AIXTRON SE

Business and Financial Review • Mar 20, 2006

News Details

Corporate | 20 March 2006 01:00

Aixtron AG: Leading Korean IC-manufacturer extends its high volume DRAM production

Corporate-news transmitted by DGAP – a company of EquityStory AG. The issuer is solely responsible for the content of this announcement. —————————————————————————— Leading Korean IC-manufacturer extends its high volume DRAM production facility with Genus proven LYNX3 300 mm CVD process tools Aachen, Germany – March 20, 2006 – AIXTRON AG, a leading manufacturer of deposition equipment to the semiconductor industry, today announced it has received significant repeat orders for state-of-the-art 300 mm CVD LYNX3 system in the fourth quarter of 2005. AIXTRON expects shipment to be during the first half of 2006. The orders validate AIXTRON’s strategy to diversify its core gas phase deposition technology into the silicon semiconductor market. Largely based on sales of CVD-systems by AIXTRON’s subsidiary Genus, Inc., which was acquired by AIXTRON in March 2005, the proportion of silicon semiconductor equipment sales in AIXTRON’s total revenues last year increased significantly, from 1 percent in 2004 to 23 percent in 2005. Technical details The customer will use the systems to ramp up its DRAM sub 80 nm high volume production site. Primary customers for Genus, Inc.’s CVD products are major chip manufacturers in the memory (DRAM and FLASH) segment of the semiconductor industry. The LYNX3 process modules are based on the patented process chamber concept and have achieved a leading position for the deposition of tungsten silicide (WSix) materials, primarily used in memory applications. Genus, Inc.’s tungsten silicide films are principally used for advanced memory applications and provide customers with many advantages including robust stable performance despite exposure to additional high-temperature deposition steps. In addition to the AIXTRON Group’s ALD and AVD® technologies, Genus, Inc.’s core tungsten silicide CVD platform forms a comprehensive portfolio of semiconductor platform technologies. The fact that Genus CVD and ALD tools offer both the same platform and system design simplifies operations and service, which are key in the extension of advanced semiconductor process equipment and low cost of ownership. During Semicon China (March 21-23, 2006), the AIXTRON Group will use the opportunity to display the technical assets of their participating development groups (booth# 2679 in Hall 2). Parallel to the show, AIXTRON hosts a seminar (March 22, 2006) conducted by Genus, Inc.’s Chief Technology Officer, Dr. Tom Seidel to give insight into AIXTRON-Genus, Inc., as well as exchange valuable information of AIXTRON’s 300 mm CVD (ALD-AVD®) manufacturing standards and capabilities at atomic level solutions. For further information on AIXTRON AG (FSE: AIX, ISIN DE0005066203; NASDAQ: AIXG) please consult our website at: www.aixtron.com. Forward-Looking Statements This news release may contain forward-looking statements about the business, financial condition, results of operations and earnings outlook of AIXTRON within the meaning of the “safe harbor” provisions of the United States Private Securities Litigation Reform Act of 1995. Words such as “may”, “will”, “expect”, “anticipate”, “contemplate”, “intend”, “plan”, “believe”, “continue” and “estimate”, and variations of these words and similar expressions, identify these forward-looking statements. The forward-looking statements reflect our current views and assumptions and are subject to risks and uncertainties. You should not place undue reliance on the forward-looking statements. The following factors, and others which are discussed in AIXTRON’s public filings and submissions with the U.S. Securities and Exchange Commission, are among those that may cause actual and future results and trends to differ materially from our forward-looking statements: actual customer orders received by AIXTRON; the extent to which chemical vapor deposition, or CVD, technology is demanded by the market place; the timing of final acceptance of products by customers; the financial climate and accessibility of financing; general conditions in the thin film equipment market and in the macro-economy; cancellations, rescheduling or delays in product shipments; manufacturing capacity constraints; lengthy sales and qualification cycles; difficulties in the production process; changes in semiconductor industry growth; increased competition; exchange rate fluctuations; availability of government funding; variability and availability of interest rates; delays in developing and commercializing new products; general economic conditions being less favorable than expected; and other factors. The forward-looking statements contained in this news release are made as of the date hereof and AIXTRON does not assume any obligation to update or revise any forward-looking statements, whether as a result of new information, future events or otherwise, unless required by law. Contact: Investor Relations and Corporate Communications AIXTRON AG, Kackertstr. 15–17, 52072 Aachen, Germany Phone: +49 241 8909 444, Fax: +49 241 8909 445, invest@aixtron.com www.aixtron.com (c)DGAP 20.03.2006 ————————————————————————— language: English emitter: AIXTRON AG Kackertstr. 15-17 52072 Aachen Deutschland phone: +49 (0)241 8909-444 fax: +49 (0)241 8909-445 email: invest@aixtron.com WWW: www.aixtron.com ISIN: DE0005066203 WKN: 506620 indexes: TecDAX stockmarkets: Geregelter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin-Bremen, Stuttgart, München, Hamburg, Düsseldorf; Foreign Exchange(s) Nasdaq End of News DGAP News-Service —————————————————————————