Earnings Release • May 3, 2016
Earnings Release
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Investor Relations
This presentation contains forward-looking statements about the business, financial condition and earnings performance of the Infineon Group.
These statements are based on assumptions and projections resting upon currently available information and present estimates. They are subject to a multitude of uncertainties and risks. Actual business development may therefore differ materially from what has been expected.
Beyond disclosure requirements stipulated by law, Infineon does not undertake any obligation to update forward-looking statements.
Leadership in system understanding will foster future growth and profitability
Competitive advantages
Average-cycle financial targets
Investment-to-Sales:
~13%
Solid Investment Grade rating assigned by S&P's in connection with revised capital structure targets
Revised capital structure targets announced by Infineon in February 2016:
a.) Gross Cash b.) Gross Debt
› "€1bn plus 10% to 20% of revenue" › "less than 2.0x EBITDA"
Financial flexibility based on a solid capital structure, adjusted to reflect the current scale of Infineon:
Infineon's revised capital structure targets are reflected in the Corporate Credit Rating of BBB (outlook: "stable") assigned by S&P's in February 2016.
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March 2015: Infineon's first Eurobonds replace €800m bridge financing
April 2016: Infineon's first US-Private Placement replaces \$934m term loan
› Maturity profile significantly improved
› Investor basis broadened
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Automotive semiconductors incl. semiconductor sensors.
Source: Strategy Analytics, April 2016
Discrete power semiconductors and power modules.
Source: IHS Inc., September 2015
Microcontroller-based smart card ICs.
Source: IHS Inc., July 2015
Tight customer relationships are based on system know-how and app understanding
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Infineon benefits from industrial, auto and security, the by far fastest growing segments
CAGR 2015 – 2020 by Semiconductor Industry Segment
Source: IHS Inc., Worldwide Semiconductor Shipment Forecast, April 2016
* In calendar year 2015
** CAGR 2015 – 2019; Source: IHS, "Smart Cards Semiconductors", August 2015
Most balanced portfolio with sensors, microcontrollers and power for system approach
Leader in electric drivetrain and CO2 reduction - making cars clean
Leader in ADAS - making autonomous driving safe and reliable
Leading product portfolio of sensors and security ICs for individual convenience and connectivity - making cars smart
Focus on sustainable high-bill-of-material areas: powertrain, safety/ADAS/autonomous cars, body
* Source: Strategy Analytics, April 2016 ** own estimate.
Infineon is ideally positioned to benefit from megatrends and to gain further market share in Automotive
2015 automotive semiconductor market by product category (\$27.4bn)
Source: Strategy Analytics, April 2016.
Four megatrends are shaping the automotive market, significantly increasing the semi content per vehicle
› Mandated CO2 reductions make electrification of powertrain inevitable
› Advanced connectivity is driven by making the car part of the Internet
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Infineon is the market leader in Radar, > 15 million chips shipped already
* Source: IHS Inc., "Advanced Driver Assistance Applications Sensor Market Database – H2 2015", February 2016
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Average ADAS semiconductor content per level of automation
Source: Infineon estimates
Source: Strategy Analytics, "Automotive Semiconductor Demand Forecast 2013 – 2022", June 2015
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Broadest product and technology portfolio
Addressing broadest range of applications
300mm thin-wafer manufacturing for power semiconductors
System leader with digitalization of the control loop and functional integration
Leader in next-generation power semiconductor materials GaN and SiC
Infineon is ideally positioned to gain further market share and earn superior margins in power semiconductors
* Source: IHS Inc., "Power Semiconductor Discretes & Modules Report – 2015", September 2015
As system leader in power Infineon offers solutions to a wide spectrum of applications
Development on Infineon's market share and relative market share* in the total power semiconductor market
Source: IHS Inc., several reports from 2004 through 2015
* The market for IGBT components (\$4,448m) includes discrete IGBTs (\$947m), Standard IGBT modules (\$1,908m), CIB/PIM (\$333m), and IPMs (\$1,260m).
Source: IHS Inc., "Power Semiconductor Discretes & Modules Report – 2015", September 2015
| [units m] |
2015 | 2020 | CAGR |
|---|---|---|---|
| washing machines |
40 | 84 | 10.6% |
| fridges/freezers | 24 | 62 | 20.9% |
| dish washer |
10 | 23 | 18.1% |
| room air conditioners |
71 | 113 | 9.7% |
Source: IHS Inc., "Major Home Appliance Market Report – 2015", December 2015
PFC = Power Factor Correction PWM = Pulse Width Modulation
total power semiconductor content per charging pile: \$200 .. \$300
* According to the "Electric Vehicle Charging Infrastructure Guidelines", August 2015.
