKED
Authenticate / Register Log In

Infineon Technologies AG

Investor Presentation • Mar 17, 2006

222_ip_2006-03-17_c9beb4ba-c20f-4cca-bfed-fc0b5d7b5a06.pdf

Investor Presentation

Open in Viewer

Opens in native device viewer

Cheuvreux European IT and Technology Conference ÑAutomotive, Industrial & Multimarketì

Cheuvreux, Paris Peter Bauern If n i e o n

2006-03-10 Slide 1

Paris, March 17, 2006

Peter Bauer Member of the Management Board

Disclaimer

Please note that while you are reviewing this information, this presentation was created as of the date listed, and reflected management views as of that date.

This presentation contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements.

Such risks and uncertainties include, but are not limited to the Risk Factors noted in the Company's Earnings Releases and the Company's filings with the Securities and Exchange Commission.

Table of Contents

Global Trends Global Trends

Automotive Business Automotive Business

Industrial Business Industrial Business

Chipcard & Security ICs Business Chipcard & Security ICs Business

Technology, Manufacturing, Customer Focus Technology, Manufacturing, Customer Focus

Questions & Answers Questions & Answers

Peter Bauer 2006-03-10 Slide 3

Global Trends Global Trends

Automotive Business Automotive Business

Industrial Business Industrial Business

Chipcard & Security ICs Business Chipcard & Security ICs Business

Technology, Manufacturing, Customer Focus Technology, Manufacturing, Customer Focus

Questions & Answers Questions & Answers

The Development of The Global Society Will Continue to Provide Solid Profitability and Growth in Our Businesses

AIM Business Drivers AIM Business Drivers

  • ! Innovation for safer and more economical mobility.
  • ! Saving energy, managing electrical power for environmental protection.
  • ! Protection of privacy and investment in the information society.
  • !Enabling customer visions through IP and technology integration.
  • ! Participation in the growth of the Asian continent.

Fields of Business Fields of Business

  • ! Automotive

  • ! Industry

  • ! Chipcard & Security

  • !Customer-specific design solutions

Mid-term Goal Mid-term Goal

! Double-digit EBIT margin and double-digit growth rate.

2006-03-10 Slide 6

Global Trends Global Trends

Automotive Business Automotive Business

Industrial Business Industrial Business

Chipcard & Security ICs Business Chipcard & Security ICs Business

Technology, Manufacturing, Customer Focus Technology, Manufacturing, Customer Focus

Questions & Answers Questions & Answers

Infineon Focuses on the Major Growth Markets in Automotive Semiconductors

Cheuvreux, Paris Peter Bauer 2006-03-10 Slide 7

Source: Strategy Analytics,

incl. North America, Europe, Japan, S. Korea, China, excl. ROW

Key Innovations:

Engine and Transmission Control Based on TriCoreTM

Infineon's Tricore 32-bit Controller

  • !Highest performing 32-bit embedded Control MCU family in automotive market !Highest performing 32-bit embedded Control MCU family in automotive market
  • !First eFlash in 130nm in volume !First eFlash in 130nm in volume
  • ! Embedded realtime performance + DSP in one chip !Embedded realtime performance + DSP in one chip
  • ! Extremely fast interrupt response time and highest level of fault tolerance !Extremely fast interrupt response time and highest level of fault tolerance

Application trends

! Reduced emissions !Reduced emissions

  • !Less fuel consumption !Less fuel consumption
  • !Better engine behavior and more comfort !Better engine behavior and more comfort
  • -> 32bit performance required! -> 32bit performance required!

Auto MCU Market Development

Key Innovations: Electrical Power Steering (EPS)

Application Trends Application Trends

  • !Reduced installation costs, complete module can be tested at supplier !Reduced installation costs, complete module can be tested at supplier
  • ! Easy adaptation to different cars with software modification, platform approach !Easy adaptation to different cars with software modification, platform approach
  • ! Increased utilization of EPS in smaller and cheaper vehicles ! Increased utilization of EPS in smaller and cheaper vehicles
  • ! Progressive steering and other new features can be realized much simpler with EPS ! Progressive steering and other new features can be realized much simpler with EPS

Infineon Solution Infineon Solution

! Leading in driver ICs and MOSFETs !Leading in driver ICs and MOSFETs

  • ! Almost complete coverage of semiconductor BoM (~ 85%); excellent application know-how !Almost complete coverage of semiconductor BoM (~ 85%); excellent application know-how
  • ! Strong technology roadmap to drive further integration on system level ! Strong technology roadmap to drive further integration on system level
  • ! Excellent quality & reliability for this safety-relevant application ! Excellent quality & reliability for this safety-relevant application

Cheuvreux, Paris Peter Bauer 2006-03-10 Slide 9

EPS Market Development EPS Market Development

Key Innovations:

Tire Pressure Monitoring Systems

Key Trends Key Trends

  • !Further integration of functionality through advanced signal processing. !Further integration of functionality through advanced signal processing.

