4DS MEMORY LIMITED — Investor Presentation 2020

Jun 28, 2020

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4DS and imec TECHNICAL RESULTS AND INTERNATIONAL CAPITAL RAISE

June 2020

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DISCLAIMER IMPORTANT NOTICE.

This presentation has been prepared by 4DS Memory Limited. (“4DS” or the “Company”) based on information available to it as at the date of this presentation. The information in this presentation is provided in summary form and does not contain all information necessary to make an investment decision.

This presentation does not constitute an offer, invitation, solicitation or recommendation with respect to the purchase or sale of any security in 4DS, nor does it constitute financial product advice or take into account any individual’s investment objectives, taxation situation, financial situation or needs. An investor must not act on the basis of any matter contained in this presentation but must make its own assessment of 4DS and conduct its own investigations. Before making an investment decision, investors should consider the appropriateness of the information having regard to their own objectives, financial situation and needs, and seek legal, taxation and financial advice appropriate to their jurisdiction and circumstances. 4DS is not licensed to provide financial product advice in respect of its securities or any other financial products. Cooling off rights do not apply to the acquisition of 4DS securities.

Although reasonable care has been taken to ensure that the facts stated in this presentation are accurate and that the opinions expressed are fair and reasonable, no representation or warranty, express or implied, is made as to the fairness, accuracy, completeness or correctness of the information, opinions and conclusions contained in this presentation. To the maximum extent permitted by law, none of 4DS, its officers, directors, employees and agents, nor any other person, accepts any responsibility and liability for the content of this presentation including, without limitation, any liability arising from fault or negligence, for any loss arising from the use of or reliance on any of the information contained in this presentation or otherwise arising in connection with it.

Forward looking statements

This presentation contains certain forward looking statements that are based on the Company’s management’s beliefs, assumptions and expectations and on information currently available to management. Such forward looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results or performance of 4DS to be materially different from the results or performance expressed or implied by such forward looking statements. Such forward looking statements are based on numerous assumptions regarding the Company’s present and future business strategies and the political and economic environment in which 4DS will operate in the future, which are subject to change without notice. Past performance is not necessarily a guide to future performance and no representation or warranty is made as to the likelihood of achievement or reasonableness of any forward looking statements or other forecast.

To the full extent permitted by law, 4DS and its directors, officers, employees, advisers, agents and intermediaries disclaim any obligation or undertaking to release any updates or revisions to information to reflect any change in any of the information contained in this presentation (including, but not limited to, any assumptions or expectations set out in the presentation).

The information presented in this presentation is subject to change without notice and 4DS does not have any responsibility or obligation to inform you of any matter arising or coming to their notice, after the date of this presentation, which may affect any matter referred to in this presentation.

The distribution of this presentation may be restricted by law and you should observe any such restrictions.

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COMPANY HIGHLIGHTS.

World-leading Silicon Valley based Interface Switching ReRAM developer

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Completed Additional Wafers Lot of 300mm wafers, most successful to date

Demonstrated record improvement in speed and endurance

4DS is the most advanced Interface Switching ReRAM

The most promising Interface Switching ReRAM cell for Storage Class Memory

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Joint development agreement with Western Digital subsidiary HGST since 2014 Strategic collaboration with imec signed in November 2017

23 granted US patents wholly owned and 9 pending or filed Completed A$4.5 mil placement , launched A$2.5 k SPP mil

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THE CHALLENGE.

DRAM and NAND Flash are the main technologies utilized today.

Both are US$95-56 billion annual markets – and . growing

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DRAM is super-fast, has exceptional endurance but is expensive and volatile

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NAND Flash is slow, has limited endurance but is cheap and non-volatile

A new innovation is needed and the industry refers to it as Storage Class Memory - over time this is predicted to have a market size as large as DRAM and NAND Flash

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STORAGE CLASS MEMORY.

Storage Class Memory is emerging as the leading new category to extend the memory hierarchy.

4DS Interface Switching ReRAM will not be a “me too” technology in the embedded and NAND Flash sectors.

Interface Switching ReRAM is a unique ReRAM being developed specifically for Storage Class Memory applications.

STORAGE CLASS MEMORY

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Attempts to combine the best
characteristics of DRAM and NAND Flash
Storage
Memory
NAND Non-Volatile
Flash
Volatile
Storage
Class DRAM
Memory
Die Cost ($/GB)
Access Time (Sec)
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Battleground for next generation memory technology.

– Faster DRAM-like read speed

Cheaper – NAND Flash-like costs

– Non-volatile Retains data when power is off

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BEST DATA SET RECORDED BY 4DS.

4DS Interface Switching ReRAM has now shown record achievements in relevant Storage Class Memory categories

Best endurance data recorded – two to three times better than previously reported

Highest recorded speed near DRAM speed – an area-based ReRAM first – US patents now granted

No need for speed crippling error correction – a ReRAM first – US patents now granted

Retention data recorded – additional studies to be completed to assess upper limits

Data validated by two of the worlds leading semiconductor participants – imec / HGST

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SEVEN YEAR PARTNERSHIP WITH HGST.

