Earnings Release • Nov 23, 2016
Earnings Release
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2016-11-23 Copyright © Infineon Technologies AG 2016. All rights reserved. 3
Technology leadership and system understanding fosters growth and profitability
Earnings-per-share (EPS) growth
2016-11-23 Copyright © Infineon Technologies AG 2016. All rights reserved. 5
Infineon increased relative market share in power and outperformed chip card market
Source: Strategy Analytics, April 2016
Source: IHS Markit, October 2016 Source: IHS Markit, July 2016
* including SHHIC (in 2015, SHHIC was acquired by CEC Huada.)
Tight customer relationships are based on system know-how and app understanding
Infineon benefits from industrial, auto and security, the by far fastest growing segments
Source: IHS Markit, "Worldwide Semiconductor Shipment Forecast", October 2016
* In calendar year 2015
** Source: ABI Research, "Secure Smart Card & Embedded Security IC Technologies", September 2016; microcontroller ICs
Most balanced portfolio with sensors, microcontrollers and power for system approach
Leader in electric drivetrain and CO2 reduction - making cars clean
Leader in ADAS - making autonomous driving safe and reliable
Leading product portfolio of sensors and security ICs for individual convenience and connectivity - making cars smart
Focus on sustainable high-bill-of-material areas: powertrain, safety/ADAS/autonomous cars, body
* See glossary; ** Source: Strategy Analytics, April 2016; *** own estimate.
Infineon is ideally positioned to benefit from ADAS*/AD*, xEV, connected cars and to gain further market share in Automotive
For full automotive story please refer to
Source: Strategy Analytics, "Automotive Semiconductor Vendor Market Shares", April 2016
* fully equipped Model X 90D
* See glossary
Broadest product and technology portfolio
Addressing broadest range of applications
300 mm thin-wafer manufacturing for power semiconductors
System leader with digitalization of the control loop and functional integration
Leader in next-generation power semiconductor materials GaN and SiC
Infineon is ideally positioned to gain further market share and earn superior margins in power semiconductors
* Source: IHS Markit, "Power Semiconductor Discretes & Modules Report – 2016", October 2016
As system leader in power, Infineon has broadest application and technology reach
2016-11-23 Copyright © Infineon Technologies AG 2016. All rights reserved. 18
* The relative market share is defined as the proportion of the market share held by the market leader (in all years presented for Infineon) compared to the market share of the second largest competitor in the relevant year.
Source: IHS Markit, several reports from 2004 through 2016
Strong #1 position in power allows driving of key areas of differentiation and innovation
Unique 300 mm thin wafer power semiconductor manufacturing
Compound semiconductors SiC and GaN
Digitalization of the power control loop
Functional integration of IGBT modules
DPM = Digital Power Management
MHA = Major Home Appliances
VSD = Variable Speed Drive
Complete portfolio of hardware, software, services and turn-key solutions
Leading in growth segments payment, government ID, connected car security, IoT, and Information and Communications Technology security
Infineon is ideally positioned to benefit from the growth trends in the security controller market
** Source: IHS Markit, December 2015
Source: IHS Markit, Dec 2015, July 2016; * based on units; USD-ranking not provided
* The business with XMC industrial microcontrollers developed by ATV and CCS was transferred to PMM and IPC with effect from 1 October 2015. The previous year's figures have been adjusted accordingly.
| Outlook Q1 FY17* (compared to Q4 FY16) |
Outlook FY17* (compared to FY16) |
|
|---|---|---|
| Revenue | Decrease of 4% +/- 2%-points |
Increase of 6% +/- 2%-points |
| Segment Result Margin |
At the mid-point of the revenue guidance: 14% |
At the mid-point of the revenue guidance: 16% |
| Investments in FY17 |
€950m** About |
|
| D&A in FY17 |
€830m*** About |
Solid Investment Grade rating assigned by S&P in connection with revised capital structure targets
| Revised capital structure targets announced by Infineon in February 2016: |
||
|---|---|---|
| a.) Gross Cash | b.) Gross Debt | |
| › "€1bn plus 10% to 20% of revenue" |
› "less than 2.0x EBITDA" |
|
| Infineon's revised capital structure targets are reflected in the Corporate Credit Rating of BBB (outlook: "stable") assigned by S&P in February 2016. |
Note: Other debt with maturities between 2017 and 2023 totaling €145m.