  • ! Increased robustness.!Increased robustness.

  • ! Standardized signal transmission concepts. !Standardized signal transmission concepts.

  • ! All new light vehicles in US after Sept. 1, 2007 have to be equipped. ! All new light vehicles in US after Sept. 1, 2007 have to be equipped.

Infineon Solution Infineon Solution

  • ! Leading-edge pressure, temperature and rotational sensors. !Leading-edge pressure, temperature and rotational sensors.
  • ! High-performance microcontrollers. !High-performance microcontrollers.

!Broad range of transmitter, receiver and transceiver ICs. !Broad range of transmitter, receiver and transceiver ICs.

Copyright © Infineon Technologies 2006. All rights reserved.

Key Innovations: Hybrid Electrical Vehicles

Cheuvreux, Paris Peter Bauer 2006-03-10 Slide 11

Automotive Semiconductor Solutions Combining Sensing, Computing and Actuating

S e
n
s
e		 C
t
o
m
p
u
e		 A
t
t
c
a
e
u
P
t
i
P
t
i
o
e
r
r
a
n
w
o
w
e
r
r
a
n
D
i
l
E
i
M
t.
e
s
e
n
g
n
e
g
m
-
G
l
i
E
i
M
t.
a
s
o
n
e
n
g
n
e
g
m
-
T
i
i
C
t
l
r
a
n
s
m
s
s
o
n
o
n
r
o
-
S
t
t
/
A
l
t
t
a
r
e
r
e
r
n
a
o
r
-		 P
r
e
!
H
l
a
!		 S
s
s
u
r
e
e
n
s
o
r
l
S
e
n
s
o
r
s		 1
6
C
b
i
t
s
µ
!
3
2
b
i
t
T
i
C
r
o
r
e
!
(
C
D
S
P
)
+
µ		 M
O
S
F
E
Ts
!
Æ
G
I
B
Ts
!
Re
la
t
g
u
o
rs
!
Tr
ive
a
ns
c
e
rs
!
S
t
Po
m
a
r
w
e
r
!
Sy
C
t
I
s
e
m
s
!
S
f
t
M
t
S
f
M
t
t
a
e
y
a
n
a
g
e
m
e
n
a
e
y
a
n
a
g
e
m
e
n
A
B
S
/
T
t
i
C
t
l
r
a
c
o
n
o
n
r
o
-
S
i
u
s
p
e
n
s
o
n
-
A
i
b
R
i
S
t
t
t
+
r
a
g
e
s
r
a
n
s
e
m
s
y
-
P
S
t
i
o
w
e
r
e
e
r
n
g
-
T
i
P
M
i
t
i
r
e
r
e
s
s
u
r
e
o
n
o
r
n
g
-		 P
r
e
!
H
l
a
!
R
F
I
!		 S
s
s
u
r
e
e
n
s
o
r
l
S
e
n
s
o
r
s
C
s		 C
8
b
i
t
s
µ
s
!
1
6
b
i
C
t
s
µ
!
3
2
b
i
t
T
i
C
r
o
r
e
!
(
C
S
)
D
P
+
µ		 D
io
d
e
s
!
Tr
is
t
a
ns
o
rs
!
M
O
S
F
E
Ts
!
Æ
Re
la
t
g
u
o
rs
!
Tr
ive
a
ns
c
e
rs
!
S
t
Po
m
a
r
w
e
r
!
Sy
I
C
t
s
e
m
s
!
&
C
B
d
i
B
d
&
C
i
o
y
o
n
v
e
n
e
n
c
e
o
y
o
n
v
e
n
e
n
c
e
C
L
i
h
t
t
l
g
o
n
r
o
-
H
i
V
i
l
i
t
t
t
e
a
n
g,
e
n
a
o
n,
-
A
i
C
d
i
t
i
r
o
n
o
n
D
&
S
t
o
o
r
e
a
-
S
t
B
t
t
T
i
l
m
a
r
a
e
r
y
e
r
m
n
a
-		 H
l
a
!
T
e
m
!
R
F
I
!		 l
S
e
n
s
o
r
s
S
p.
e
n
s
o
r
s
C
s		 8
b
i
C
t
µ
s
!
1
6
b
i
t
C
µ
s
!		 D
io
d
e
s
!
Tr
is
t
a
ns
o
rs
!
O
S
M
F
E
Ts
!
Re
la
t
g
u
o
rs
!
Tr
ive
a
ns
c
e
rs
!
S
t
Po
m
a
r
w
e
r
!
I
f
i
t
t
I
f
i
t
t
n
o
a
n
m
e
n
n
o
a
n
m
e
n
T
l
t
i
e
e
m
a
c
s
-
N
i
t
i
a
v
g
a
o
n
-
M
l
i
d
i
t
m
e
a
u
-
C
A
d
i
a
r
u
o
-
D
h
b
d
a
s
o
a
r
-		 M
i
c
r
o
S
h
o
r
l
i
t
s
o
u
C
A
N
/
M
l
t
i
u		 l
l
t
c
o
n
r
o
e
r
s,
t
R
(
B
l
a
n
g
e
u
e
G
P
S,
H
i
o
n
s,
M
O
S
T
T
r
a
n
s
c
d
i
C
d
m
e
a
a
r
s,		 W
i
d
R
(
G
S
M
/
e
a
n
g
e
t
t
h,
W
L
A
N
)
o
o
c
o
m
h
F
I
C
g
r
e
q
e
n
c
s,
u
y
i
P
l
t
i
O
t
e
v
e
r
s,
a
s
c
p
P
I
C
S
i
t
o
w
e
r
s,
e
c
u
r
Cop
yrig
ht ©
Inf
ine
Tec
on		 G
P
R
S
)
d
a
n
i
t
i
m
u
n
c
a
o
n
i
l
F
i
b
c
a
r
e
s,
I
C
y
s
hno
log
ies
200
6. A
ll ri
ght
ed.
s re
serv

