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AMPOC — Investor Presentation 2021
Apr 12, 2021
52124_rns_2021-04-12_21ecf6bc-57e5-4d4b-b7da-8dcca42d8899.pdf
Investor Presentation
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Ampoc Far East Co., Ltd
Ampoc Far-East Co., Ltd
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Ampoc Far East Co., Ltd
1. Ampoc Profile
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Company History
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Products Introduction and Application
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Financial Information
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Future Outlook
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Ampoc Far East Co., Ltd
1. Company Profile
Company : AMPOC Far-East Co., Ltd. Address : 17F., No.171, Sung-Teh Road, Taipei, Taiwan Tel : (02) 2726-2220 Fax : (02) 2726-2227
E-mail : [email protected] Responsible Person : Chairman & C.E.O., Mr. Ronald S. Su Executive VP & C.O.O., Mr. Alden Chiao Since : November 1, 1980 Paid-up Capital : NT$ 1,144 Million Employee : 280 people
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Ampoc Far East Co., Ltd
2. Company History
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• Ampoc invested in Ampoc Trading (Shanghai) Co., Ltd through the subsidiary in Hong Kong.
2019/01
• Ampoc merged Yang Shin Investment Co., Ltd which Ampoc owned 100%.
2006/12
• Ampoc was approved to list on the Taiwan Stock Exchange, Stock Code: 2493.
2002/01
• Stock dividend was issued, resulting in total capital of NT$905 million.
2001/06
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Paid-in capital was increased to NT$73.7 million.
2000/10
• Ampoc merged with TTCM and issued additional 21,107,000 shares, paid-in capital increased to
1999/12 NT$57.1 million.
• Ampoc was approved as public company.
1998/12 Ampoc was engaged in capitalization of NT$10.2 million, paid-in capital increased to NT$30 million.
• Ampoc established the inspection lab. with precision instruments to enhance our service quality.
1998/03
• Ampoc purchased the office which located at 17F, No.171, Sung-Teh Rd., Sinyi District, Taipei.
1997/03
• TCM in Japan which was a master manufacturer of PCB Wet Process established TTCM in CHUNG-LI
industrial zone, Taiwan. Ampoc invested in TTCM and obtained the sole global distribution agreement
1987/05
except in Japan.
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Ampoc was founded in Taipei with initially registered capital of NT$1 million.
1980/11 4
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Ampoc Far East Co., Ltd
3. Applications and Products Introduction
• Applications
– Semiconductor (Front-end)
– Advanced PKG
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5G/AI
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Products Introduction
– Laser Heater TC Bonder
– Ampoc Wing Vertical System
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Ampoc Far East Co., Ltd
Applications
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- Applications core strategy for development
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Solder bump plating chemicals
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3D-IC , FOWLP high-speed plating chemicals
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UBM high-selective etching chemicals
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High-resolution PR
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Hard Mask
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Chemicals for lead frame metal finish
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EDPR for QFN lead frame & crystal oscillator
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Semiconductor Advanced PKG 5G/AI
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AiP (Antenna in Package) testing device
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MLO probe card for 5G chip testing
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Ampoc Far East Co., Ltd
Customers & Partners
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FEOL ADV PKG 5G/AI
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Products Introduction
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Laser Heater TC Bonder
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Conventional horizontal System
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ABF 載板垂直蝕刻系統 (Ampoc Wing)
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Ampoc Far East Co., Ltd
4. Financial Information
Condensed Statement of Comprehensive Income from 2018 to 2020
Unit: NT$ thousands (Except EPS: NT$)
| Year Item |
2018 | 2019 (consolidated) |
2020 (consolidated) |
|---|---|---|---|