SG&A still includes noticeable acquisitionrelated costs that are incrementaly declining
[days]
* For definition please see page 36.
'Purchase of property, plant and equipment'
'Total assets'
('Income from continuing operations'
DOI (days of inventory; quarter-to-date) =
('Net Inventories' / 'Cost of goods sold') * 90
DSO (days sales outstanding; quarter-to-date) = ('Trade receivables' / 'revenue') * 90
All positions in ' ' refer to the respective accounting position and therefore should be applied with the positive or negative sign used in the relevant accounting table.
DPO (days payables outstanding; quarter-to-date) =
('Trade payables' / ['Cost of goods sold' + 'Purchase of property, plant and equipment']) * 90
› Sep 2016: Infineon is listed in the STOXX® Global ESG Leaders Indices, which serves as an indicator of the quality of Infineon's performance in the governance, social and environmental areas (ESG).
› Infineon was added to the FTSE4Good Index Series in 2001 and has been confirmed as a member since then.
› Jul 2016: Most recent review.
› Dec 2015: In the Carbon Disclosure Project (CDP) climate change report, Infineon achieved a placing among the best companies in the Information Technology sector.
› Oct 2016: Infineon has been selected as a constituent of the Ethibel Sustainability Index (ESI) Excellence Europe.
| Date | Location | Event |
|---|---|---|
| 29 – 30 Nov 2016 |
Scottsdale, AZ |
Credit Suisse TMT Conference |
| 08 Dec 2016 | Pennyhill Park (Surrey, London) |
Berenberg European Conference |
| 02 Feb 2017* | Q1 FY17 Results | |
| 16 Feb 2017 | Munich | Annual General Meeting |
| 27 Feb – 02 Mar 2017 |
Barcelona | Mobile World Congress |
| 04 May 2017* | Q2 FY17 Results | |
| 30 May 2017 | Copenhagen | German Corporate Day by Danske Bank Markets |
| 31 May – 01 Jun |
New York | Bernstein Strategic Decision Conference |
| 21 – 22 Jun 2017 |
Berlin | Dt. Bank German, Swiss & Austrian Conference |
| 01 Aug 2017* | Q3 FY17 Results | |
| 19 Sep 2017 | Munich | Berenberg Bank and Goldman Sachs German Corporate Conference |
| 20 Sep 2017 | Munich | Baader Investment Conference |
| 14 Nov 2017* | Q4 FY17 and FY 2017 Results | |
| 15 – 16 Nov 2017 |
Barcelona | Morgan Stanley TMT Conference |
* preliminary
| ACC | adaptive cruise control |
|---|---|
| AD | automated driving |
| ADAS | advanced driver assistance system |
| AEB | automatic emergency braking |
| BoM | bill of material |
| EPS | electric power steering |
| EV | electric vehicle |
| FCW | forward collision waring |
| HEV | mild and full hybrid electric vehicle |
| ICE | internal combustion engine |
| micro-hybrid | vehicles using start-stop systems and limited recuperation |
| mild-hybrid | vehicles using start-stop systems, recuperation, DC-DC conversion, e-motor |
| PHEV | plug-in hybrid electric vehicle |
| SiC | silicon carbide |
| SiGe | silicon germanium |
| V2X | vehicle-to-everything communication |
| xEV | all degrees of vehicle electrification (EV, HEV, PHEV) |
Corporate Vice President +49 89 234-21626
Investor Relations [email protected]
Senior Director +49 89 234-25649 Investor Relations [email protected]
Manager +49 89 234-22332 Investor Relations [email protected]
Manager +49 89 234-83346 Investor Relations [email protected]
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