AI Terminal

MODULE: AI_ANALYST
Interactive Q&A, Risk Assessment, Summarization
MODULE: DATA_EXTRACT
Excel Export, XBRL Parsing, Table Digitization
MODULE: PEER_COMP
Sector Benchmarking, Sentiment Analysis
SYSTEM ACCESS LOCKED
Authenticate / Register Log In

BE Semiconductor Industries N.V.

AGM Information Apr 27, 2023

3819_iss_2023-04-26_34e2dc5d-aa30-4fce-ab4c-76c5ee4d4e42.pdf

AGM Information

Open in Viewer

Opens in native device viewer

PRESS RELEASE

BE Semiconductor Industries N.V. Announces Results of 2023 Annual General Meeting of Shareholders

Duiven, the Netherlands, April 26, 2023 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced results of its Annual General Meeting of Shareholders ("AGM").

All items on the Agenda received a majority of votes in favor except for Item 6 (Advisory vote on the Remuneration Report 2022). The new Remuneration Policy 2024 (Item 7) was approved by a super majority of the votes cast (in excess of the required 75%).

In addition, the AGM approved the appointment of Mr Richard Norbruis as Supervisory Board member for a four-year term ending April 2027. The Supervisory Board intends to appoint Mr Norbruis as Chairman of Besi's Supervisory Board.

Dividend 2022

The dividend proposal of € 2.85 per ordinary share for the 2022 financial year was approved by the AGM. Such dividend will be paid out wholly in cash. Payments will commence as of May 4, 2023. The following time-table will be applicable with respect to the dividend payment:

  • April 28, 2023 Ex-dividend quotation
  • May 2, 2023 Record date for dividend eligibility (after market close)
  • Starting May 4, 2023 Payment of cash dividend

Holders of ordinary shares will receive the dividend through their bank or broker in whose custody their ordinary shares are held at the close of business on May 2, 2023 (record date). The dividend will be payable starting May 4, 2023 through ABN AMRO Bank N.V.

About Besi

Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. The Company develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi's ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY) and its headquarters are located in Duiven, the Netherlands. For more information, please visit our website at www.besi.com.

Contacts:

Richard W. Blickman, President & CEO Leon Verweijen, SVP Finance Claudia Vissers, Executive Secretary/IR coordinator Edmond Franco, VP Corporate Development/US IR coordinator Tel. (31) 26 319 4500 [email protected]

Talk to a Data Expert

Have a question? We'll get back to you promptly.