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Infineon Technologies AG

Investor Presentation • Aug 2, 2005

222_ip_2005-08-02_43ec1e6d-dd3a-4b6c-920d-c5456ce458a5.pdf

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Company Information

Infineon Company Information July 2005

July 2005

Page 1

Table of contents

Information July 2005 Page 2

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General company information General company information

Semiconductor market development and forecasts 1993 - 2006

Infineon Company Information July 2005 Page 4

1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006

Source: WSTS for historical data

* As of July 12th, 2005

** incl. Update 1Q CY 2005

Company

Information

July 2005

Page 5

Worldwide semiconductor ranking Q1 2005 and Q1 2004

Source: iSuppli, June 2005

Company

Information

July 2005

Page 6

Ranking Americas*

Source: iSuppli, June 2005

Company

Information

July 2005

Page 7

Ranking Europe

Source: iSuppli, June 2005

Ranking Asia

Infineon Company Information July 2005 Page 8

Source: iSuppli, June 2005

Ranking in all targeted applications

Infineon Company Information July 2005 Page 9

* Application-specific semiconductor Source:GartnerDataquest (March 2005);iSuppli(March 2005)

Infineon at a glance

  • Infineon – the No. 6 semiconductor company worldwide
  • Revenues of Euro 7.2 billion in the fiscal year 2004; revenues growth of 17% year-on-year
  • Approx. 36,000 employees (incl. 7,300 R&D staff) as of June 30, 2005
  • Strong technology portfolio with about 41,000 patents and applications; more than 35 major R&D locations worldwide
  • Most advanced fab cluster in 300mm production
  • Focus on automotive and industrial electronics, security and chip cards, communication and memory products

Infineon Company Information July 2005 Page 11

Company

Information

July 2005

Page 12

Business Groups

Applications

Automotive, Industrial & Multimarket

Car Electronics (powertrain, safety management, body & convenience, infotainment), Power control (distributed power generation, automation / motor control, traction, power supplies), Chipcard & Security (communications, payment, identification, entertainment)

Communication

MPMP

Memory Products

Mobile Solutions, Cellular Base Stations, Broadband and Carrier Access, Metro Ethernet Access, Local / Personal area wireless, GPS, CPE, Tuner

Desktop and notebook PCs, workstations, infrastructure (servers and networking), computer peripherals, PDAs, SMART phones, consumer products, Removable-Solid-State-Memories (Flash-Cards)

Customers

Infineon's technology competence

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Cop
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Inf
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20
05.
All
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General company information General company information

Infineon's four pillars

Customer Focus:

We think of our customers first; delivering innovative semiconductor solutions to meet their needs today and in the future.

Operational Excellence:

We are committed to being best-in-class on cost, quality and time-to-market.

Profitable Growth:

We focus on profitable growth in the interest of our shareholders and employees.

Collaborative Leadership:

We foster a cooperative culture and work as a global team for the success of our customers.

General company information General company information

Market Environment and results of Infineon in Q3 FY 2005

Infineon Infineon

  • Stable revenues in Q3 compared to Q2 Stable revenues in Q3 compared to Q2
  • Significant pricing pressure in memory market Significant pricing pressure in memory market
  • Rapid decline of prices in security and chip card business Rapid decline of prices in security and chip card business
  • EBIT includes charges of Euro 81 million, EBIT includes charges of Euro 81 million,
    • EBIT loss increased to Euro 234 million EBIT loss increased to Euro 234 million
  • Net loss in Q3 at Euro 240 million Net loss in Q3 at Euro 240 million
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Cop
yrig
ht ©
Inf
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n T
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nolo
gies
20
05.
All
righ
rved
ts r
ese