2006-03-10 Slide 13

Global Trends Global Trends

Automotive Business Automotive Business

Industrial Business Industrial Business

Chipcard & Security ICs Business Chipcard & Security ICs Business

Technology, Manufacturing, Customer Focus Technology, Manufacturing, Customer Focus

Questions & Answers Questions & Answers

The Industrial Market is Very Fragmented, Regarding Market Players, Applications and Requirements

Our Current Microcontroller Portfolio is Well Suited to Address Our Target Markets

Global Power Semiconductor Market: Market Development by Region

R
k
a
n
2
0
0
4		 R
k
a
n
2
0
0
3		 S
l
i
u
p
p
e
r		 2
0
0
4		 2
0
0
3		 C
h
a
n
g
e
1 1 I
f
i
n
n
e
o
n		 8.
4
%		 8.
1
%		 0.
3
%
2 2 I
R		 8
%
7.		 8.
0
%		 -0
2
%
3 4 F
i
h
i
l
d
a
r
c		 7.
7
%		 7.
6
%		 0.
1
%
4 3 S
T
M		 2
%
7.		 6.
%
7		 0.
%
5
5 5 T
h
i
b
o
s
a		 6.
7
%		 7.
4
%		 -0
7
%
Ch
euv
reu
x,		 Pa
ris
Pet
er B
aue
r
20
0
6-
0
3-
10		 Slid
16
e

Source: IMS Research, Global Market for Power Semiconductors, August 2005 *Source: iSuppli, "Power Management Competitive Analysis 2005î, Sept 2005, **Source: IFX estimation, 2005

A
i
m
e
r
c
a
s		 2
0
0
4		 2
0
0
3
1.
I
R
2
I
f
i
n
n
e
o
n
O
3
N
S
i
e
m
S
4
T
M
5
V
i
h
s
a
y		 1
4
9
%
1
1.
4
%
9
1
%
%
7
9
6
%
7		 1
4
%
5
1
0
9
%
8
7
%
%
6
6
%
5
5
E
M
E
A		 2
0
0
4		 2
0
0
3
1.
I
f
i
n
n
e
o
n
2
S
T
M
3
I
R
S
4
i
k
e
m
r
o
n
V
i
h
5
s
a
y		 2
1.
6
%
1
1.
5
%
%
1
0
1
,
%
7
7
8
%
5		 2
0
2
%
1
1.
1
%
%
1
0
7
,
%
7
2
2
%
5
S
A
I
A		 2
0
0
4		 2
0
0
3
1.
T
h
i
b
o
s
a
2
F
i
h
i
l
d
a
r
c		 9
3
%
8
9
%		 9
4
%
8
%
7
Ö
9
S
a
n
y
o
N
E
C
1
0
1
1.
I
f
i
n
n
e
o
n		 Ö
4
3
%
4
1
%
3
8
%		 Ö
4
2
%
4
3
%
3
7
%

