Asetek A/S

Legal Proceedings Report • Apr 24, 2014

ASETEK - Allowed U.S. Patent Claims on its RackCDU D2CT Data Center Liquid Cooling

ASETEK - Allowed U.S. Patent Claims on its RackCDU D2CT Data Center Liquid Cooling

Thursday, April 24, 2014 - Asetek® today announced that the U.S. Patent

and Trademark Office (USPTO) has issued a notice of allowance on the

company's patent claims on the groundbreaking RackCDUT Direct-to-Chip

liquid cooling technology for data centers.

RackCDU D2CT is a "free cooling" solution that captures between 60% and

80% of server heat, reducing data center cooling cost by over

50% (http://asetek.com/press-room/blog/2014/report-validating-rackcdu

-energy-savings-made-public.aspx) and allowing 2.5x-5x increases in data

center server density. D2C removes heat from

CPUs (http://asetek.com/data-center/technology/data-center

-components/cpu-cooling.aspx), GPUs (http://asetek.com/data

-center/technology/data-center-components/gpu-cooling.aspx), memory

modules (http://asetek.com/data-center/technology/data-center

-components/memory-cooling.aspx) within servers using water as hot as

40°C (105°F), eliminating the need for chilling to cool these

components.

"Needless to say I am thrilled that we have gotten allowance on our

patent claims on the RackCDU technology. Asetek's future is, to a large

extent, hinging on these claims so having the exclusivity on this

technology is key," says André Eriksen, Asetek's founder and CEO. "We

have a solution with the potential for solving one of the largest and

fastest growing energy problems on the planet and I think this has a

bright future as energy consumption, density and operating costs of data

centers will continue to rise."

Chilling is the largest portion of data center cooling OpEx and CapEx

costs. With RackCDU D2C, less air needs to be cooled and moved by

Computer Room Air Handlers (CRAH) or Computer Room Air Conditioning

(CRAC) units. Furthermore, liquid cooled servers need less airflow

resulting in more energy efficient servers.

RackCDU is capable of returning water from the data center at

temperatures high enough to enable waste heat recycling. Data centers

choosing this option recover a portion of the energy running their

servers further increasing energy cost savings, reducing carbon

footprint and resulting in cooling Energy Reuse Efficiencies (ERE) below

1.0.

RackCDU D2C is deployed at a rack/server level providing maximum

scalability. The system consists of a zero-U rack level CDU (Cooling

Distribution Unit) mounted in a 10.5 inch rack extension that includes

space for 3 additional PDUs, and direct-to-chip server coolers that

are drop in replacements (http://asetek.com/press

-room/videos/2014/timelapse-installing-asetek-liquid-cooling-inside

-cisco-220-server.aspx) for standard server air heat sinks.

About Asetek

Asetek is the world-leading provider of energy efficient liquid cooling

systems for data centers, servers, workstations, gaming and high

performance PCs. Its products are used for reducing power and greenhouse

emissions, lowering acoustic noise, and achieving maximum performance by

leading OEMs and channel partners around the globe.

Asetek's products are based upon its patented all-in-one liquid cooling

technology with more than 1.5 million liquid cooling units deployed in

the field. Founded in 2000, Asetek is headquartered in Aalborg, Denmark

with offices in California, China and Taiwan. For more information,

visit http://www.asetek.com.

For further information, please contact:

Andre S. Eriksen, Chief Executive Officer

Mobile: +1 408 398 7437, e-mail: ceo@asetek.com