| Net Revenue | 2,400,520 | 2,482,446 | 2,600,664 |
| Gross profit | 765,833 | 653,556 | 687,947 |
| Gross margin(%) | 31.90 | 26.33 | 26.45 |
| Operating income | 423,229 | 354,944 | 397,524 |
| Net income after tax | 342,985 | 228,519 | 308,769 |
| EPS | 3.00 | 2.00 | 2.70 |
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Ampoc Far East Co., Ltd Condensed Balance Sheet from 2018 to 2020
Unit: NT$ thousands
| Year Item |
2018 | 2019 (consolidated) |
2020 (consolidated) |
|---|---|---|---|
| Current Assets | 2,713,049 | 2,660,223 | 2,951,161 |
| Non-current Assets |
758,096 | 708,293 | 697,883 |
| Total Assets | 3,471,145 | 3,368,516 | 3,649,044 |
| Current Liabilities |
938,712 | 892,531 | 1,141,638 |
| Non-current Liabilities |
108,930 | 126,181 | 153,401 |
| Total Liabilities | 1,047,642 | 1,018,712 | 1,295,039 |
| Equity | 2,713,049 | 2,660,223 | 2,951,161 |
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Ampoc Far East Co., Ltd
Financial Analysis from 2018 to 2020YearItem2018 2019 (consolidated) 2020 (consolidated) Debts Ratio(%) 30.18 30.24 38.56 Current Ratio(%) 289.02 298.05 227.64 Average Inventory Turnover(Times) 1.89 2.19 2.12 Return on Equity (%) 14.66 9.57 8.38 |
Financial Analysis from 2018 to 2020YearItem2018 2019 (consolidated) 2020 (consolidated) Debts Ratio(%) 30.18 30.24 38.56 Current Ratio(%) 289.02 298.05 227.64 Average Inventory Turnover(Times) 1.89 2.19 2.12 Return on Equity (%) 14.66 9.57 8.38 |
Financial Analysis from 2018 to 2020YearItem2018 2019 (consolidated) 2020 (consolidated) Debts Ratio(%) 30.18 30.24 38.56 Current Ratio(%) 289.02 298.05 227.64 Average Inventory Turnover(Times) 1.89 2.19 2.12 Return on Equity (%) 14.66 9.57 8.38 |
Financial Analysis from 2018 to 2020YearItem2018 2019 (consolidated) 2020 (consolidated) Debts Ratio(%) 30.18 30.24 38.56 Current Ratio(%) 289.02 298.05 227.64 Average Inventory Turnover(Times) 1.89 2.19 2.12 Return on Equity (%) 14.66 9.57 8.38 |
|---|---|---|---|
YearItem |
2018 |
2019 (consolidated) |
2020 (consolidated) |
| Debts Ratio(%) | 30.18 | 30.24 | 38.56 |
| Current Ratio(%) | 289.02 | 298.05 | 227.64 |
| Average Inventory Turnover(Times) |
1.89 | 2.19 | 2.12 |
| Return on Equity (%) | 14.66 | 9.57 | 8.38 |
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Ampoc Far East Co., Ltd.
2021 Net Revenue
Unit: NT$ thousands
Month January February March Item A m o u n t 245,760 272,557 248,287 M o n t h l y -17.26 10.90 -8.90 growth rate(%) Annual growth 16.81 43.44 20.64 r a t e ( % )
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5.Future Outlook
Market trends & forecast in 2021
In H1 of 2021, COVID pandemic, geopolitics and exchange rate issue impact the global economy and bring uncertainties to the global market. Along with the mass vaccination, the economic impact of COVID crisis seems to be relieved in H2. On the other hand, global market shows signs of recovery from 2020 Q4. The demand for 5G, AI and electric mobile application remains high, and these applications are considered to drive the market growth in 2021.
With long year experience and outstanding integration of upstream and downstream supply chain in electronic industry, Taiwan is the market which is blessed with several advantages. AMPOC is the total solution provider which owns prudential management team. It is the company which considers market position and actively offers solutions for Advanced PKG, 5G and AI applications to customers.
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Taiwan PCB industry review & and outlook 2021
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1) The production value of global PCB industry is estimated to reach USD 62.5B. Meanwhile, Taiwanese and Chinese shares USD 23.6B (NTD 696B), which is 5.1% increase than 2019.
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2) Taiwan tops the global market, and China is close behind the ranking. Applications such as 5G, big data, cloud computing, AI, IoT and electric mobile are contributing to the rapid growth of the market.
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3) The production expansion of PCB can be expected. The products are 5G substrate, HDI and FPC for applications such as smart phone, automotive electronics, IoT and network communication.
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4) Equipment demands outlook in 2021 :
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Advanced ABF substrate;
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High-end products including 5G substrate, SLP, HDI, FPC, etc.;
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Electric Vehicle & safety devices.
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Ampoc Far East Co., Ltd
Thank you
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