Business highlights Q3 FY 2005 Automotive, Industrial & Multimarket

  • Infineon received the Supplier Award 2004 from Continental for outstanding performance in logistics and quality. In addition, Astec awarded the company its Quality Award for the implementation of Infineon's zero-defect program, which was launched at IBM. Infineon received the Supplier Award 2004 from Continental for outstanding performance in logistics and quality. In addition, Astec awarded the company its Quality Award for the implementation of Infineon's zero-defect program, which was launched at IBM.
  • Infineon will supply the German government with its secure chips for use in next-generation electronic passports, which the German Passport Office intends to begin to issue in November 2005. The company will also supply a special chip package developed for identity cards and passports, as well as the inlay containing the antenna and its connection to the chip. Infineon will supply the German government with its secure chips for use in next-generation electronic passports, which the German Passport Office intends to begin to issue in November 2005. The company will also supply a special chip package developed for identity cards and passports, as well as the inlay containing the antenna and its connection to the chip.
  • In the third quarter, the company signed an agreement with a leading hard-disk-drive manufacturer to develop a product to enter the new and fast-growing market segments of mobile applications. In the third quarter, the company signed an agreement with a leading hard-disk-drive manufacturer to develop a product to enter the new and fast-growing market segments of mobile applications.

Business highlights Q3 FY 2005 Communications

  • We sampled our first UMTS six-band single-chip CMOS RF transceiver, which makes UMTS phones usable worldwide. The new SMARTi 3G has achieved design wins at various customers and is the world's first CMOS RF transceiver specifically developed for UMTS applications. We sampled our first UMTS six-band single-chip CMOS RF transceiver, which makes UMTS phones usable worldwide. The new SMARTi 3G has achieved design wins at various customers and is the world's first CMOS RF transceiver specifically developed for UMTS applications.
  • We launched a new multimedia phone platform offering flexible support to GPRS and EDGE cellular standards. The MP-E platform includes all hardware and software components required for high-performance wireless phones with advanced multimedia functionality such as video streaming, video recording and playback. The true three-chip solution consisting of multi-media baseband, power management unit and CMOS RF transceiver makes possible one of the cellular industry's smallest platforms. We launched a new multimedia phone platform offering flexible support to GPRS and EDGE cellular standards. The MP-E platform includes all hardware and software components required for high-performance wireless phones with advanced multimedia functionality such as video streaming, video recording and playback. The true three-chip solution consisting of multi-media baseband, power management unit and CMOS RF transceiver makes possible one of the cellular industry's smallest platforms.
  • With the first sample of its VINAX chip available, we announced the industry's first fully standard-compliant VDSL2 end-to-end solution. With VINAX, we extend our comprehensive DSL portfolio and established a leading position in VDSL2, which is necessary for Triple Play services such as multi-channel HDTV, on-line / on-demand gaming and video applications, Voice over IP, and high-speed internet access. With the first sample of its VINAX chip available, we announced the industry's first fully standard-compliant VDSL2 end-to-end solution. With VINAX, we extend our comprehensive DSL portfolio and established a leading position in VDSL2, which is necessary for Triple Play services such as multi-channel HDTV, on-line / on-demand gaming and video applications, Voice over IP, and high-speed internet access.

Business highlights Q3 FY 2005 Memory Products

  • Start of commercial production based on 90nm DRAM trench technology. Two products available: 512M DDR and 512M DDR2. Start of commercial production based on 90nm DRAM trench technology. Two products available: 512M DDR and 512M DDR2.
  • Strong bit-growth of about 45% compared to previous quarter. Strong bit-growth of about 45% compared to previous quarter.
  • Increased share of specialty DRAMs (Graphic and Mobile RAM). Increased share of specialty DRAMs (Graphic and Mobile RAM).
  • Sampling started of customized 8GB (Gigabyte) DDR2-400 Tall registered DIMMs based on dual-die technology. Sampling started of customized 8GB (Gigabyte) DDR2-400 Tall registered DIMMs based on dual-die technology.
  • First to provide DDR3 devices with full interface functionality to major PC enabler. First to provide DDR3 devices with full interface functionality to major PC enabler.
  • Only company to offer complete in-house solution for next generation server modules (FB-DIMMs), including DRAM module, AMB-Chip and heat spreader. Only company to offer complete in-house solution for next generation server modules (FB-DIMMs), including DRAM module, AMB-Chip and heat spreader.

Infineon Company Information July 2005 Page 21

Business Development Infineon, Comparison Q2 FY 2005 vs. Q3 FY 2005 and 9 months FY 2004 vs. 9 months 2005

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Infineon Company Information July 2005 Page 23

Prior period segment results are reclassified to be consistent with the current period presentation and organizational structure.