Copyright © Infineon Technologies 2006. All rights reserved. thereof > 8% share in APAC, < 1% in Japan**

Key Innovations: Flat Panel Displays and Computing Products using CoolMOSTM

CoolMOS CoolMOS ññ the ultimate high-voltage power MOSFET the ultimate high-voltage power MOSFET

  • ! New technological standard in high-voltage MOSFETs. ! New technological standard in high-voltage MOSFETs.
  • ! Enables a significant reduction of conducting and switching losses. ! Enables a significant reduction of conducting and switching losses.
  • ! Extremely reduced heat generation. ! Extremely reduced heat generation.
  • ! Largest range of packaging options. ! Largest range of packaging options.
  • ! Reduced overall system cost with CoolMOS. ! Reduced overall system cost with CoolMOS.

Application trends Application trends

  • ! Increased output power !Increased output power
  • !Reduced size and weight of the power supply !Reduced size and weight of the power supply

  • highest conversion efficiency is achieved by combining CoolMOS with thinQ!TM Silicon Carbide Schottkydiode!#highest conversion efficiency is achieved by combining CoolMOS with thinQ!TM Silicon Carbide Schottky diode!

Market development HV MOSFETs Market development HV MOSFETs (>500V) (>500V)

Cheuvreux, Paris Peter Bauer 2006-03-10 Slide 17

Key innovations:

Power Supplies for Graphics Cards with OptiMOS 2

OptiMOS 2 in Graphics Card Applications OptiMOS 2 in Graphics Card Applications

High end: 2005 High end: 2005

  • ! Increasing graphics processor performance requires higher power density. !Increasing graphics processor performance requires higher power density.
  • ! This requires a high efficient power supply using state-of-the-art MOSFET technologies and packages. ! This requires a high efficient power supply using state-of-the-art MOSFET technologies and packages.
  • ! Power consumption increased from 2002 to 2005 by 30% in high-end segment. ! Power consumption increased from 2002 to 2005 by 30% in high-end segment.
  • ! Infineon OptiMOS 2 offering: ! Infineon OptiMOS 2 offering:
      • performance leadership which offers very high efficiency in application - performance leadership which offers very high efficiency in application
      • state-of-the-art SuperSO8 package - state-of-the-art SuperSO8 package

Copyright © Infineon Technologies 2006. All rights reserved.

    • excellent cost / performance ratio - excellent cost / performance ratio
  • ! Infineonís key customers include NVIDIA and ATI. ! Infineonís key customers include NVIDIA and ATI.

High end: 2002 High end: 2002

Cheuvreux, Paris Peter Bauer 2006-03-10 Slide 19

Key Innovations: Induction Heating with IGBT

Induction heating with IGBTs Induction heating with IGBTs

  • ! Reverse Conducting IGBT !Reverse Conducting IGBT
    • ñ IGBT's based on Infineon TrenchStopTM technology with integrated backside diode lead to highest efficiency in induction conduction applications. ñ IGBT's based on Infineon TrenchStopTM technology with integrated backside diode lead to highest efficiency in induction conduction applications.
  • !600-900-1200V families cover all used line voltages in the world. !600-900-1200V families cover all used line voltages in the world.

IGBTs in induction heating market IGBTs in induction heating market

Copyright © Infineon Technologies 2006. All rights reserved. Label on the Sunpentown cookers

Controlling Power With Power Semiconductors, Power Modules and Microcontrollers

P
P
o
w
e
r
o
e
r
w
D
i
t
D
i
t
s
c
r
e
e
s
s
c
r
e
e
s		 P
P
o
w
e
r
o
e
r
w
M
d
l
M
d
l
o
e
s
u
o
u
e
s		 P
P
o
w
e
r
o
e
r
w
I
C
I
C
s
s		 M
i
M
i
c
r
o
c
r
o
-

