Investor Presentation • Nov 18, 2025
Investor Presentation
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This presentation contains forward-looking statements concerning Atomera Incorporated (""Atomera," the "Company," "we," "us," and "our"). The words "believe," "may," "will," "potentially," "estimate," "continue," "anticipate," "intend," "could," "would," "project," "plan," "expect" and similar expressions that convey uncertainty of future events or outcomes are intended to identify forwardlooking statements. These forward-looking statements are subject to a number of risks, uncertainties and assumptions, including those disclosed in the section "Risk Factors" included in our Annual Report on Form 10-K filed with the SEC on March 4, 2025 (the "Annual Report"). In light of these risks, uncertainties and assumptions, the forward-looking events and circumstances discussed in this presentation may not occur and actual results could differ materially and adversely from those anticipated or implied in our forward-looking statements. You should not rely upon forward-looking statements as predictions of future events. Although we believe that the expectations reflected in our forward-looking statements are reasonable, we cannot guarantee that the future results, levels of activity, performance or events and circumstances described in the forward-looking statements will be achieved or occur.
This presentation contains only basic information concerning Atomera. The Company's filings with the Securities Exchange Commission, including the Annual Report, include more information about factors that could affect the Company's operating and financial results. We assume no obligation to update information contained in this presentation. Although this presentation may remain available on the Company's website or elsewhere, its continued availability does not indicate that we are reaffirming or confirming any of the information contained herein.
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Quantum Engineered Materials

Transistor enhancement High Leverage IP technology for the Licensing Business \$600B semiconductor Model market Top Tier Strong, Growing and Management Team Defensible
Patent Portfolio
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► Same benefits as a node shrink
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Core MST Method and Device MST Enabled Devices/Architecture Next-Gen Architectures using MST
These distinctive layers are visible on products using MST

Extensive know-how Extends life and value of patents
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| v | Customer Wafer Manufacturing | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Atomera MST® Customer MST® Deposition Deposition |
|||||||||||
| Phase | 1. Planning | 2. Setup | 3. Integration | 4. Installation | 5. Qualification | 6. Production |

• At least 10 of the top 20 semiconductor sales leaders with fabs (IC Insights, McClean Report 2023)
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License Fees
Joint Development Agreements
Royalties
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MST starting wafers Easier integration, faster time to revenue
• RFSOI, GaN, Next Gen DRAM, etc

High volume potential products
Longer integration, higher revenue potential
• GAA Logic, DRAM, Power, Flash memory, etc.

Breakthrough, enabling materials
New disruptive technologies
• Si28 for Quantum, Piezo, HBM Memory, etc.
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These Benefits are ADDITIVE & COMPLEMENTARY to other enhancement technologies
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MST-SP, SPX for BCD
MST for RF-SOI
MST for Advanced Nodes
MST for DRAM


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Atomera 13
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► Enables solutions that are more validated so faster to production
► Leverages partner's sales and marketing resources

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► MST provides benefits in multiple areas for Gate-All-Around transistors

Source: IMEC
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▪ Area of highest customer interest

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Atomera 18
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X-ray confirms crystal quality improvement with MST
Collaboration with Sandia's CINT to validate benefits