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Infineon Company Information July 2005 Page 24

Prior period segment results are reclassified to be consistent with the current period presentation and organizational structure.

Sales by segments, 2nd quarter FY 2005 and 3rd quarter FY 2005

* Includes Corporate & Reconciliation and Other Operating Segments

Copyright © Infineon Technologies 2005. All rights reserved.

Sales by region, 2nd quarter FY 2005 and 3rd quarter FY 2005

Infineon Company Information July 2005 Page 26

(1) Excluding Germany

Company

Information

July 2005

Page 27

Sales by segments, 9 months FY 2004 and 9 months FY 2005

Sales by region, 9 months FY 2004 and 9 months FY 2005

(1) Excluding Germany

Outlook for Q4 FY 2005

  • Improved Q4 compared to Q3 expected. Improved Q4 compared to Q3 expected.
  • Stable revenues and EBIT for AIM expected, despite ongoing pricing pressure especially at security and chip card ICs. Planned phase-out of production at Munich-Perlach and start-up costs for production site at Kulim will negatively impact EBIT through the end of CY 2006. Stable revenues and EBIT for AIM expected, despite ongoing pricing pressure especially at security and chip card ICs. Planned phase-out of production at Munich-Perlach and start-up costs for production site at Kulim will negatively impact EBIT through the end of CY 2006.
  • For COM, stable or slightly increasing revenues expected compared to Q3. EBIT loss anticipated to remain stable or decrease slightly excluding impairment charges. For COM, stable or slightly increasing revenues expected compared to Q3. EBIT loss anticipated to remain stable or decrease slightly excluding impairment charges.
  • For MP a further increase in memory loads per system, increasing demand and only moderate growth of supply in the industry expected for Q4. A rather balanced supply and demand ratio is anticipated. In addition, we expect to gain further market share with our bit shipments further increasing at a rate above market growth, as a result of constantly increasing capacities at our joint venture and foundry partners and due to the start of ramp-up of the 300mm production facility in Richmond. We will continue to focus on diversification of our memory product portfolio aiming at improving market shares and reducing price volatility. For MP a further increase in memory loads per system, increasing demand and only moderate growth of supply in the industry expected for Q4. A rather balanced supply and demand ratio is anticipated. In addition, we expect to gain further market share with our bit shipments further increasing at a rate above market growth, as a result of constantly increasing capacities at our joint venture and foundry partners and due to the start of ramp-up of the 300mm production facility in Richmond. We will continue to focus on diversification of our memory product portfolio aiming at improving market shares and reducing price volatility.

Company

Information

July 2005

Page 30

Relative performance of IFX stock since the beginning of FY 2003

July 2005

Page 31

Business groups Business groups

General company information General company information

Infineon – Business groups

Automotive, Industrial & Multimarket

Communication

Memory Products

Automotive Semiconductor Solutions Combining sensing, computing and actuating

Copyright © Infineon Technologies 2005. All rights reserved.

solutions, GPS, High Frequency ICs,

Multimedia Cards, Power ICs, Security ICs

CAN/MOST Transceivers, Plastic Optical Fibres,

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Infineon Company Information July 2005 Page 33

-

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  • Multimedia

Car Audio

Dashboard

-

-

-

-

Advanced sensors, controllers and RF ICs for Tire Pressure Monitoring Systems (TPMS)

  • Infineon utilizes its combined wireless and automotive know-how to build a leading position in Tire Pressure Monitoring Systems
  • Key solutions include:
    • Leading edge Pressure, temperature and rotational sensors
    • High-performance microcontrollers
    • Broad range of transmitter, receiver and transceiver ICs
  • Our core competencies in sensors:
      • Advanced signal processing
      • Strong technical support expertise
  • Key sensor trends:
      • Further integration of functionality through advanced signal processing
      • Increased robustness
    • Standardized signal transmission concepts

AIMAIM

Copyright © Infineon Technologies 2005. All rights reserved.

