AGM Information • Apr 24, 2025
AGM Information
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Duiven, the Netherlands, April 23, 2025 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced results of its Annual General Meeting of Shareholders ("AGM").
All items on the agenda received a majority of votes in favor except for Item 6 (Advisory vote on the Remuneration Report 2024).
The dividend proposal of € 2.18 per ordinary share for the 2024 financial year was approved by the AGM. Such dividend will be paid out wholly in cash. Payments will commence as of May 2, 2025. The following time-table will be applicable with respect to the dividend payment:
Holders of ordinary shares will receive the dividend through their bank or broker in whose custody their ordinary shares are held at the close of business on April 28, 2025 (record date). The dividend will be payable starting May 2, 2025 through ABN AMRO Bank N.V.
Besi is a leading manufacturer of assembly equipment supplying a broad portfolio of advanced packaging solutions to the semiconductor and electronics industries. We offer customers high levels of accuracy, reliability and throughput at a lower cost of ownership with a principal focus on wafer level and substrate assembly solutions. Customers are primarily leading semiconductor manufacturers, foundries, assembly subcontractors and electronics and industrial companies. Besi's ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY) and its headquarters are located in Duiven, the Netherlands. For more information, please visit our website at www.besi.com.
Richard W. Blickman, President & CEO Andrea Kopp-Battaglia, SVP Finance Claudia Vissers, Executive Secretary/IR coordinator Edmond Franco, VP Corporate Development/US IR coordinator Michael Sullivan, Investor Relations Tel. (31) 26 319 4500 [email protected]
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