In plot, each bar represents the average of FWHM values measured at positions 15mm and 30mm from the center of a 100mm wafer
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Atomera 21
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| Example 1 Worldwide Average Fab | ||||
|---|---|---|---|---|
| Monthly Fab Capacity1 (wafers/month) |
46,240 | |||
| Industry average wafer ASP - 2018 |
\$1,365 | |||
| Annual Revenue Potential2 | \$15.1M | |||
| Annual Revenue at 50% of ramp2 | \$7.6M |
| Example 2 Leading Foundry, 28nm Fab | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Monthly Fab Capacity (wafers/month) |
80,000 | |||||||||
| Industry average 28nm wafer ASP | \$3,300 | |||||||||
| Annual Revenue Potential2 | \$63M | |||||||||
| Annual Revenue at 50% of ramp2 | \$31.7M |
1. Represents wafers starts per month (200mm equiv) – 227.5M starts in 410 fabs
Source: IC Insights Global Wafer Capacity 2021-2025 report, McClean Report 2021, 2022
2. Assumes 2% royalty rate
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| Wafer | GM\$ | MST | Wafer | |||
|---|---|---|---|---|---|---|
| Price Increase GM% 3,300 45% \$ - |
Royalty | Cost | ||||
| 28nm HP wafer | \$ | \$ - |
\$ 1,815 | |||
| 28nm HP+ wafer | \$ 3,450 |
45% | \$ 68 |
\$ - |
5% higher price for +15% performance boost | |
| 28nm HP wafer with MST | \$ 3,600 |
47.0% | \$ 208 |
\$ 72 |
\$ 1,907 30% performance boost=10% higher price (+ \$20 MST cost) | |
| 28nm HP wafer with MST | \$ 3,713 |
48.6% | \$ 318 |
\$ 74 |
\$ 1,909 | 25% die shrink=12.5% price increase (+ \$20 MST cost) |
| Chip sales/ wafer |
GM% | GM\$ Increase |
Product ASP |
Die/wafer | ||
|---|---|---|---|---|---|---|
| 28nm HP wafer | \$ 9,233 |
50% | \$ - |
\$ 4.86 |
2,235 | Baseline business for 30mm2 chip |
| 28nm HP wafer with MST | \$ 12,398 | 59% | \$ 3,165 | \$ 4.86 |
3,001 | Improved financials with 25% size reduction |
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| Income Statement | Three | e Months Ended | ||||||
|---|---|---|---|---|---|---|---|---|
| (\$ in thousands, except per-share data) | Septen | nber 30, 2025 | Jı | une 30, 2025 | September 30, 2024 | |||
| REVENUE | \$ | 11 | \$ | - | \$ | 22 | ||
| Gross Profit | (117) | (62) | 19 | |||||
| OPERATING EXPENSES | ||||||||
| Research & Development | 3,304 | 3,004 | 2,759 | |||||
| General and Administration | 2,165 | 2,048 | 1,812 | |||||
| Selling and Marketing | 207 | 141 | 248 | |||||
| TOTAL OPERATING EXPENSES | 5,676 | 5,193 | 4,819 | |||||
| OPERATING LOSS | (5,793) | (5,255) | (4,800) | |||||
| Other Income (Expense) | 220 | 288 | 205 | |||||
| NET LOSS | \$ | (5,573) | \$ | (4,967) | \$ | (4,595) | ||
| Net Loss Per Share | \$ | (0.19) | \$ | (0.17) | \$ | (0.17) | ||
| Weighted average shares outstanding | 31,128 | 30,397 | 27,406 | |||||
| ADJUSTED EBITDA (NON-GAAP) | \$ | (4,440) | \$ | (3,965) | \$ | (3,881) | ||
| ADJUSTED EBITDA PER SHARE | \$ | (0.14) | \$ | (0.13) | \$ | (0.14) | ||
| Balance Sheet Information | ||||||||
| Cash, equivalents & ST investments | \$ | 20,322 | \$ | 22,026 | \$ | 17,342 | ||
| Debt | - | - | - |
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| 2018-2025F IC Market Forecast by Device Type (Analog) | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Product Category | 18 | 19 | 19/18 % Chng |
20 | 20/19 % Chng |
21F | 21/20 % Chng |
22F | 22/21 % Chng |
23F | 23/22 % Chng |
24F | 24/23 % Chng |
25F | 25/24 % Chng |
20-2 CAG |
| Power Management (\$M) Units (M) ASP (\$) |
14,529 69,243 \$0.21 |
14,050 67,227 \$0.21 |
-3% -3% 0% |
14,640 68,409 \$0.21 |
4% 2% 2% |
18,153 80,788 \$0.22 |
24% 18% 5% |
20,332 91,396 \$0.22 |
12% 13% -1% |
22,568 102,475 \$0.22 |
11% 12% -1% |
23,019 105,580 \$0.22 |
2% 3% -1% |
24,861 115,178 \$0.22 |
8% 9% -1% |
11' 11' 09 |
Source: IC Insight's McClean Report, June 2021
"A typical 5G smartphone can hold as many as eight powermanagement chips, compared with two to three in a 4G phone, according to Hui He, an analyst at research firm Omdia."
WSJ "Why the Chip Shortage is So Hard to Overcome" 4/20/2021
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$L_{DEVICE} = 1.84um$
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13 of 25 IC's in Apple iPhone13 Pro use 5V transistors

▪ iPhone 13 Pro teardown by Tech Insigths
▪ 5V transistor assessment by Atomera
Reference https://www.techinsights.com/blog/teardown/apple-iphone-13-pro-teardown?utm_source=Prospect+Email&utm_medium=Email&utm_campaign=2021+-+Q3+-+Teardown+-+Blog-+Apple+iPhone+13
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Atomera 34
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MST performance improvement due to:
Improved gate oxide integrity enabling higher overdrive
► Performance improvements due to MST can be traded for area reduction

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* Professor Suman Datta Group
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Partial Monolayers of Oxygen in Silicon

Supported by Major Semiconductor Tool Suppliers




MST Enhanced Transistors

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Epi Deposition Tool
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