t
l
l
l
l
t
c
o
n
r
o
e
r
s
c
o
n
r
o
e
r
s
D
i
t
i
b
t
d
D
i
t
i
b
t
d
s
r
u
e
s
r
u
e
P
P
o
e
r
w
o
w
e
r
G
t
i
G
t
i
e
n
e
r
a
o
n
e
n
e
r
a
o
n		 T
hy
is
t
&
r
o
r
!
D
io
d
e
s
Pr
P
A
C
K
e
s
s		 Ea
P
I
M
sy
!
Ea
P
A
C
K
sy
!
Ec
P
A
C
K
o
no
!
I
H
M
du
le
m
o
s
!
B
I
P
du
le
m
o
s
!
S
ks
t
a
c
!		 E
ic
Dr
iv
e
e
!		 8-
b
i
t µ
C
s
!
1
6-
b
i
C
t µ
s
!
3
2-
b
i
t
Tr
i
C
o
re
!
(
C
D
S
P
)
+
µ
A
i
/
t
t
/
A
t
t
i
u
o
m
a
o
n
o
m
a
o
n
u
M
C
l
t
t
M
C
l
t
t
o
o
r
o
n
r
o
o
o
r
o
n
r
o
I
d
t
i
l
D
i
n
u
s
r
a
r
v
e
s
-
C
D
i
o
n
s
u
m
e
r
r
v
e
s
-		 C
Em
o
n
!
Tr
h
S
t
e
nc
o
p
!
I
G
B
Ts
Fa
I
G
B
Ts
t
s
!		 Ea
P
I
M
sy
!
Ea
P
A
C
K
sy
!
Ec
P
A
C
K
o
no
!
I
H
M
du
le
m
o
s
!
B
I
P
du
le
m
o
s
!
S
ks
t
a
c
!		 &
C
C
P
W
M
P
F
I
s
!
E
ic
Dr
iv
e
e
!		 C
8-
b
i
t µ
s
!
1
6-
b
i
C
t µ
s
!
3
2-
b
i
t
Tr
i
C
o
re
!
(
C
D
S
P
)
+
µ
T
t
i
T
i
t
r
a
c
o
n
r
a
c
o
n		 T
hy
is
&
t
r
o
r
!
D
io
d
e
s
Pr
P
A
C
K
e
s
s		 I
H
M
/
I
H
V
!
du
le
m
o
s
S
ks
t
a
c
!
Pr
im
P
A
C
K
e
!
6
2m
I
G
B
T
m
!
du
le
m
o
s		 E
ic
Dr
iv
e
e
!		 8-
b
i
C
t µ
s
!
1
6-
b
i
t µ
C
s
!
3
2-
b
i
Tr
i
C
t
o
re
!
(
C
D
S
P
)
+
µ
S
P
l
i
S
P
l
i
o
e
r
p
p
e
s
w
u
o
w
e
r
u
p
p
e
s
U
P
S
-
A
C
/
D
C
-
C
/
C
D
D
-		 C
l
M
O
S
o
o
!
h
in
Q
!
(
S
i
C
t
!
S
ho
t
t
ky
D
io
d
)
c
e
H
ig
hs
d
I
G
B
p
e
e
!
O
t
i
M
O
S
p
!		 Ea
P
I
M
sy
!
Ea
P
A
C
K
sy
!
Is
P
A
C
K
o
!
Ts
Ec
P
A
C
K
o
no
!
T
hy
is
t
/
r
o
r-
!
D
io
d
du
le
e-
m
o
s		 P
W
M
&
P
F
C
I
C
s
!
C
l
S
E
T
o
o
!
In
t
t
d
e
g
ra
e
!
i
he
t
sw
c
s
G
t
d
iv
a
e
r
e
rs
!
E
ic
Dr
iv
e
e
!		 8-
b
i
t µ
C
s
!
1
6-
b
i
C
t µ
s
!

Cheuvreux, Paris Peter Bauer 2006-03-10 Slide 20

2006-03-10 Slide 21

Global Trends Global Trends

Automotive Business Automotive Business

Industrial Business Industrial Business

Chipcard & Security ICs Business Chipcard & Security ICs Business

Technology, Manufacturing, Customer Focus Technology, Manufacturing, Customer Focus

Questions & Answers Questions & Answers

Total Smart Card Market: Strong Drivers

Key market drivers Key market drivers

  • ! Contactless technology is breaking through in more applications and drives potential demand !Contactless technology is breaking through in more applications and drives potential demand
  • ! SIM cards continue to grow faster than expected !SIM cards continue to grow faster than expected
  • ! ePass offer a tremendous growth potential for the smart card industry !ePass offer a tremendous growth potential for the smart card industry
  • ! Enhanced value of cíless smart cards, e.g. flexibility, speed, personalization benefits, and convenience promotes its usage ! Enhanced value of cíless smart cards, e.g. flexibility, speed, personalization benefits, and convenience promotes its usage

