XTPL S.A.

Regulatory Filings • May 31, 2021

In relation to the ESPI Current Report No. 3/2021 of 9 April 2021, theManagement Board of XTPL S.A. (the "Issuer") announces that today (31May 2021) it has received information that on 28 May 2021 the NationalCentre for Research and Development ("NCBR") signed an agreement onco-financing, under the 6/1.1.1/2020 - "Fast Track" competitionorganized by NCBR, for the Issuer's project "Development of breakthroughprinting technology of 3D micrometric conductive structures using aninnovative printhead capable of printing on non-planar substrates andcompatible ink for printed electronics applications" (the "Project").Thescope of this project is the design and implementation of the newtechnology for printing of ultrafine conductive structures on 3Dsubstrates for applications in printed electronics.

• Total Project value: PLN 11,615,569.56;

• Recommended co-financing value: PLN 7,695,844.09;

• Implementation period: 1 October 2020 - 30 September 2023Inthe opinion of the Issuer's Management Board the above fact is insideinformation, as grants constitute an important element of financing theIssuer's operations. The Project will contribute to further developmentof the Issuer's strategic area of printed electronics.