Controlling power with power semiconductors, power modules and microcontrollers

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Infineon Company Information July 2005 Page 35

Industrial drives

Power range from 100 W to 4 MW

  • No. 1 worldwide in standard IGBT modules
  • No. 3 worldwide in semiconductors for drives
  • Product portfolio covers complete application: Power Semiconductors, Rectifiers, IGBT Modules, Controllers, optical POF transceivers
  • Inverter solutions for low, medium and high power drives
  • IGBT / BIP stacks & subassemblies including drivers & control circuit
  • Comprehensive microcontroller portfolio with excellent real time performance and motor control peripherals (PWM, ADC, Timer etc.)
  • 16- & 32-bit microcontrollers with DSP processing performance
  • TriCoreTM based 32-bit micro-controllers and third generation IGBTs allow high performance system solutions for drives

Copyright © Infineon Technologies 2005. All rights reserved.

Chip Card and Security applications Infineon is well-positioned to serve the key growth markets

Infineon Company Information July 2005 Page 37

AIMAIM

Challenges and developments in the banking market Chip Card Security expands the value chain for banks

Demand

for Chip

Minimum requirement of EMV mandate by VISA and MastercardMinimum requirement of EMV mandate by VISA and Mastercard

More Added Value for Banks and Customers More Added Value for Banks and Customers

Security

Contactless interface for comfort / public transportation EMV DDA, loyalty applications, e-purse, etc. Contactless interface for comfort / public transportation EMV DDA, loyalty applications, e-purse, etc.

Banks will be the Trust Centers of Tomorrow Banks will be the Trust Centers of Tomorrow

AIMAIM

Secure Home Banking PKI / digital signature enabled by the Bank (e.g. as Job Card, Health Care Card, Citizen Card, etc.)Secure Home Banking PKI / digital signature enabled by the Bank (e.g. as Job Card, Health Care Card, Citizen Card, etc.)

We drive the convergence of voice, video and data communications

Company Information July 2005 Page 39

Company

Information

July 2005

Page 40

COM business units -

Copyright © Infineon Technologies 2005. All rights reserved.

software

Driving convergence of communication technologies

  • Chipsets for T/E carrier, analog linecards and ISDN
  • Analog and digital terrestrial tuner systems

Broadband access Focus areas

Access Access

  • Leading market position in Standard Telecom infrastructure*: No. 1 in T/E carrier, No. 1 in Analog Linecards Leading market position in Standard Telecom infrastructure*: No. 1 in T/E carrier, No. 1 in Analog Linecards
  • Complete xDSL CO/CPE portfolio: Complete xDSL CO/CPE portfolio:
      • Aggressively gaining market share in ADSL/2/+ - Aggressively gaining market share in ADSL/2/+
      • Industry's first standard compliant VDSL2 ICs -Industry's first standard compliant VDSL2 ICs
      • Leading position in SHDSL and VDSL - Leading position in SHDSL and VDSL
  • First Integrated Voice Data solution, fully integrated splitter and VoIP option First Integrated Voice Data solution, fully integrated splitter and VoIP option
  • Significant deployment of Infineon based ADSL2+ DSLAMs and early availability of an ADSL2+ modem chipset Significant deployment of Infineon based ADSL2+ DSLAMs and early availability of an ADSL2+ modem chipset
  • Highest-quality VoIP and IP telephony solutions Highest-quality VoIP and IP telephony solutions

CPE (Customer Premise Equipment) CPE (Customer Premise Equipment)

  • Entry in the Digital Home market by combining IFX DSL and packetized Voice with ADMtek's strong Home Router and WiFi technology and market positionEntry in the Digital Home market by combining IFX DSL and packetized Voice with ADMtek's strong Home Router and WiFi technology and market position
  • Extensive wired and wireless : Network Processors, NICs, Switches and Router, product portfolioExtensive wired and wireless : Network Processors, NICs, Switches and Router, product portfolio