HGST , is a subsidiary of Western Digital Corporation (US$13.5 billion market cap), one of the largest global leaders in digital storage

Strategic innovator in emerging high growth technologies

Commenced JDA in 2014 – Renewed in 2015, 2016, 2017, 2018, 2019 and 2020

Insight into what is important in a data-centric world

Now actively involved with 4DS / imec and remain committed to Storage Class Memory

Siva Sivaram, President of Technology and Strategy at Western Digital , commented “We are committed to ReRAM, it is scalable with greater density, lower cost and latency and longer endurance”*

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*12/8/2016 EE Times – 14 Views from the Flash Summit

WORLD # 1 AND 4DS PARTNER.

imec , is the world’s #1 independent semiconductor development institute

Collaborates with the who’s who of electronic products and systems

Collaborates with makers of high-volume high-density memories

Has a world leading track record in the transfer of semiconductor processes

Uses the same tools as industry for high-volume production of high-density memories Has a proven megabit memory platform to fast track development of megabit chip Used this platform to explore a wide range of emerging memories

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COLLABORATION OBJECTIVES.

imec and 4DS completed Additional Wafers Lot manufacturing after discussions and input from Western Digital

Complete discussions with imec and HGST in July 2020 regarding next steps to incorporate new technical developments established from first megabit platform and additional wafers iterations

Develop a fully transferable fabrication compatible process

Mimic industry standard high volume production

Utilizing imec’s proven megabit memory platform reduces time and cost

End goal is to fabricate a megabit 4DS Interface Switching chip with a fully functioning Storage Class Memory

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BOARD AND MANAGEMENT.

Global expertise founding and building high-tech companies.

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JIM

DORRIAN

Non-Executive Chairman

Served as CEO of several Silicon Valley companies Extensive M&A experience

Partner at VC firm Crosspoint Venture Partners

Dr SESHUBABU DESU

Chief Technology Officer

Expert in thin films, semiconductor processing and non-volatile memories

Professor, Dean and Head of Electrical Engineering at various universities

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Dr GUIDO ARNOUT CEO & Managing Director 30+ years in commercialising electronics technology

Successes include, PowerEscape, CoWare, CrossCheck Technology and Silvar-Liso

DAVID

McAULIFFE

Executive Director

Experienced company director

Involved in numerous capital raisings and in-licensing of technologies

Founder of several companies in Australia, France and the UK, many of which are now ASX listed. The most recent was Invex Therapeutics Ltd

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HOWARD DIGBY

Non-Executive Director

Former senior roles at IBM, Adobe, Gartner and the Economist Group

Director of Vortif Ltd, Cirralto Ltd, Elisight Ltd and Hearmeout Ltd

Advisor to a number of early stage technology companies

MICHAEL

VAN BUSKIRK

Chief Engineering Officer

Executive roles with a number of leading memory companies in Silicon Valley

These include, Adesto Technologies Corporation, Innovative Silicon Inc and Spansion Inc.

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PLACEMENT AND SHARE PURCHASE . PLAN (SPP)

Completed a A$ 4.5 million placement at A$0.045 per share to USA and Australian institutions and high net worth investors

Placement was extremely well supported

Undertaking a SPP for A$ 2.5 million at the same price as the placement for up to A$15,000

The Company may take oversubscriptions or place any shortfall from SPP

SPP Booklet will be sent to eligible shareholders as soon as possible

Upon successful completion the cash position will be circ A$ 9.25 mil*

• Assumes SPP fully subscribed and less placement fees

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USE OF PROCEEDS

Fast track the manufacture of a megabit chip with imec and Western Digital / HGST

File additional patents and maintain existing 23 granted patents

General working capital

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CAPITAL	CAPITAL
STRUCT	URE.
ASX Code	4DS
Market Cap (Fully Diluted)	A$ 64 Million*
Ordinary Shares on Issue	1,296 Million*
Unlisted Options	129 Million
Cash	~A$9.25 Million – July 2020**
Board and Management	6.1%***

CAPITAL STRUCTURE.

*As at 29 June 2020 placement price and assumes successful SPP

**Assumes successful SPP and after placement expenses

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*** Assumes successful SPP

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VALUE PROPOSITION.

4DS is developing a breakthrough Interface Switching ReRAM Storage Class Memory solution

Recently produced pivotal data applicable for Storage Class Memory and best to date

Seven year strategic partnership with HGST, leader in digital storage

Imec - strategic collaboration to develop megabit chip with the world # 1 developer in nano electronics

Strong patent portfolio with 23 granted patents wholly owned and developed in-house

World-class team of memory specialists, material scientists and test engineers

Board experienced in founding, building and exiting high tech companies

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Sufficient cash to meet current objectives

4DS is addressing the massive memory demands of tomorrow

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TIMETABLE*.

Record Date for SPP Friday, 26 June 2020 Booklet Despatch and Opening of SPP Friday, 3 July 2020 Settlement of Placement Friday, 3 July 2020 Allotment of Placement Shares Monday, 6 July 2020 Trading of Placement Shares on ASX Monday 6 July 2020 Closing date of SPP Friday, 24 July 2020 Issue Date of SPP Shares Wednesday, 30 July 2020

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*Indicative and the Company reserves the right to close the SPP early

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THANK YOU

SILICON VALLEY

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ABN 43 145 590 110

ASX Code: 4DS www.4dsmemory.com

3155 Skyway Court Fremont CA 94539 UNITED STATES

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AUSTRALIA
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Level 2, 50 Kings Park Road West Perth WA 6005 AUSTRALIA

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