XTPL S.A.

Regulatory Filings • Apr 12, 2021

The Management Board of XTPL S.A. (the "Issuer") announces that on 9April 2021 it received information that the Issuer's project"Development of breakthrough printing technology of 3D micrometricconductive structures using an innovative printhead capable of printingon non-planar substrates and compatible ink for printed electronicsapplications" (the "Project") has been recommended for co-financingunder the 6/1.1.1/2020 - "Fast Track" competition of the National Centrefor Research and Development ("NCBiR").

The scope of this project is the design and implementation of the newtechnology for printing of ultrafine conductive structures on 3Dsubstrates for applications in printed electronics.

• Total Project value: PLN 11,615,569.56;

• Recommended co-financing value: PLN 7,695,844.09;

• Implementation period: 1 October 2020 - 30 September 2023

The final co-financing amount may change slightly at the stage ofpreparing the documentation for the grant agreement. The signing of thegrant agreement will be communicated by the Issuer in a separate report.

In the opinion of the Issuer's Management Board the above fact is insideinformation, as grants constitute an important part of financing theIssuer's operations. The Project will contribute to further developmentof the Issuer's strategic area of printed electronics.