C SUN — Investor Presentation 2017

Oct 31, 2017

Investor Conference

Morrison Liang, Chairman

Dr. Toshio Huang, Executive Vice President of FPD Business Unit Steven Lai, Executive Vice President of PCB Business Unit Place: Sheraton Grand Taipei Hotel October 31[th ] , 2017

This presentation contains some forward-looking statements that are subject to substantial risks and uncertainties. Typically, these statements contain words such as “ anticipate ” , “ believe ” , “ could ” , “ estimate ” , “ expect ” , “ intend ” , “ plan ” , “ forecast ” , ” project ” , “ predict ” , “ potential ” , “ continue ” , “ may ” , “ should ” , “ will ” , and “ would ” or similar words. You should consider these forward-looking statements carefully because such statements are only our expectations or projections about future events, and actual results may differ materially from those expressed or implied by such statements. The forward-looking statements in this presentation include, but are not limited to, growth rates for various markets estimated by third party sources, future products and technology development, widespread market acceptance of the hosted delivery model, future revenue growth and profitability. You should be cautioned that the forward-looking statements are no guarantee of our future performance. The forward-looking statements contained in this presentation are made only as of the date of this presentation and we undertake no obligation to update the forward-looking statements to reflect subsequent events or circumstances, except as required by law.

This presentation and the information contained herein are the property of CSUN MFG. Ltd. Neither this presentation nor any of its contents may be reproduced to a third party without the prior written consent of CSUN MFG Ltd.

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• 2017Q3 營運成果

• 成長機會

• -Flat Panel Display (FPD) -Printed Circuit Board(PCB)

• -子公司 創峰(PCB)

• Q&A

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2017 Q3 營運成果

in TWD millions

	2017Q3*	**2016Q3 **	2016	2015	2014
	Amount %	Amount %	Amount %	Amount %
Revenue-Consolidated
COGS
Gross Margin
Operating Expense
Operating Income
Net Non-Op. Profit
Net Income before tax
Net Income after tax
Net Income after tax attributed to stockholders of the parent
Employees ROE
EPS (NT$/after tax)*
Note : unaudited Debt Ratio

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2016

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P&C
8%
SEMI
9%
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PCB-TCF (13.4%)

2017/1~9

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7%
SEMI
5%
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PCB-TCF (18.5%)

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Revenue Booking Backlog B/B Ratio 1.80
2,200
1.60
2,000 1.67
1,800 1.40
1.21
1,600
1.20
1.31
1,400 1.28
1.19
1.11
1.00
1,200 1.10 1.08
1.03
0.95
1,000 0.93 0.80
800
0.71 0.60
600
0.40
400
0.20
200
0 0.00
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成長機會

真空/自動化 UV2 for TFT OVEN(SEMI)

熱板 for TFT

熱風 for TFT

FPD BU

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IGZO
LTPS
熱風技術
去氫/活化爐/PI
軟顯爐
100 ℃ TFT CF G10.5熱風
TFT
ARRAY
600℃
450 ℃
350 ℃
250 ℃
200 ℃
G10.5熱板
TFT PA
&G8.6 熱板爐 Oxide TFT
TFT PIPB
熱板技術
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2010 2012 2013 2014 2015 2016 2017 2018

FPD BU

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自動化真空oven
壓力烤箱
真空烤箱
真空迴焊爐
無塵烤箱
2019
2017
2016
2015
~2013
WLP Auto Oven PLP PI oven
半自動化 Oven
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2012 2013 2014 2015 2016 2017 2018 2019 2020

FPD BU

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G8.6 UV2
UV技術 G10.5 UV2
DUV
可調光
TFT
G6/G7.5 UV2
2019
TFT
CF UV 2017
2016
2015
PRSM-RIE
2014 In Line Descum
PRSS
LIR
Plasma技術
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2013 2014 2015 2016 2017 2018 2019 2020