Cheuvreux, Paris Peter Bauer 2006-03-10 Slide 22

Realization of significant manufacturing cost reduction required for profitability in chip card ICs

Market Situation

  • ! Volumes stable due to seasonal effects; further growth expected in Q2 and Q3. ! Volumes stable due to seasonal effects; further growth expected in Q2 and Q3.
  • !Continuing price pressure in the main controller-based product segments: 25 ñ 40% price decline y-o-y for the main SIM card applications !Continuing price pressure in the main controller-based product segments: 25 ñ 40% price decline y-o-y for the main SIM card applications

Chipcard Strength

  • ! Leading in security certification !Leading in security certification
  • ! 88 state-of-the-art security architecture ! 88 state-of-the-art security architecture
  • ! Leading edge NVM technology, 1st in 130nm Flash !Leading edge NVM technology, 1st in 130nm Flash
  • !Microslim & FCOS for cost advantage in chips & modules !Microslim & FCOS for cost advantage in chips & modules
  • !Security architecture and low-power design !Security architecture and low-power design
  • !Contactless chip and system expertise !Contactless chip and system expertise

MicroSlim technology & FCOS

  • ! Continuous execution of the previously announced cost reduction measures of MicroSlim, FCOS and the 130nm product introduction. ! Continuous execution of the previously announced cost reduction measures of MicroSlim, FCOS and the 130nm product introduction.
  • ! Introduction of new optimized MicroSlim derivatives (scheduled for 2nd half FY 2006). !Introduction of new optimized MicroSlim derivatives (scheduled for 2nd half FY 2006).

Copyright © Infineon Technologies 2006. All rights reserved.

Cheuvreux, Paris Peter Bauer 2006-03-10 Slide 23

Key Innovations: Trusted Platform Module (TPM)

Windows Vista supports full-volume encryption to prevent disk access by other operating systems. It also stores encryption keys in a Trusted Platform Model (TPM) v1.2 chip. (Source: http://www.microsoft.com/windowsvista/basics/security.mspx)

%Support for other OS (eg. Linux) in preparation!

Trusted Platform Module Market

TPM Features

\$Check the system integrity

What is the status of the hardware and software environment?

\$Authenticate and provide information on the security status of the platform

Inform user and communication partners (if allowed by user).

\$ Secure storage

Safe environment for customer secret and private data.

\$ Ensure the privacy of the user

Full control of privacy by the user.

Copyright © Infineon Technologies 2006. All rights reserved.

in millionunits

Infineon Was Named First Supplier for the U.S. ePassport and is Currently the Only Company With Necessary Security Approval by NIST*

*Note: NIST = National Institute of Standards and Technology, U.S.

2006-03-10 Slide 25

Chip Card and Security Applications: Infineon is Well-positioned to Serve Key Growth Markets

Cheuvreux, Paris Peter Bauer 2006-03-10 Slide 26

2006-03-10 Slide 27

Global Trends Global Trends

Automotive Business Automotive Business

Industrial Business Industrial Business

Chipcard & Security ICs Business Chipcard & Security ICs Business

Technology, Manufacturing, Customer Focus Technology, Manufacturing, Customer Focus

Questions & Answers Questions & Answers

Infineon's Frontend Fab Locations for Power Logic: Global Technology and Manufacturing Competence

Cheuvreux, Paris Peter Bauer 2006-03-10 Slide 28

Copyright © Infineon Technologies 2006. All rights reserved. Additional capacities at silicon foundries: ASMC, Chartered, TSMC and ZMD Additional capacities at silicon foundries: ASMC, Chartered, TSMC and ZMD

