Earnings Release • Jun 4, 2008
Earnings Release
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FOR: BE SEMICONDUCTOR INDUSTRIES N.V. Ratio 6 6921 RW Duiven The Netherlands
Duiven, the Netherlands, June 4, 2008, BE Semiconductor Industries N.V. ("Besi") (Euronext: BESI), a leading manufacturer of assembly equipment for the semiconductor industry, today announced the receipt of orders aggregating € 3.4 million for multi chip die bonding equipment systems.
Besi's Datacon subsidiary received orders in May aggregating € 3.4 million for twelve 2200 evo multi chip die bonding systems for delivery in the third quarter of 2008. The orders were placed by a leading European producer of optical systems for the industrial and automotive markets for use at its Malaysian assembly operations.
Helmut Rutterschmidt, Executive Board member and Head of Marketing and Sales of Besi commented: "We are very pleased to receive these important orders from a long standing customer reflecting our position as a technological leader in automotive and industrial applications offering the market a high degree of flexibility at a low cost of ownership."
BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations. Its customers consist primarily of leading U.S., European and Asian semiconductor manufacturers, assembly subcontractors and electronics and industrial companies which utilize its products for both array connect and conventional leadframe manufacturing processes. For more information about Besi, please visit our website at www.besi.com.
This press release contains forward-looking statements, which are found in various places throughout the press release, including statements relating to expectations of orders, net sales, product shipments, backlog, timing of purchases of assembly equipment by customers and capital expenditures. The words "anticipate", "estimate", "expect", "can", "intend", "believes", "may", "plan", "predict", "project", "forecast", "will", "would", and similar expressions are intended to identify forward looking statements, although not all forward looking statements contain these identifying words. While these forward looking statements represent our judgments and future expectations concerning the development of our business, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from our expectations. These factors include, but are not limited to, those listed or discussed in Besi's Annual Report for the year ended December 31, 2007, as well as the risk that anticipated orders may not materialize or that orders received may be postponed or canceled, generally without charges; the volatility in the demand for semiconductors and our products and services; acts of terrorism and violence; overall global economic conditions; risks, such as changes in trade regulations, currency fluctuations, political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations; potential instability in foreign capital markets; the risk of failure to successfully manage our expanding and more diverse operations; and other key factors that could adversely affect our businesses and financial performance contained in our filings and reports, including our statutory consolidated statements. We are under no obligation to (and expressly disclaim any such obligation to) update or alter our forward-looking statements whether as a result of new information, future events or otherwise.
Richard W. Blickman Cor te Hennepe President & CEO Director of Finance Tel. (31) 26 319 4500 Tel. (31) 26 319 4500 [email protected] [email protected]
Nederlandse toelichting bij Engelstalig persbericht d.d. 4 juni 2008, waarbij de Engelse tekst leidend is. Zie het Engelstalig persbericht voor "Caution Concerning Forward Looking Statements".
BE SEMICONDUCTOR INDUSTRIES N.V. Ratio 6 6921 RW Duiven
Duiven, 4 juni 2008, BE Semiconductor Industries N.V. ("Besi") (Euronext: BESI), een toonaangevende leverancier van machines voor de assemblage van halfgeleiders heeft vandaag bekend gemaakt een order te hebben ontvangen voor een totaalbedrag van € 3,4 mio voor multi chip die bonding systemen.
Besi dochter Datacon heeft in mei een order ontvangen voor een totaalbedrag van € 3,4 mio voor twaalf multi chip die bonding systemen, type 2200 evo, voor levering in het derde kwartaal 2008. Deze order is geplaatst door een toonaangevende Europese fabrikant van optische systemen voor de industriële markt en automobielindustrie en deze systemen worden geïnstalleerd in Maleisië.
Helmut Rutterschmidt, lid van de Raad van Bestuur en hoofd Marketing & Sales van Besi, lichtte toe: "Wij zijn uiterst content met deze belangrijke order van een bestaande Besi klant. Wederom is onze positie als technologieleider bevestigd voor toepassingen in de algemene industriële markt en specifiek de automobielindustrie, waar wij klanten een hoge mate van flexibiliteit en lage productiekosten kunnen bieden."
Richard Blickman Cor te Hennepe President & CEO Director of Finance Tel. 026-3194500 Tel. 026-3194500 [email protected] [email protected]
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