Data

100

60

20

2

8

Infineon Company Information July 2005 Page 41

Broadband access Product portfolio

Copyright © Infineon Technologies 2005. All rights reserved. Advanced system-on-chips High integration level Multiple interfaces for a wide host of applications Complete system designs Advanced system-on-chips High integration level Multiple interfaces for a wide host of applications Complete system designs Complete IP phone SW/HW package Scalable solutions that fit all country requirements Complete IP phone SW/HW package Scalable solutions that fit all country requirements Ultra low power ADSL2+ Fully standard compliant VDSL2 Ultra low power ADSL2+ Fully standard compliant VDSL2 Applications Applications Product Features Product Features IP Phone DSLAM / DLC IVD line-cards VoIP and POTS line cards Cellular base-stations Video Phone Media Adapter Home Gateway

Broadband access –

End to end broadband access and CPE solutions

Infineon Company Information July 2005 Page 43

Company

Information

July 2005

Page 44

Broadband access - DSL semiconductor market growth is strongly driven by Voice over IP (VoIP) COM COM

Source: COM AC M; S. Lindecke.

Company

Information

July 2005

Page 45

RF connectivity Focus areas

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Company

Information

July 2005

Page 46

RF connectivity Product portfolio

RF connectivity

Infineon Company Information July 2005 Page 47

(All dates refer to first customer samples available) Copyright © Infineon Technologies 2005. All rights reserved.

t

COM COM

CMOS RF enabling the path towards highest integration – Monolithic integration of baseband & CMOS RF transceiver COMCOM

Infineon Company Information July 2005 Page 48

-

  • SRAM

SRAM

Copyright © Infineon Technologies 2005. All rights reserved.

Company

Information

July 2005

Page 49

Mobile phone Product portfolio

Copyright © Infineon Technologies 2005. All rights reserved.

COM COM

Infineon's ULC platforms meets all market requirements

Infineon's contribution:

ULC platform enables mobile phones' BOM for < 20 USD

Component cost

Highest level of integration: single-chip E-GOLDradio

  • Optimization of external components
    • Minimum of memory: only 2 MByte Flash
    • Supports standard Ni-MH AAA-cells
    • Combined headset/charger connector
    • 4-layer PCB
    • Linear Charger

R&D cost

  • Stable and mature E-GOLDradio platform
  • Comprehensive Development & Supporting tools
      • Graphical MMI with small memory footprint
      • Support for unicode, bi-directional based languages and dialects

Manufacturing cost

  • Low component count of less than 100 components on PCB
  • Reduction of manufacturing time: Single-sided mounted PCB
  • Reduction of test time: Calibration time reduced from 60s to 1s
    • Lowest field-return rate

Optimized Total Cost Optimized Total Cost

Portfolio cost

  • Different memory options for
      • Color display support
      • Ring tones, personalization
      • Language packages
  • Migration path to Entry Phone platform BP3 and next generation ULC platforms

Copyright © Infineon Technologies 2005. All rights reserved.

Strong commitments for customers success

Customer Commitment

  • We achieve sustainable success through partnering with our customers
  • Top three position in worldwide markets for voice and data access over copper infrastructure enables customers to expand and succeed in access and broadband CPE
  • Leading positions in wireless (RF + GSM/GPRS baseband)
  • Focused investment in strategic business areas

Product Innovation

We team up with top industry players and organizations to create best-in-class solutions

Innovative, power/cost efficient xDSL, ATM, Ethernet, VoIP, analog voice portfolio

  • Industry-leading RF chips/chipsets, integrated platform solutions (single-chip phones)
  • Worldwide presence of COM design resources

Execution Excellence

We cover the complete semiconductor value chain and guarantee maximum flexibility in development and production

  • Deep understanding / know how related to complexity of data/voice/video over copper wire infrastructure
  • Best in class cost position for RF CMOS
  • Software / hardware integration IP and system knowledge

Worldwide DRAM Revenue Ranking 2004 and 2003

Infineon Company Information July 2005 Page 53

Source: iSuppli, March 2005

Copyright © Infineon Technologies 2005. All rights reserved.