Package Development and Manufacturing Core Competence

P
P
o
e
r
w
o
w
e
r		 D
i
t
D
i
t
s
c
r
e
e
s
s
c
r
e
e
s		 S
S
e
n
s
o
r
s
e
n
s
o
r
s		 H
i
h
P
H
i
h
P
g
o
e
r
w
g
o
w
e
r		 C
h
i
C
d
C
h
i
C
d
p
a
r
p
a
r
P
l
t
P
l
t
a
n
s
a
n
s
M
l
M
l
a
a
c
c
a
!
!
a
a
c
c
a
M
i
P
d
t
M
i
P
d
t
a
n
r
o
u
c
s
a
n
r
o
u
c
s
P
P
o
w
e
r
!
o
e
r
!
w
d
i
t
d
i
t
s
c
r
e
e
s
s
c
r
e
e
s
C
I
d
l
t
i
I
C
d
l
t
i
s
a
n
m
u
!
s
a
n
m
!
u
h
i
k
h
i
k
c
p
p
a
c
a
g
e
s
c
p
p
a
c
a
g
e
s		 P
l
t
P
l
t
a
n
s
a
n
s
M
l
M
l
a
a
c
c
a
!
!
a
a
c
c
a
W
i
W
i
!
u
x
!
u
x
R
b
R
b
!
e
g
e
n
s
u
r
g
e
g
e
n
s
u
r
g
!
M
i
P
d
t
M
i
P
d
t
a
n
r
o
u
c
s
a
n
r
o
u
c
s
T
i
t
T
i
r
a
n
s
s
t
o
r
s
!
!
r
a
n
s
s
o
r
s
D
i
d
D
i
d
!
o
e
s
!
o
e
s		 P
l
t
P
l
t
a
n
s
a
n
s
R
b
R
b
e
g
e
n
s
r
g
!
u
!
e
g
e
n
s
u
r
g
M
l
M
l
!
a
a
c
c
a
!
a
a
c
c
a
S
k
S
k
!
o
p
p
u
m
o
p
p
u
m
!
M
i
P
d
t
M
i
P
d
t
a
n
r
o
u
c
s
a
n
r
o
u
c
s
H
l
l
H
l
l
a
s
e
n
s
o
r
s
!
!
a
s
e
n
s
o
r
s
T
T
!
e
m
p.
s
e
n
s
o
r
s
!
e
m
p.
s
e
n
s
o
r
s
P
P
!
r
e
s
s
u
r
e
r
e
s
s
u
r
e
!
s
e
n
s
o
r
s
s
e
n
s
o
r
s
R
i
l
t
t
R
t
t
i
l
!
o
a
o
n
a
o
a
o
n
a
!
s
e
n
s
o
r
s
s
e
n
s
o
r
s		 P
l
t
P
l
t
a
n
s
a
n
s
W
t
i
W
i
a
r
s
t
e
n
!
!
a
r
s
e
n
C
l
È
d
C
l
È
d
!
e
g
!
e
g
M
i
P
d
t
M
i
P
d
t
a
n
r
o
u
c
s
a
n
r
o
u
c
s
G
I
B
T
d
l
I
G
B
T
d
l
m
o
u
e
s
!
m
o
e
s
!
u
I
H
M
/
I
H
V
d.
I
H
M
/
I
H
V
d.
m
o
!
!
m
o
D
i
d
/
T
h
i
t.
D
i
d
/
T
h
i
t.
!
o
e
s
y
r
s
!
o
e
s
y
r
s
S
k
t
S
t
k
!
a
c
s
a
c
s
!
D
i
B
d
D
i
B
d
r
v
e
r
o
a
r
s
!
r
v
e
r
o
a
r
s
!		 P
l
t
P
l
t
a
n
s
a
n
s
R
b
R
b
e
g
e
n
s
r
g
!
u
!
e
g
e
n
s
u
r
g
W
i
W
i
!
u
x
!
u
x
M
i
P
d
t
M
i
P
d
t
a
n
r
o
u
c
s
a
n
r
o
u
c
s
C
t
t-
b
d
C
t
t-
b
d
o
n
a
c
a
s
e
!
o
n
a
c
a
s
e
!
C
h
i
d
C
h
i
d
p
c
a
r
s
p
c
a
r
s
C
t
t
l
C
t
t
l
o
n
a
c
e
s
s
!
o
n
a
c
e
s
s
!
C
h
i
d
C
h
i
d
p
c
a
r
s
p
c
a
r
s
S
C
i
t
I
S
i
t
I
C
e
c
u
r
y
s
!
e
c
r
s
!
u
y

Site Development AIM Manufacturing Landscape Continued Consolidation from 6" to 8"

AIMs Automotive Excellence Program Drives Strong Quality Focus

Cheuvreux, Paris Peter Bauer 2006-03-10 Slide 31

Examples of Recent Customer Appreciation

Supplier of the Year 2004 Award

for Quality, Logistics, Flexibility. First semiconductor company ever receiving this award.

Best Supplier Award 2005

for Technology, Quality, Response time, Delivery and Cost among 153 suppliers.

Best Supplier Award

for Quality, Price, Logistics, Innovations.

Certificate of Recognition

for Support of the Astec Zero Defect Plan in 2004.

Preferred Supplier Award 2005

for Logistics, Innovation, Price and Customer Relations.

