Asetek A/S

Regulatory Filings • Nov 15, 2016

Asetek Announces Names of Undisclosed OEM Partner and HPC Customer

November 15, 2016 – With reference to stock exchange notice June 22, 2016 announcing that Asetek had received an order from one of its existing OEM partners for RackCDU D2C™ (Direct-to-Chip) to satisfy an undisclosed HPCcustomer installation in Europe, resulting in revenue toAsetek in the range of \$100,000 with installation expected to occur in Q3 2016:

Asetek® today announces that it is existing OEM partner Fujitsu® that has been selected by the University of Regensburg to install Asetek InRackCDU™ technology to liquid cool one of the first Intel® Xeon Phi™ based HPCclusters in Europe. The Fujitsu® installation is a joint research project (SFB/TRR-55) with The University of Wuppertal and Jülich Supercomputing Center.

"We appreciate that our OEM customer Fujitsu continue to deploy Asetek's liquid cooling solution and increase end user adoption" saidAndré Sloth Eriksen, Founder and CEOofAsetek.

For the full press release go to www.asetek.com .

About Asetek

Asetek® (ASETEK.OL) is the global leader in liquid cooling solutions for data centers, servers and PCs. Asetek's server products enable OEMs to offer cost effective, high performance liquid cooling data center solutions. Its PCproducts are targeted at the gaming and high performance desktop PC segments. With over 3.5 million liquid cooling units deployed, Asetek's patented technology is being adopted by a growing portfolio of OEMs and channel partners. Founded in 2000, Asetek is headquartered in Denmark and has operations in California, Texas, China and Taiwan. For more information visit http://www.asetek.com.

For further information, please contact: André S. Eriksen, Chief Executive Officer Mobile: +45 2125 7076, e-mail: ceo@asetek.com