Share Issue/Capital Change • Nov 24, 2025
Share Issue/Capital Change
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THIS NOTICE IS IMPORTANT AND REQUIRES THE IMMEDIATE ATTENTION OF BONDHOLDERS. IF BONDHOLDERS ARE IN ANY DOUBT AS TO THE ACTION THEY SHOULD TAKE, THEY SHOULD SEEK THEIR OWN FINANCIAL AND LEGAL ADVICE IMMEDIATELY FROM THEIR STOCKBROKER, SOLICITOR, ACCOUNTANT OR OTHER INDEPENDENT FINANCIAL OR LEGAL ADVISER. NOT FOR DISTRIBUTION IN OR INTO THE UNITED STATES OR IN OR INTO AUSTRALIA, CANADA, JAPAN, SOUTH AFRICA OR ANY OTHER JURISDICTION IN WHICH SUCH DISTRIBUTION OR RELEASE WOULD BE PROHIBITED BY APPLICABLE LAW.
BE Semiconductor Industries N.V. Announces Early Redemption of Remaining Outstanding € 150 Million Senior Unsecured Convertible Bonds due 2027
Duiven, the Netherlands, 21 November 2025 – BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC: BESIY) announces today the exercise of its early redemption option with respect to its outstanding € 150 million 0.75% Senior Unsecured Convertible bonds due 2027 (ISIN: XS2211511949) (the "2027 Bonds") in accordance with Condition 4.1 of the terms and conditions (the "Conditions") of the 2027 Bonds.
Currently, € 21.2 million aggregate principal amount of the 2027 Bonds remains outstanding which represents approximately 14% of the aggregate principal amount of the 2027 Bonds originally issued. The remainder of the 2027 Bonds will be redeemed on 23 December 2025 (the "Redemption Date") at 100% of their principal amount (equal to € 100,000 per 2027 Bond). The Company will also pay accrued but unpaid interest on the 2027 Bonds up to but excluding the redemption thereof. The holders of the 2027 Bonds may exercise their conversion rights no later than 12 December 2025. The conversion price of the 2027 Bonds is currently € 48.2828 per Besi ordinary share versus the closing price of the Company's ordinary shares of € 130.05 on Euronext Amsterdam at the end of yesterday's trading session.
Besi is a leading manufacturer of assembly equipment supplying a broad portfolio of advanced packaging solutions to the semiconductor and electronics industries. We offer customers high levels of accuracy, reliability and throughput at a lower cost of ownership with a principal focus on wafer level and substrate assembly solutions. Customers are primarily leading semiconductor manufacturers, foundries, assembly subcontractors and electronics and industrial companies. Besi's ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY) and its headquarters are located in Duiven, the Netherlands. For more information, please visit our website at www.besi.com.
This press release relates to the disclosure of information that qualified, or may have qualified, as inside information within the meaning of Article 7(1) of Regulation (EU) No 596/2014 of the European Parliament and of the Council of 16 April 2014, as amended (the EU Market Abuse Regulation).

Richard W. Blickman, President & CEO Andrea Kopp-Battaglia, Senior Vice President Finance Claudia Vissers, Executive Secretary/IR coordinator Edmond Franco, VP Corporate Development/US IR coordinator Tel. (31) 26 319 4500 [email protected]
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