C SUN — Investor Presentation 2018

Oct 30, 2018

Morrison Liang, Chairman Place: Taiwan Stock Exchange Corporation October 30[th] , 2018

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免責聲明
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This presentation contains some forward-looking statements that are subject to substantial risks and uncertainties. Typically, these statements contain words such as “anticipate” , “believe”, “could”, “estimate”, “expect”, “intend”, “plan” , “forecast” ,”project”, “predict”, “potential”, “continue”, “may” , “should” , “will”, and “would” or similar words. You should consider these forward-looking statements carefully because such statements are only our expectations or projections about future events, and actual results may differ materially from those expressed or implied by such statements. The forward-looking statements in this presentation include, but are not limited to, growth rates for various markets estimated by third party sources, future products and technology development, widespread market acceptance of the hosted delivery model, future revenue growth and profitability. You should be cautioned that the forward-looking statements are no guarantee of our future performance. The forward-looking statements contained in this presentation are made only as of the date of this presentation and we undertake no obligation to update the forward-looking statements to reflect subsequent events or circumstances, except as required by law.

This presentation and the information contained herein are the property of CSUN MFG. Ltd. Neither this presentation nor any of its contents may be reproduced to a third party without the prior written consent of CSUN MFG Ltd.

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核心技術
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議程
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 2018Q3 營運成果

• 市場機會與產品發展

-Flat Panel Display (FPD) -Advanced Packaging(SEMI) -Printed Circuit Board(PCB) -子公司創峰  Q&A

2018 Q3 營運成果

	2018Q3 營運成果 2018Q3 2017Q3 Amount % Amount %*	2018Q3 營運成果 2018Q3 2017Q3 Amount % Amount %*	2018Q3 營運成果 2018Q3 2017Q3 Amount % Amount %*
		2018Q3*	2017Q3	2017	2016	2015
		Amount %	Amount %	Amount %	Amount %
	Revenue-Consolidated
	COGS
	Gross Margin
	Operating Expense
	Operating Income
	Net Non-Op. Profit
	Net Income before tax
	Net Income after tax
	Attribute to stockholder's of the parent ROE
	EPS (NT$/after tax)
	Debt Ratio

Note : * unaudited

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2017

2018/1~9

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SEMI &
SEMI &
P&C
P&C
12.7%
14.5%
DISPLAY DISPLAY
PCB
PCB
45.9% 37.2%
48.3%
41.4%
PCB-TCF
(18.2%) PCB-TCF
(25.5%)
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市場機會與產品發展

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真空/自動化
OVEN(SEMI)
UV2 for TFT
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FPD BU

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 G8.6/G11設備擴產多，現有客戶與未來擴廠

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FPD BU

• 車載顯示面板，網印後自動化乾燥 生產線，開發完成導入量產線。

13 FPD BU

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 3D玻璃機殼防破碎製程已導入志聖生產設備

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FPD BU

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• 先進封裝製程發展快速( Fan-Out) ，封裝載具變化(WLP、PLP)。

• 熱技術應用與現況:

• 先進封裝Molding段:與外商合作切入Molding 固化製程。

• 與客戶合作開發切入PLP RDL 全自動烘烤設備，製程驗證中  傳統Oven結合自動化技術，導入客戶端

• 中國開始發展先進封裝製程，設備需求啟動

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FPD BU

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半導體設備發展規劃
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Wafer form
Panel form
Mounter
WVL-A16D(WVL二代機)
CBVO(第三代)
De bonder
WVL-A12D
CSL-A12W
Panel bonder
CSL-A25V+VL-A24 MP-A25 For FOPLP laminator
CSL-A25U
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~2010 2011 2012 2013 2014 2015 2016 2017 2018

PCB BU

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 高階AI先進封裝製程  消費性晶片先進封裝製程

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PCB BU

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應用於：PCB 、半導體、太陽能

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PCB BU

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曝光技術沿革與展望
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PCB/太陽能/陶瓷基板
PCB
UVE-A265
LDI-H9300D
太陽能 (Agent) UVE-R960M
設備智能光源LED化
UVE-A9XX
UVLED IL Exp.
UVE-A260/A250
UVE-M565
UVE-A230/A282
UVE-A220/A280
UVE-M765/M865
UVLED FPC ; Ceramic
Substrate S/M Exp.
UVLED OL Exp.
UVE-M525/M535
UVE-M500 UVE-M765L/M865L UVLED S/M Exp.
~2000 2005 2010 2010 2013 2015 2016 2017 2018
PCB BU
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PCB/太陽能/陶瓷基板
PCB
太陽能
設備智能 跨產業應用
CSL-A25V+VL-A24
MP-A25
RC-A24 PL-A24
CSL-A25UⅡ
CSL-A25PHⅡ
CSL-A25
CSL-A32
RTR-500PH
~1996 2000 2004 2009 2010 2014 2016 2017 2018
PCB BU
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智能化服務應用情境說明
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現在(As-Is) 未來(To-Be)
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設備這麼多，人力永遠不夠 智能化預測維護與監控
實時監測馬達負載，即將
透過定期檢點管理表定期
發生異常，即時通知工務
檢驗，零件異常而停機
趁待料時檢修，僅停機4小
時，進行替換零件。
時且不影響產能。
機台狀態數值異常，不知 區域B感測器3號
道哪個元件出錯。 Cable發生斷線，
請確認連接器配
線。
通訊
智慧型自動偵測光
曝光源光源均勻度量
有時候操作員為了 源功能，一鍵執
測：
提高產能擅自修改 行，數據自動上
1天3班，每個班都要量1 料號重要參數統一
機台設定值，又產 傳，確保製程穩
次30分鐘，好浪費時 由上位系統下達，
生好多報廢。 定，也不用在人工
間，有時數據隨便寫， 有效避免報廢。
抄寫數據。
反正主管也不知道。
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子公司-創峰

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2018營收成長動能

• Desmear PTH取代既有龍門線設備

• 耗能、耗水、耗藥水

• 汰舊換”節能、環保”設備

• 沿海環保議題往內陸擴張

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Thank You