Cornerstones of the AIM Strategy

P
d
t
i
i
t
P
d
t
i
i
t
r
o
u
c
v
y
r
o
u
c
v
y		 A
l
l
f
b
f-
h
i
8
ì;
l
i
d
i
f
t
t
t
t
t
!
a
s
s
a
e
-o
e
-a
r
n
s
r
e
a
m
n
e
m
x
o
p
r
o
c
e
s
s
e
s
C
f
f
l
P
l
h
b
i
K
l
i
M
l
i
!
o
s
u
r
e
o
e
r
a
c
;
n
e
w
a
n
u
m
a
a
y
s
a
,
C
i
d
i
i
t
!
o
m
p
a
n
y
-w
e
g
r
o
s
s
m
a
r
g
n
m
p
r
o
v
e
m
e
n
p
r
o
g
r
a
m
T
h
l
T
h
l
e
c
n
o
o
g
y
e
c
n
o
o
g
y		 I
G
B
T
t
h
l
l
d
h
i
!
e
c
n
o
o
g
e
a
e
r
s
p
y
U
i
S
i
C
d
C
l
M
O
S
(
h
i
h
l
M
O
S
F
E
T
)
t
!
n
q
u
e
a
n
o
o
g
v
o
a
g
e
h
l
i
t
e
c
n
o
o
g
e
s
F
i
i
h
1
3
0
F
l
h
i
l
t
t
!
r
s
c
o
m
p
a
n
y
w
n
m
e
a
s
n
v
o
u
m
e
Q
&
l
i
t
Q
&
l
i
t
u
a
y
u
a
y
L
i
i
t
L
i
i
t
o
g
s
c
s
o
g
s
c
s		 S
f
f
f
t
l
i
t
d
l
i
t
i
!
r
o
n
g
o
c
u
s
o
n
q
u
a
y
a
n
o
g
s
c
s
p
a
y
s
o
f
B
t
l
i
t
l
l
J
l
i
!
e
s
q
u
a
y
o
a
n
o
n
a
p
a
n
e
s
e
s
u
p
p
e
r
s
-
A
I
M
C
t
f
i
d
f
!
s
o
m
e
r
s
c
o
n
r
m
e
p
e
r
o
r
m
a
n
c
e
u
S
t
S
t
r
o
n
g
r
o
n
g
S
t
S
t
e
g
m
e
n
s
e
g
m
e
n
s		 C
i
i
i
i
h
t
t
t
t
t
!
o
n
n
u
o
u
s
n
v
e
s
m
e
n
n
s
e
g
m
e
n
s
w
h
t
t
s
r
o
n
g
g
r
o
w
I
d
R
&
D
d
i
i
b
i
!
n
c
r
e
a
s
e
s
p
e
n
n
g
n
c
o
r
e
u
s
n
e
s
s
F
t
F
t
r
e
u
u
r
e
u
u
B
i
B
i
u
s
n
e
s
s
e
s
u
s
n
e
s
s
e
s		 B
i
l
d
d
i
i
b
i
!
p
n
e
a
n
p
r
o
m
s
n
g
s
n
e
s
s
e
s
e
g
u
u
w
u
,
H
b
i
d
R
d
T
P
M
S
M
E
M
S
8
8
f
i
l
r
a
a
r,
a
m
y
y
,
,
,
,
H
V
C
M
O
S
3
2
b
i
t
C
i
t
h
F
l
h
e
a
s
µ
w
-
-
,
Cop
yrig
ht ©
Inf
ine
Tec
hno
log
ies
200
6. A
ll ri
ght
ed.
on
s re
serv

Global Trends Global Trends

Automotive Business Automotive Business

Industrial Business Industrial Business

Chipcard & Security ICs Business Chipcard & Security ICs Business

Technology, Manufacturing, Customer Focus Technology, Manufacturing, Customer Focus

Questions & Answers Questions & Answers

2006-03-10 Slide 34

Cheuvreux, Paris

2006-03-10 Slide 35

Peter Bauer

Never stop thinking.

More from Infineon Technologies AG

Director's Dealing 2025
Dec 9
Director's Dealing 2025
Dec 5
Report Publication Announcement 2025
Nov 28
Report Publication Announcement 2025
Nov 28
Report Publication Announcement 2025
Nov 28
Annual Report 2025
Nov 28
Transaction in Own Shares 2025
Nov 17
Earnings Release 2025
Nov 12
Transaction in Own Shares 2025
Nov 10
Transaction in Own Shares 2025
Nov 3
View all filings →

Talk to a Data Expert

Have a question? We'll get back to you promptly.