XTPL S.A.

Regulatory Filings • Nov 12, 2019

The Management Board of XTPL S.A. (the "Company", the "Issuer")announces that today it has signed an agreement for technologyvalidation with Hefei BOE Joint Technology Co. Ltd with its registeredseat in China ("Partner") - subsidiary of one of the leading globalproducers operating in the display industry based in China

The purpose of the agreement is to confirm parameters of the technologydeveloped and commercialized by the Issuer and to assess the possibilityof implementing the technology in the production Partner's processes.The XTPL nanoprinting technology offered to the Partner will bededicated to obtain transparent conductive mesh which will improveelectrical conductivity in new generations of displays. Each party willbe responsible for their respective costs, i.e. the Issuer - for thecosts of the printing samples on the Partner's substrates and thePartner - for the costs of preparing and sending the substrates forevaluation, costs of advanced analysis of the obtained nanoprtints andassesment of the results of technological tests and costs of thereference visits to Issuer's headquarters.

In the opinion of the Company's Management Board executing theTechnology Evaluation Agreement is to be considered as insideinformation because the Partner has declared that if the projectproduces satisfactory results, the Partner will be ready to startnegotiations on the main business assumptions for the commercialcooperation, and therefore there are reasons to believe thatimplementation of the above agreement may have a significant impact onthe Issuer's future revenue position.