Capital/Financing Update • Jan 24, 2017
Capital/Financing Update
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January 24, 2017 - Asetek® announced today confirmation of an order from one of its existing OEM partners for its InRackCDU D2C™ (Direct-to-Chip) liquid cooling solution. The order is part of the installation for an undisclosed HPC(High Performance Computer) customer.
"I am happy that our OEM partner continues to promote and sell our unique liquid cooling technology to their customers. We appreciate the ongoing commitment with them. The repeat business of this particular OEM customer marks a strategically important moment for Asetek's emerging data center business segment," saidAndré Sloth Eriksen, CEOand founder ofAsetek.
The order will result in revenue toAsetek in the range of \$75,000 with delivery in early Q2 2017. The OEM partner as well as the installation site will be announced at a later date.
André S. Eriksen, Chief Executive Officer Mobile: +45 2125 7076, e-mail: [email protected]
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