Report Publication Announcement • Feb 19, 2010
Report Publication Announcement
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FOR : BE SEMICONDUCTOR INDUSTRIES N.V. Ratio 6 6921 RW Duiven The Netherlands
Duiven, the Netherlands, February 18, 2010, BE Semiconductor Industries N.V. ("Besi") (Euronext: BESI), a leading manufacturer of assembly equipment for the semiconductor industry, will release results for the fourth quarter and year ended December 31, 2009, on Thursday, February 25, 2010 at 8.00 a.m. Continental European Time (2.00 a.m. New York time).
Besi will host a conference call and audio webcast (log on via www.besi.com) to discuss its results for the fourth quarter and year ended December 31, 2009, on Thursday, February 25, 2010 at 4.00 p.m. CET (10.00 a.m. New York time). The teleconference dial-in number is (31) 10 29 44 228. The audio webcast will remain available on www.besi.com.
BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, wire bonding, packaging and plating equipment for the semiconductor industry's assembly operations. Its customers consist primarily of leading U.S., European, Asian, Korean and Japanese semiconductor manufacturers and subcontractors which utilize its products for both array connect and conventional leadframe manufacturing processes.
Richard W. Blickman Jan Willem Ruinemans President & CEO Chief Financial Officer Tel. (31) 26 319 4500 Tel. (31) 26 319 4500
[email protected] [email protected]
IR Contact Europe: Uneke Dekkers/Frank Jansen Citigate First Financial Tel. (31) 20 575 4021/24
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