FPD BU

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• G8.6/G10.5建廠方興未艾

• 技術:TFT設備超大型化與溫度控制技術提升。

• 客戶群:BOE/CSOT/CHOT/HKC/INX…

• G8.6烘烤設備全球市佔第一。

• 首套G10.5烘烤設備裝機中

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製程 製程溫度 志聖設備
ANOV
Array 230~250℃
(退火爐)
Post-bake
CF 230~240℃
(光阻固烤爐)
SEPB
CELL 120~160℃
(框膠固烤爐)
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FPD BU
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AMOLED
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• 產業趨勢:

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OLED蒸鍍/封裝 LTPS OLED蒸鍍/封裝 Oxide TFT

主流 持續發展中

• 背板技術:LTPS/Oxide TFT退火、去氫、活化製程。

• OLED封裝段:蒸鍍前Curing/蒸鍍後Aging。

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• 客戶群:AUO/BOE/CSOT/INX/TIANMA…

• 已切入LTPS ITO/Metal、 IGZO Oven 製程退火設備

• OLED蒸鍍前Curing/蒸鍍後Aging

• 志聖正發展LTPS 背板製程關鍵技術:去氫、活化爐

FPD BU

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• 新開發Pre Bake/Post Bake設備導入玻璃機殼製程。

• • 設備已量產玻璃機殼中

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FPD BU
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• 先進封裝製程發展快速( Fan-Out) ，封裝載具變化(WLP、PLP)。

• 傳統封裝廠朝向自動化整合發展，提高良率降低成本

• 熱技術應用與現況:

• 先進封裝Molding段:與外商合作切入Molding 固化製程。

• 與客戶合作開發切入PLP RDL 全自動烘烤設備，製程驗證中

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• 傳統Oven結合自動化技術，導入客戶端

• 客戶群:tsmc、ASE、SPIL、PTI……..。

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FPD BU

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2017現況 A H重慶 C B H 后科 H華中 華北 B9華中 南科 AUO L6K昆山 2017 2017 2017 2017 2017 AUO L7B中科 AUO L8A中科 BOE B10福建 B社惠州 CEC 南京 CSOT t2深圳 CSOT t3武漢 HSD南科 HKC 重慶 IVO 昆山 L社長沙 TIANMA武漢 TIANMA廈門

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FPD BU
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2018展望 C t 2 華南 C t 4 華中 C t6 華南 I Fab1南科 I T2竹南 I Fab5南科 K 華東 L 華南 B* B11 華中

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PCB BU
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PCB
太陽能
UVE-A265
設備智能 光源LED化
UVE-R960M
UVE-A9XX
UVLED IL Exp.
UVE-A260/A250
UVE-M565
UVE-A230/A282
UVE-A220/A280
UVE-M765/M865
UVE-M525/M535 UVLED S/M Exp.
UVE-M500 UVE-M765L/M865L UVLED OL Exp.
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2000 2001 2004 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018
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PCB BU

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PCB
太陽能
設備智能 跨產業應用
CSL-A25V+VL-A24
MP-A25
RC-A24 PL-A24
CSL-A25UⅡ
CSL-A25PHⅡ
CSL-A25
CSL-A32
RTR-500PH
1996 2000 2001 2004 2009 2010 2011 2014 2016 2017 2018
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PCB BU
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Wafer form
Panel form
CSL-A12W
WVL-A16D(WVL二代機)
CBVO(第三代)
WVL-A12D
Panel bonder/de-warpage
CSL-A25V+VL-A24 CSL-A25U MP-A25
MP-A25R
CSL-A25R
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~2010 2011 2012 2013 2014 2015 2016 2017 2018

PCB BU

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CSUN 智動曝光機 雲端管理平台 設備資訊監控 設備異常通知 設備訊息通知 定期保養功能 耗材更換通知 帳號權限管理 郵件發送功能 數據分析 遠端參數設定 多國語言(繁簡英)

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PCB BU

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未來技術發展狀況－High-Resolution UV LED exposure system

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PCB BU

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• 高階AI先進封裝製程

• 消費性晶片先進封裝製程

PCB BU

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子公司-創峰

2017營收成長動能

• Desmear PTH取代既有龍門線設備

• 耗能、耗水、耗藥水

• 汰舊換”節能、環保”設備

• 沿海環保議題  往內陸擴張

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