SÜSS MicroTec SE

Regulatory Filings • Sep 8, 2005

News Details

Ad-hoc | 8 September 2005 08:03

SUSS MicroTec receives order from IBM for the first C4NP production line.

Ad hoc announcement §15 WpHG Order received SUSS MicroTec receives order from IBM for the first C4NP production line. Ad hoc announcement transmitted by DGAP. The issuer is solely responsible for the content of this announcement. —————————————————————————— SUSS MicroTec receives order from IBM for the first C4NP production line. Munich, September 8th 2005 – SUSS MicroTec AG (Prime Standard) has received an order from IBM for the first C4NP high volume bumping line. The tool set is scheduled for delivery at the end of the first quarter of 2006. With this order IBM is moving towards using C4NP in a production environment earlier than expected. SUSS MicroTec and IBM will also jointly market this new technology. C4NP represents the next generation in bumping technology with significant technology and cost advantages over current processes. This new bumping production line enables the lead-free bumping of up to 300 silicon wafers per day. The C4NP process (Controlled Collapse Chip Connection – New Process) was initially invented by IBM. In September 2004 SUSS MicroTec was engaged by the US manufacturer to develop the necessary tools for this process. The C4NP process is explained in more detail on the SUSS website. It can be accessed via http://www.suss.com/C4NP . Weitere Informationen erhalten Sie bei: SÜSS MicroTec AG Investor Relations Barbara v. Frankenberg Tel.: +49 (0) 89 / 320 07-314 Fax: +49 (0) 89 / 320 07-450 E-Mail: b.frankenberg@suss.de Süss MicroTec AG Schleissheimer Strasse 90 85748 Garching b. München Deutschland ISIN: DE0007226706 WKN: 722670 Listed: Geregelter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin- Bremen, Düsseldorf, Hamburg, München und Stuttgart End of ad hoc announcement (c)DGAP 08.09.2005 080803 Sep 05