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Infineon Technologies AG

Investor Presentation • Apr 1, 2006

222_ip_2006-04-01_e9792b48-b2e5-489b-9a43-e096fa9e070f.pdf

Investor Presentation

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Half Year Roadshow

June

Slide - 1 - ## April / May 2006

Dr. Wolfgang Ziebart President and CEO

Peter J. Fischl Executive Vice President and CFO

  • -

Disclaimer

Please note that while you are reviewing this information, this presentation was created as of the date listed, and reflected management views as of that date.

This presentation contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements.

Such risks and uncertainties include, but are not limited to the Risk Factors noted in the Company's Earnings Releases and the Company's filings with the Securities and Exchange Commission.

Contents

Financials and Outlook Financials and Outlook

AIM Review AIM Review

COM Review COM Review

Qimonda Review Qimonda Review

Financials and Outlook Financials and Outlook

AIM Review AIM Review

COM Review COM Review

Qimonda Review Qimonda Review

Results Overview

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Presentation for Q2 FY06 June Quarter 2006 Slide-5-

Maintaining a Net Cash Position

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Presentation for Q2 FY06 June Quarter 2006 Slide - 6 -

(1) Excluding purchase / sale of marketable securities.

Infineon Business Group Q3 FY06 Outlook as of April 26th

  • AIMAIM! AIM revenues to remain broadly unchanged qoq with automotive and industrial flat and an expected normalization in chipcard sales from very high Q2 FY06 levels.
    • ! AIM EBIT to be driven by top line prior to inclusion of certain corporate overhead expenses that will remain with logic segments after Qimonda carve-out.

COM COM

  • !COM revenues to decline qoq due to loss of Fiber Optics revenue as a result of divestiture and due to normalization of sales levels in broadband access.
  • ! COM EBIT to be driven by top line prior to inclusion of certain corporate overhead expenses that will remain with logic segments after Qimonda carve-out.

  • ! Bit production expected to grow approximately 10% quarter over quarter.
    • !EBIT to be influenced by benefit from certain corporate overhead expenses that will remain with logic segments after Qimonda carve-out, offset in part by build of Qimonda proprietary corporate infrastructure.

Presentation for Q2 FY06 June Quarter 2006 Slide - 7 -

Presentation for Q2 FY06 June Quarter 2006 Slide - 8 -

Business Group Automotive, Industrial & Multimarket Q2 FY06 Update

! Revenue +12% qoq. Main drivers: power semiconductors for consumer applications, ICs for computer peripherals and strong demand and improved product mix in chipcard.

!EBIT driven by top-line; significant reduction in chipcard losses. 10% margin despite ongoing expenses for Perlach and Kulim fabs.

Presentation for Q2 FY06 June Quarter 2006 Slide-9-

June Quarter 2006 Slide - 10 -

Ww Automotive Semiconductor Market by Applications; Safety is the Largest and the Fastest Growing Segment

Presentation for Q2 FY06 June Quarter 2006 Slide - 11 -

Source: Strategy Analytics 9/2003

Automotive Electronics Need Full Spectrum of Semiconductor Technologies

Presentation for Q2 FY06June Quarter 2006 Slide - 12 -

Automotive Semiconductor Product Segments

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Presentation for Q2 FY06June Quarter 2006 Slide-13 -

Market Share of Automotive Semiconductor Supplier

Presentation for Q2 FY06 June Quarter 2006 Slide-14 -

The Industrial Market is Very Fragmented, Regarding Market Players, Applications and Requirements

Presentation for Q2 FY06 June Quarter 2006 Slide - 15 -

Source: IMS Research, July 2005

Infineon Strengthened Market Leadership in Power Semis

Power Semiconductor Market Power Semiconductor Market

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Presentation for Q2 FY06 June Quarter 2006 Slide - 16 -

Sources: (top) iSuppli, August 2005; (bottom) IMS Research, August 2005

The Industry Business Segmentation

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Key Innovation: Induction Heating with Reverse Conducting IGBT

!IGBT's based on Infineon TrenchStopTM technology with integrated backside diode lead to highest efficiency in induction applications. !600 / 900 / 200V families cover all used line voltages in the world. !Market leader in the big market for 1-plate induction heating. !IGBT's based on Infineon TrenchStopTM technology with integrated backside diode lead to highest efficiency in induction applications. !600 / 900 / 200V families cover all used line voltages in the world. !Market leader in the big market for 1-plate induction heating.

Presentation for Q2 FY06 June Quarter 2006 Slide - 18 -

Chip Card and Security Applications

Presentation for Q2 FY06June Quarter 2006 Slide - 19 -

Presentation for Q2 FY06 June Quarter 2006 Slide - 20 -

Business Group Communication Solutions Q2 FY06 Update

  • ! COM revenue declined qoq despite strong broadband access sales (espec. VDSL2) due to seasonality and lower baseband demand.
  • !COM EBIT was lower qoq due to top line development in spite of further improvement in profitability in broadband access.

Presentation for Q2 FY06 June Quarter 2006 Slide - 21 -

(1) Excl. acquisition related expenses and net charges resulting primarily from reorganization measures.

Slide - 22 -

Design Win at Deutsche Telekom for ADSL2+ and VDSL2 Rollout

Presentation for Q2 FY06June Quarter 2006 Slide - 23 -

Expanding RF Customer Base Through RF CMOS Leadership

  • !No. 1 in RF with approximately 200 million RF chips sold in CY05 !No. 1 in RF with approximately 200 million RF chips sold in CY05
  • ! Design-win for EDGE (SMARTi PM) at Samsung; ramp-up in FQ3.!Design-win for EDGE (SMARTi PM) at Samsung; ramp-up in FQ3.
  • !Two further design-wins for other RF transceivers at two other major customers. !Two further design-wins for other RF transceivers at two other major customers.

SMARTi 3G HSDPA / WCDMA SMARTi 3G HSDPA / WCDMA SMARTi 3GE HSDPA / WCDMA / EDGE SMARTi 3GE HSDPA / WCDMA / EDGE

World's first CMOS onechip 6-band WCDMA and 4-band EDGE transceiver World's first CMOS onechip 6-band WCDMA and 4-band EDGE transceiver

World's first CMOS single-chip 6-band transceiver World's first CMOS single-chip 6-band transceiver

World's first CMOS EDGE single-chip transceiver World's first CMOS EDGE single-chip transceiver

SMARTi

SMARTi

EDGE

EDGE

PM

PM

Presentation for Q2 FY06 June Quarter 2006 Slide-24-

Competitive Mobile Phone Platforms Offering Leads to Several Design Wins

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Presentation for Q2 FY06 June Quarter 2006 Slide-25 -

Presentation for Q2 FY06 June Quarter 2006 Slide - 26 -

Q2 FY06 Update

  • !Strong top line growth to second highest quarterly level since foundation of Infineon.
  • ! Significant shipment growth. DDR2 price recovery coupled with higher specialty share also led to slight ASP increase.
  • ! Back to positive EBIT thanks to shipment and ASP increase and fully loaded cost reduction. Inventory range 2-6 weeks, down 2 weeks.

FY05/06 and FY 06/07: Planned Measures

Presentation for Q2 FY06June Quarter 2006 Slide - 28 -

Share of Graphics RAMs as of Total DRAM Bit Shipments

Presentation for Q2 FY06 June Quarter 2006 Slide - 29 -

Source: Qimonda

DRAM Trench Technology Roadmap Optimizing for Performance, Power and Cost

Presentation for Q2 FY06 June Quarter 2006 Slide-30 -

Presentation

June Quarter 2006

Slide - 31 - for Q2 FY06

Never stop thinking.

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