Hubei Dinglong CO.,Ltd. - Capital/Financing Update 2017

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二
、项目名		项	：°(万元)拟用募集资金投入金额	备注
,Ï 付本次交易的现金对价2集成电路(ic ) 芯片及制程工艺材料研发中心顶Ħ上电路芯片(ic ) 抛光工艺材料的产业化二期项目园■牌营销网络及技术支持中" 。。园降打······用耗材研发中" 。。.. . . . . 金(尚需ł门除中介机构费用)合计	1		，，，C园ı。6729020 0D0 D011 562I區画画画国ı' 000 。园习ı。772 92ļ103 047 8299

项目名称		自筹资金预先投入金额(万元)	拟以募集资金置换前期预先投入自筹资金(万元)
支付本次交易的现金对价園■ı	Ĺ	6 000 00 6 000 001	6000006 00000

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