XTPL S.A.

Regulatory Filings • Jun 2, 2021

The Management Board of XTPL S.A.("Issuer", "Company", "XTPL") hereby announces that on 1 June 2021, theIssuer submitted a patent application with the United States Patent andTrademark Office (USPTO) relating to the XTPL-developed technologicalsolution ("Method") for precise filling of micrometric cavities withpolymer.The methoddescribed in the application is particularly important for themanufacture of modern semiconductor devices. The advantage of XTPL'sMethod is that the cavity is filled in a homogeneous and precise manner(without spilling), and that no cracks are formed in the process. TheXTPL printing system can used to perform the filling.TheIssuer's Management Board has decided that the submission of the saidpatent application is inside information, as in the case of an entityoperating in the deep-tech sector, effective protection by the Companyof its intellectual and industrial property, a factor which influencesthe Company value, is one of the elements that investors may take intoaccount when making decisions about the Issuer's financial instruments.Inthe opinion of the Company's Management Board, ensuring an appropriatelevel of security and extensive patent protection (both in the form ofobtained patents and submitted patent applications) is a significantcompetitive advantage for the Issuer and may contribute to ensuring anappropriate bargaining position when negotiating commercial contracts.Accordingly,in the Management Board's opinion, the information on submission of thepatent application meets the criteria of inside information within themeaning of Article 7(1) MAR.Atthe same time, the Company's Management Board advises that as ofpublication of this report, information on submission of subsequentpatent applications will be each time made available to the public.