MPMP

The market place – new Memory applications

MP – strengths

Technology leadership

  • Commercial production based on 90nm technology started:
    • 512M DDR and 512M DDR2 products on 90nm available
  • First product prototype on 70nm technology

Manufacturing leadership

  • Most advanced global fab cluster
    • Leader in manufacturing on cost efficient 300mm wafers

Strong technology and manufacturing alliances

  • Joint technology development to improve economies of scale
  • Improve market position with reduced capital requirements
    • Flexible capacity increase through foundries

Expanding product portfolio

  • Expanding module portfolio for mobile PCs and infrastructure
  • Increasing focus on consumer and specialty DRAMs
  • Including expanding portfolio for NAND-compatible Flash

Copyright © Infineon Technologies 2005. All rights reserved.

DRAM technology roadmap

Company

Information

July 2005

Page 57

DRAM fab cluster

MPMP

Leader in 300mm DRAM manufacturing

2004 Annual 12-inch Wafer Production Market Shares

The new organization of Memory Products: Focus on applications and market segments

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Infineon Company Information July 2005 Page 59

Company

Information

July 2005

Page 60

Computing Portfolio

Copyright © Infineon Technologies 2005. All rights reserved.

MPMP

July 2005

Page 61

Graphics portfolio

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Company

Information

July 2005

Page 62

MPMP

Company

Information

July 2005

Page 63

Mobile portfolio

Copyright © Infineon Technologies 2005. All rights reserved.

MPMP

Flash product portfolio

Infineon Company Information July 2005 Page 64

Infineon

Company

Information

July 2005

Page 65

MPMP

Applications & Market Applications & Market

  • Address Whitebox PC market through distribution partners
  • Large share and strong growth potentials of Whitebox market especially in emerging economies such as Eastern Europe, Latin America and South East Asia

Desktop PC - DDR unbuffered DIMMs - DDR2 unbuffered DIMMs Notebook PC - DDR SO-DIMMs - DDR2 SO-DIMMs Product Features Product Features

General company information General company information

Company Information July 2005 Page 66

Infineon organization

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Infineon Company Information July 2005 Page 67

Infineon has 36,151 employees worldwide*

Company Information July 2005 Page 68

Infineon

Continuous investment in R&D

Infineon Company Information July 2005 Page 69

  • About Euro 1.2 billion for R&D expenditure in FY 2004 About Euro 1.2 billion for R&D expenditure in FY 2004
  • More than 35 major R&D locations worldwide More than 35 major R&D locations worldwide
  • 7,300 R&D employees 7,300 R&D employees
  • Currently about 41,000 patents / patent applications Currently about 41,000 patents / patent applications

Infineon – R&D network in Europe

Infineon Company Information July 2005 Page 70

Company

Information

July 2005

Page 71

Infineon – Worldwide R&D network (excluding Europe)

World-class manufacturing sites on 3 continents

Infineon Company Information July 2005 Page 72

Copyright © Infineon Technologies 2005. All rights reserved.

Company

Information

July 2005

Page 73

Infineon production sites

Company

Information

July 2005

Page 74

Infineon sales offices in Europe

Company

Information

July 2005

Page 75

Infineon sales offices worldwide (excluding Europe)

Comprehensive and sustainable environmental, safety and health concept at Infineon

Synergy between ecological responsibility and economic success

EN ISO 14001 multi-site certification

Efficient resources management in terms of optimized consumption, recovery, recycle and re-use

  • Intelligent waste management and emission reduction
    • Voluntary commitment to reduce green-house gas emissions on global scale
      • Environmental commitments covering development and life-cycle considerations
      • Environmental requirements as part of supply chain management
      • High safety and health standards

Infineon Company Information July 2005 Page 76

Source of picture: photocase.de

Green products

  • IFX is running the project "Green Products" since 1998 according to the EU directives.
    • More than 50% of the total volume in pieces is already converted to "Green".
  • The main conversion is in 2004 / 2005.
    • Information about project, technology and conversion roadmaps are available on the homepage: http://www.infineon.com/greenproduct/index.htm

Infineon Company Information July 2005 Page 77

Company

Information

July 2005

Page 78

Integrated business continuity, disaster recovery and security at Infineon

Infineon – partner of the worldwide electronics industry

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Infineon Company Information July 2005 Page 79

Expanding global network: Selected partnerships*

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Infineon Company Information July 2005 Page 80

* some of almost 40 Infineon alliances as per September 2004

Company

Information

July 2005

Page 81

Never stop thinking.

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