DPM = Digital Power Management
MHA = Major Home Appliances
VSD = Variable Speed Drive
*Source: IHS Inc., July 2015
Infineon is the leader in security solutions for the connected world
Complete portfolio of hardware, software, services and turn-key solutions
Infineon Security Partner Network (ISPN) easy implementation of proven semiconductor-based security for manufacturers of connected devices and systems
Leading in growth segments payment, government ID, connected car, and IoT Infineon is ideally positioned to benefit from the growth trends in the security controller market
Most recent design-wins for OPTIGA™ TPM
› Emergence of multi-application cards
› Rise of smart homes, connected cars, automated industries etc.
› Greater adoption of NFC technologies for mobile payment and other applications
* Including International Rectifier from 13 January 2015.
| Outlook Q3 FY16* (compared to Q2 FY16) |
Outlook FY16* (compared to FY15) |
|||
|---|---|---|---|---|
| Revenue | Increase of 2% +/- 2%-points |
Increase of 12% +/- 2%-points 2%-points**) (prev.: Increase of 13% +/- |
||
| Segment Result Margin |
At the mid-point of the revenue guidance: 16% |
At the mid-point of the revenue guidance: between 15% and 16% (prev.: 16% at the mid-point of the previous revenue guidance**) |
||
| Investments in FY16 |
About €850m |
|||
| D&A in FY16 |
€850m*** About |
|||
| * Based on an assumed average exchange rate of \$1.15 for €1.00. |
Revenue Infineon* [lhs]
Source: Infineon; WSTS (World Semiconductor Trade Statistics), November 2015
SG&A still includes noticeable acquisitionrelated costs that are incrementaly declining
* For definition please see page 43.
* For definition please see page 43.
* For definition please see page 43.
'Purchase of property, plant and equipment'
('Trade payables' / ['Cost of goods sold' + 'Purchase of property, plant and equipment']) * 90
'Total assets'
('Income from continuing operations'
/ Capital Employed
DOI (days of inventory; quarter-to-date) =
('Net Inventories' / 'Cost of goods sold') * 90
DPO (days payables outstanding; quarter-to-date) =
DSO (days sales outstanding; quarter-to-date) = ('Trade receivables' / 'revenue') * 90
All positions in ' ' refer to the respective accounting position and therefore should be applied with the positive or negative sign used in the relevant accounting table.
› Sep 2015: Infineon was listed in the STOXX® Global ESG Leaders Indices, which serves as an indicator of the quality
of Infineon's performance in the governance, social and environmental areas (ESG).
› Dec 2015: In the Carbon Disclosure Project (CDP) climate change report, Infineon achieved a placing among the best companies in the Information Technology sector.
| Date | Location | Event |
|---|---|---|
| 23 – 24 May 2016 |
Boston | JPMorgan Global TMT Conference |
| 25 May 2016 | Tarrytown, NY |
Berenberg European Conference USA |
| 26 May 2016 | Milan | Equita European Conference |
| 30 May 2016 | Copenhagen | Danske Bank German Corporate Day |
| 01 Jun 2016 | Zurich | Berenberg TMT Conference |
| 08 – 09 Jun 2016 |
Berlin | Dt. Bank German, Suisse & Austrian Conference |
| 15 – 16 Jun 2016 |
Paris | Exane European CEO Conference |
| 20 Jun 2016 | London | JPMorgan CEO Conference |
| 02 Aug 2016* | Q3 FY16 Results | |
| 01 Sep 2016 | Frankfurt | Commerzbank Sector Week |
| 21 Sep 2016 | Munich | Baader Investment Conference |
| 16 – 17 Nov 2016 |
Barcelona | Morgan Stanley TMT Conference |
| 23 Nov 2016* | Q4 FY16 and FY 2016 Results | |
| 29 – 30 Nov 2016 |
Scottsdale, AZ |
Credit Suisse TMT Conference |
* preliminary
Corporate Vice President +49 89 234-21626
Investor Relations [email protected]
Senior Director +49 89 234-25649 Investor Relations [email protected]
Manager +49 89 234-22332 Investor Relations [email protected]
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